Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC CTRLR DMA SERIAL 2-CH TQFP144
|
pacchetto: 144-LQFP |
Azione3.680 |
|
HDLC, PPP | 2 | 3 V ~ 3.6 V | 50mA | 150mW | 0°C ~ 70°C | Surface Mount | 144-LQFP | P-TQFP-144 |
||
Microsemi Corporation |
IC TDM SWITCH 4K-CH ENH 256BGA
|
pacchetto: 256-BGA |
Azione5.904 |
|
- | 1 | 1.71 V ~ 1.89 V | 1.75mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Maxim Integrated |
IC TXRX QUAD T1/E1 BGA
|
pacchetto: 256-BGA |
Azione6.960 |
|
E1 | 4 | 3.3V | - | - | - | Surface Mount | 256-BGA | 256-BGA (27x27) |
||
Exar Corporation |
IC BITS CLOCK EXTRACTOR 28TSSOP
|
pacchetto: 28-TSSOP (0.173", 4.40mm Width) |
Azione6.368 |
|
E1, T1 | 1 | 3.14 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 28-TSSOP (0.173", 4.40mm Width) | 28-TSSOP |
||
Texas Instruments |
IC 1 LINE RING GEN CTRLR 16DIP
|
pacchetto: 16-DIP (0.300", 7.62mm) |
Azione7.120 |
|
- | 1 | 12V | 1mA | - | -55°C ~ 125°C | Through Hole | 16-DIP (0.300", 7.62mm) | 16-PDIP |
||
Silicon Labs |
IC SLIC/CODEC PROG 1CH 38TSSOP
|
pacchetto: 38-TFSOP (0.173", 4.40mm Width) |
Azione27.540 |
|
PCM, SPI | 1 | 3.3V, 5V | 88mA | 700mW | -40°C ~ 85°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione2.768 |
|
- | 1 | 4.5 V ~ 5.5 V | 700µA | 10.5W | -40°C ~ 110°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
IXYS Integrated Circuits Division |
IC TRANSCEIVER DTMF CMOS 20-DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione50.064 |
|
- | 1 | 4.75 V ~ 5.25 V | 10mA | 78.75mW | -40°C ~ 85°C | Through Hole | 20-DIP (0.300", 7.62mm) | 20-DIP |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/J1/E1 21+1CH 640BGA
|
pacchetto: 640-BGA Exposed Pad |
Azione5.504 |
|
E1, J1, T1 | 1 | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 640-BGA Exposed Pad | 640-PBGA-EP (31x31) |
||
Microsemi Corporation |
IC ECHO CANCELLER AEC 48TQFP
|
pacchetto: 48-TQFP |
Azione4.608 |
|
- | 1 | 2.7 V ~ 3.6 V | 20mA | - | -40°C ~ 85°C | Surface Mount | 48-TQFP | 48-TQFP |
||
IXYS Integrated Circuits Division |
IC ANALOG SWITCH 16CH 48-LQFP
|
pacchetto: 48-LQFP |
Azione5.520 |
|
- | 1 | 3 V ~ 5.5 V | 100nA | - | 0°C ~ 70°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
Silicon Labs |
IC ISOMODEM LINE-SIDE DAA 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione7.472 |
|
Parallel, SPI, UART | 1 | 3 V ~ 3.6 V | 8.5mA | - | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SWTCH 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione6.528 |
|
- | 1 | 4.5 V ~ 5.5 V | - | 10mW | -40°C ~ 110°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microsemi Corporation |
IC RECEIVER DTMF 18DIP
|
pacchetto: 18-DIP (0.300", 7.62mm) |
Azione193.200 |
|
- | 1 | 2.7 V ~ 3.6 V | 2mA | - | -40°C ~ 85°C | Through Hole | 18-DIP (0.300", 7.62mm) | 18-PDIP |
||
Texas Instruments |
IC QUAD PHONE RELAY DRVR 14-SOIC
|
pacchetto: 14-SOIC (0.154", 3.90mm Width) |
Azione6.528 |
|
- | 4 | - | - | - | 0°C ~ 70°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
Microsemi Corporation |
IC SYNCHRONIZER T1/E1 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione9.900 |
|
- | 1 | 4.5 V ~ 5.5 V | 60mA | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microsemi Corporation |
IC CNIC1.1 CLIP CID TYPE1 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione69.840 |
|
3-Wire | 1 | 2.7 V ~ 5.5 V | 1.9mA | - | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Maxim Integrated |
IC LIU T1/E1/J1 3.3V 49-BGA
|
pacchetto: 49-LFBGA, CSPBGA |
Azione12.156 |
|
Serial | 1 | 3.135 V ~ 3.465 V | - | - | 0°C ~ 70°C | Surface Mount | 49-LFBGA, CSPBGA | 49-CSBGA (7x7) |
||
Microchip Technology |
IC ETHERNET QUAD PORT 256BGA
|
pacchetto: - |
Azione7.216 |
|
- | 1 | 1V | - | - | - | Surface Mount | - | 256-BGA (17x17) |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
pacchetto: - |
Azione6.672 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC SLIC 1CH UNIV 145V 28QFN
|
pacchetto: - |
Azione4.224 |
|
Parallel | 1 | 3.3V | 40mA | - | - | - | - | - |
||
Microchip Technology |
IC ECHO CANCELLER AEC 36SSOP
|
pacchetto: 36-BSOP (0.295", 7.50mm Width) |
Azione4.960 |
|
Serial | 1 | 2.7V ~ 3.6V | 20mA | - | -40°C ~ 85°C | Surface Mount | 36-BSOP (0.295", 7.50mm Width) | 36-SSOP |
||
Microchip Technology |
IC CNIC CIDCW CWD CID 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.616 |
|
3-Wire | 1 | 2.7V ~ 5.5V | 4.3mA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
TEMAP 168, LF BUMP
|
pacchetto: - |
Azione4.688 |
|
- | - | - | - | - | - | - | - | - |
||
Intel |
FRAMER E1/T1 5V 28-PIN PLCC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
MaxLinear, Inc. |
VOICECODEC PEF49000ELV11 LFBGA11
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
MaxLinear, Inc. |
IC
|
pacchetto: - |
Request a Quote |
|
- | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-VQFN (7x7) |
||
Broadcom Limited |
24GE + 4X10GE SWITCH
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |