Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC AUDIO RINGING CODEC 28-PDSO
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione6.016 |
|
IOM-2, PCI, Serial | 1 | 5V | 900µA | 1mW | -25°C ~ 80°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | P-DSO-28 |
||
Microsemi Corporation |
IC VOICEPORT 1CH FXS 8KHZ 44LQFP
|
pacchetto: 44-LQFP |
Azione2.704 |
|
PCM | 1 | - | - | - | - | Surface Mount | 44-LQFP | 44-eLQFP |
||
Maxim Integrated |
IC MUX FRAMER T3 E3 256BGA
|
pacchetto: 256-BGA |
Azione3.472 |
|
Parallel/Serial | - | 3.135 V ~ 3.465 V | 150mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-PBGA (27x27) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 12P 484-BGA
|
pacchetto: 484-BGA |
Azione6.560 |
|
LIU | 1 | 3.135 V ~ 3.465 V | 150mA | - | -40°C ~ 85°C | Surface Mount | 484-BGA | 484-BGA (23x23) |
||
Silicon Labs |
IC SLIC/CODEC PROG 38TSSOP
|
pacchetto: 38-TFSOP (0.173", 4.40mm Width) |
Azione17.448 |
|
PCM, SPI | 1 | 3.3V, 5V | 88mA | 700mW | -40°C ~ 85°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
Silicon Labs |
IC SLIC/CODEC 1CH 38TSSOP
|
pacchetto: 38-TFSOP (0.173", 4.40mm Width) |
Azione5.056 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | -40°C ~ 85°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
Microchip Technology |
IC UNVRSL PHONE CIRCUIT 44SSOP
|
pacchetto: 44-SOP (0.291", 7.40mm Width) |
Azione176.520 |
|
- | 1 | - | 3.8mA | 900mW | -25°C ~ 75°C | Surface Mount | 44-SOP (0.291", 7.40mm Width) | 44-SSO |
||
Exar Corporation |
IC LIU E1 SGL 28SOJ
|
pacchetto: 28-BSOJ (0.300", 7.62mm Width) |
Azione2.912 |
|
LIU | 1 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 28-BSOJ (0.300", 7.62mm Width) | 28-SOJ |
||
Intersil |
IC RSLIC FAMILY 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione7.056 |
|
2-Wire | 1 | - | - | - | 0°C ~ 70°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
Silicon Labs |
IC PROSLIC FXS ISI -106V 48QFN
|
pacchetto: - |
Azione4.896 |
|
3-Wire, PCM | 2 | 3.3V | - | - | 0°C ~ 70°C | - | - | - |
||
Microsemi Corporation |
IC 1FXO CHIPSET 1CH OLAC 10MSOP
|
pacchetto: - |
Azione2.672 |
|
- | 1 | - | - | - | - | Surface Mount | - | 10-MSOP |
||
IXYS Integrated Circuits Division |
IC RELAY OPTO 120MA 8SMD
|
pacchetto: 8-SMD (0.300", 7.62mm) |
Azione3.488 |
|
- | 2 | - | - | 800mW | -40°C ~ 85°C | Surface Mount | 8-SMD (0.300", 7.62mm) | 8-SMD |
||
Silicon Labs |
IC SYSTEM-SIDE DAA 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione44.400 |
|
DSP, Serial | 1 | 3 V ~ 3.6 V | 15mA | - | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Maxim Integrated |
IC T1/E1/J1 64KCC ELEMENT 64LQFP
|
pacchetto: 64-LQFP |
Azione9.636 |
|
64KCC, E1, T1 | 1 | 3.14 V ~ 3.47 V | 150mA | - | 0°C ~ 70°C | Surface Mount | 64-LQFP | 64-LQFP (10x10) |
||
Maxim Integrated |
IC TXRX E1 1-CHIP 5V 100-LQFP
|
pacchetto: 100-LQFP |
Azione3.984 |
|
E1, HDLC, J1, T1 | 1 | 4.75 V ~ 5.25 V | 75mA | - | 0°C ~ 70°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Microchip Technology |
IC ETHERNET RGMII/RMII 68-QFN
|
pacchetto: 68-VFQFN Exposed Pad |
Azione8.484 |
|
- | - | - | - | - | - | Surface Mount | 68-VFQFN Exposed Pad | 68-QFN (8x8) |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
pacchetto: - |
Azione5.344 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
48FE+4FE+HIGIG SWITCH
|
pacchetto: - |
Azione4.848 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC TDM SWITCH 2K-CH ENH 256BGA
|
pacchetto: 256-BGA |
Azione2.880 |
|
- | 1 | 1.71V ~ 1.89V | 165mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Microchip Technology |
IC DGTL SWITCH IDX 64X64 68PLCC
|
pacchetto: 68-LCC (J-Lead) |
Azione3.120 |
|
- | 1 | 4.5V ~ 5.5V | 10mA | - | -40°C ~ 85°C | Surface Mount | 68-LCC (J-Lead) | 68-PLCC |
||
Microchip Technology |
IC HDLC PROTOCOL CTLR 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione6.944 |
|
- | 1 | 4.75V ~ 5.25V | 1µA | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Harris Corporation |
BALANCED PBX/KEY SYSTEM SLIC
|
pacchetto: - |
Request a Quote |
|
2-Wire | 1 | -24V ~ -58V, 4.75V ~ 5.25V | - | - | 0°C ~ 75°C | Through Hole | 22-DIP (0.400", 10.16mm) | 22-PDIP |
||
Harris Corporation |
ITU LOW COST, PABX SLIC
|
pacchetto: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | ±4.75V ~ 5.25V | 5.5mA | 150 mW | -40°C ~ 85°C | Through Hole | 22-DIP (0.400", 10.16mm) | 22-PDIP |
||
Infineon Technologies |
FLEXISLIC SLIC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
TQFP 20.00X20.00X1.40 MM, 0.50MM
|
pacchetto: - |
Request a Quote |
|
JTAG, Serial | 8 | 3.13V ~ 3.47V | 60mA | 1.6 W | -40°C ~ 85°C | Surface Mount | 144-LQFP Exposed Pad | 144-TQFP (20x20) |
||
Broadcom Limited |
8P G.FAST 106/4P G.FAST 212
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
CML Microcircuits |
IC TELECOM INTERFACE 64VQFN
|
pacchetto: - |
Request a Quote |
|
C-Bus | 1 | 3V ~ 3.6V | 670µA | 3.5 W | -40°C ~ 85°C | Surface Mount | 64-VFQFN Exposed Pad | 64-VQFN (9x9) |
||
Analog Devices Inc./Maxim Integrated |
DS21Q50 QUAD E1 TRANSCEIVER
|
pacchetto: - |
Request a Quote |
|
E1 | 4 | 3.135V ~ 3.465V | 230mA | - | 0°C ~ 70°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |