Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC LINE INTERFACE UNIT MQFP-44
|
pacchetto: 44-QFP |
Azione4.448 |
|
DS3, E3, STS-1 | 1 | 3.13 V ~ 3.46 V | 110mA | - | -40°C ~ 85°C | Surface Mount | 44-QFP | P-MQFP-44 |
||
Microsemi Corporation |
IC SLIC 1CH 8KHZ 150V HV 16SOIC
|
pacchetto: - |
Azione60.828 |
|
PCM | 1 | - | - | - | - | Surface Mount | - | 16-SOIC |
||
Silicon Labs |
IC PROSLIC LINE FEED 135V 40QFN
|
pacchetto: 40-VFQFN Exposed Pad |
Azione5.360 |
|
PCM | 2 | - | - | - | - | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (6x6) |
||
Silicon Labs |
IC PROSLIC LINE FEED 125V 40QFN
|
pacchetto: 40-VFQFN Exposed Pad |
Azione101.868 |
|
GCI, PCM, SPI | 2 | 3.3V | - | - | - | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (6x6) |
||
Maxim Integrated |
IC LIU T1/E1/J1 256CSBGA
|
pacchetto: 256-LBGA, CSBGA |
Azione5.488 |
|
LIU | 16 | 3.135 V ~ 3.465 V | 500mA | - | -40°C ~ 85°C | Surface Mount | 256-LBGA, CSBGA | 256-CSBGA (17x17) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 6CH 217BGA
|
pacchetto: 217-BBGA |
Azione9.240 |
|
LIU | 6 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 217-BBGA | 217-BGA (23x23) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 6CH 217BGA
|
pacchetto: 217-BBGA |
Azione4.224 |
|
LIU | 6 | 3.135 V ~ 3.465 V | 725mA | - | -40°C ~ 85°C | Surface Mount | 217-BBGA | 217-BGA (23x23) |
||
Cypress Semiconductor Corp |
IC TXRX HOTLINK II QUAD 256LBGA
|
pacchetto: 256-LBGA Exposed Pad |
Azione5.680 |
|
LVTTL | 4 | 3.135 V ~ 3.465 V | 830mA | - | 0°C ~ 70°C | Surface Mount | 256-LBGA Exposed Pad | 256-BGA |
||
Cypress Semiconductor Corp |
IC TXRX HOTLINK 256LBGA
|
pacchetto: 256-LBGA Exposed Pad |
Azione5.264 |
|
LVTTL | 4 | 3.135 V ~ 3.465 V | 900mA | - | 0°C ~ 70°C | Surface Mount | 256-LBGA Exposed Pad | 256-BGA |
||
Silicon Labs |
IC SLIC/CODEC 1CH 38QFN
|
pacchetto: 38-VFQFN Exposed Pad |
Azione2.176 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | 0°C ~ 70°C | Surface Mount | 38-VFQFN Exposed Pad | 38-QFN (5x7) |
||
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione7.376 |
|
- | 1 | 4.5 V ~ 5.5 V | 1.3mA | 10mW | -40°C ~ 110°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Maxim Integrated |
IC RECEIVE LINE INTERFACE 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione2.384 |
|
T1 | 1 | 4.75 V ~ 5.25 V | 18mA | - | 0°C ~ 70°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SW 28-SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione5.360 |
|
TTL | 1 | 4.5 V ~ 5.5 V | 2mA | 10.5mW | -40°C ~ 110°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microsemi Corporation |
IC SIGNAL COND 4X4 69-BGA
|
pacchetto: 69-FBGA |
Azione4.608 |
|
TTL/CMOS | 4 | 2.5V, 3.3V | - | 1.5W | 0°C ~ 110°C | Surface Mount | 69-FBGA | 69-BGA |
||
Renesas Electronics America |
IC RSLIC FAMILY 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione3.440 |
|
2-Wire | 1 | - | - | - | 0°C ~ 70°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
Microchip Technology |
IC VOICEPORT FXS 8KHZ 44LQFP
|
pacchetto: 44-LQFP |
Azione5.888 |
|
PCM | 1 | 3V, 5V | - | - | - | Surface Mount | 44-LQFP | 44-eLQFP |
||
Microchip Technology |
IC SLIC 2CH UNIV 100V 48QFN
|
pacchetto: 56-VFQFN Exposed Pad |
Azione5.520 |
|
4-Wire | 2 | 3.135V ~ 3.465V | 25mA | - | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
Microchip Technology |
1CH 150V MISLIC, 36QFN, T&R
|
pacchetto: - |
Azione2.528 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
1CH G.FAST LINE DRIVER T&R
|
pacchetto: 16-QFN |
Azione5.712 |
|
- | 1 | - | - | - | - | Surface Mount | 16-QFN | 16-QFN (4x4) |
||
CML Microcircuits |
IC TELECOM INTERFACE 24SOIC
|
pacchetto: - |
Request a Quote |
|
- | 2 | 2.7V ~ 5.5V | 5mA | 800 mW | -40°C ~ 85°C | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
||
CML Microcircuits |
IC TELECOM INTERFACE 16SOIC
|
pacchetto: - |
Azione72 |
|
Parallel | 1 | 2.7V ~ 5.5V | 1.5mA | 800 mW | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Texas Instruments |
320C6201 352PIN BGA REV3.0 FOR A
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
MaxLinear, Inc. |
DATA COMM PEF32002VTV12 VQFN68 S
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Harris Corporation |
SLIC, 2-4 CONVERSION, BIPOLAR, P
|
pacchetto: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | ±4.75V ~ 5.25V | 5.5mA | 150 mW | -40°C ~ 85°C | Through Hole | 22-DIP (0.400", 10.16mm) | 22-PDIP |
||
Infineon Technologies |
INFINEON PBM99011/22QS - SSO28-4
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Harris Corporation |
3 REN RINGING SLIC FOR ISDN MODE
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
MaxLinear, Inc. |
CODEC/SLIC 44-VQFN
|
pacchetto: - |
Request a Quote |
|
PCM, SPI | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 44-QFN | 44-QFN (5x6) |
||
Broadcom Limited |
ETH SWITCH 24GE 4X10GE
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |