Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC SGL CHIP ADSL-CPE LBGA-256
|
pacchetto: 256-LBGA |
Azione6.176 |
|
- | - | - | - | - | - | Surface Mount | 256-LBGA | PG-LBGA-256 |
||
Microsemi Corporation |
IC VOICEPORT FXS 4KHZ 44LQFP
|
pacchetto: 44-LQFP |
Azione360.000 |
|
PCM | 1 | 3V, 5V | - | - | - | Surface Mount | 44-LQFP | 44-eLQFP |
||
Microsemi Corporation |
IC DIGITAL SWITCH 16K CH 256BGA
|
pacchetto: 256-BGA |
Azione6.880 |
|
- | 1 | 1.71 V ~ 1.89 V | 240mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Maxim Integrated |
IC LIU SDH SONET 2CH 128-LQFP
|
pacchetto: 128-LQFP Exposed Pad |
Azione4.816 |
|
CMOS | 2 | 3.15 V ~ 3.45 V | 325mA | - | -40°C ~ 85°C | Surface Mount | 128-LQFP Exposed Pad | 128-LQFP (14x14) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144-CSBGA
|
pacchetto: 144-BGA, CSPBGA |
Azione5.632 |
|
LIU | 3 | 3.135 V ~ 3.465 V | 225mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144-CSBGA
|
pacchetto: 144-BGA, CSPBGA |
Azione5.520 |
|
LIU | 3 | 3.135 V ~ 3.465 V | 225mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Silicon Labs |
IC SLIC PROG 1CH 38QFN
|
pacchetto: 38-VFQFN Exposed Pad |
Azione5.008 |
|
SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | 0°C ~ 70°C | Surface Mount | 38-VFQFN Exposed Pad | 38-QFN (5x7) |
||
IXYS Integrated Circuits Division |
IC MOD DAA FULL-WAVE DETECT PCB
|
pacchetto: 18-DIP Module (0.850", 21.59mm), 11 Leads |
Azione5.472 |
|
- | 1 | 5V | 8mA | - | 0°C ~ 70°C | Through Hole | 18-DIP Module (0.850", 21.59mm), 11 Leads | 18-DIP |
||
Maxim Integrated |
IC TXRX T1/E1 QD 3.3V IND 256BGA
|
pacchetto: 256-BGA |
Azione4.864 |
|
E1 | 4 | 3.3V | - | - | - | Surface Mount | 256-BGA | 256-BGA (27x27) |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/E1/J1 OCTAL 256BGA
|
pacchetto: 256-BGA |
Azione4.800 |
|
E1, J1, T1 | 8 | 1.8V, 3.3V | - | 2.57W | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-PBGA (17x17) |
||
Silicon Labs |
IC PROSLIC FXS ISI DTMF 48QFN
|
pacchetto: - |
Azione4.320 |
|
3-Wire, PCM | 2 | 3.3V | - | - | -40°C ~ 85°C | - | - | - |
||
Silicon Labs |
IC PROSLIC FXS DUAL -110V 50QFN
|
pacchetto: - |
Azione6.800 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | - | 50-QFN (6x8) |
||
IXYS Integrated Circuits Division |
IC SHDSL/ISDN DC TERM 16MLP
|
pacchetto: 16-VDFN Exposed Pad |
Azione7.824 |
|
ISDN, SHDSL | 1 | - | - | 1W | -40°C ~ 85°C | Surface Mount | 16-VDFN Exposed Pad | 16-MLP (7x6) |
||
Silicon Labs |
IC SLIC/CODEC 1CH 38TSSOP
|
pacchetto: 38-TFSOP (0.173", 4.40mm Width) |
Azione5.184 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | 0°C ~ 70°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
Microsemi Corporation |
IC VOICEPORT 2CH SLIC 150V 24QFN
|
pacchetto: 24-QFN |
Azione29.280 |
|
PCM | 2 | - | - | - | - | Surface Mount | 24-QFN | 24-QFN (6x6) |
||
Exar Corporation |
IC BITS CLOCK EXTRACTOR 28TSSOP
|
pacchetto: 28-TSSOP (0.173", 4.40mm Width) |
Azione6.000 |
|
E1, T1 | 1 | 3.14 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 28-TSSOP (0.173", 4.40mm Width) | 28-TSSOP |
||
Broadcom Limited |
SWITCH FABRIC
|
pacchetto: - |
Azione3.728 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
STACKABLE MANAGED SWITCH 24 PORT
|
pacchetto: - |
Azione3.136 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC DAA CHIPSET 1CHAN 10MSOP
|
pacchetto: - |
Azione5.616 |
|
- | 1 | - | - | - | - | Surface Mount | - | 10-MSOP |
||
Microchip Technology |
IC DGTL SWITCH F12KDX 272BGA
|
pacchetto: 272-BGA |
Azione2.400 |
|
- | 1 | 3V ~ 3.6V | 160mA | - | -40°C ~ 85°C | Surface Mount | 272-BGA | 272-PBGA (27x27) |
||
Microchip Technology |
IC LINE CARD LCAS 1CH 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione4.128 |
|
- | 1 | 4.5V ~ 5.5V | - | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Broadcom Limited |
10GBE DUAL SFI - XAUI PHY
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Analog Devices Inc./Maxim Integrated |
DS3253 TRIPLE DS3/E3/STS-1 LIU
|
pacchetto: - |
Request a Quote |
|
DS3, E3, STS-1 | 3 | 3.135V ~ 3.465V | 280mA | - | -40°C ~ 85°C | Surface Mount | 144-LBGA, CSPBGA | 144-TECSBGA (13x13) |
||
Harris Corporation |
EIA/ITU PABX SLIC
|
pacchetto: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | -42V ~ -58V, 4.75V ~ 5.25V, 10.8V ~ 13.2V | - | 550 mW | 0°C ~ 75°C | Through Hole | 24-DIP (0.300", 7.62mm) | 24-PDIP |
||
Cirrus Logic Inc. |
DUAL T1/E1 LINE INTERFACE
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
onsemi |
TELECOM CIRCUIT, 1-FUNC, PDSO14
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Rohm Semiconductor |
IC POWER MANAGEMENT SMD
|
pacchetto: - |
Request a Quote |
|
- | 1 | 1.15V ~ 1.27V | - | 1.35 W | -35°C ~ 60°C | Surface Mount | 24-SOP (0.213", 5.40mm Width) + 2 Heat Tabs | 24-HSOP |
||
Infineon Technologies |
MUSLIC MULTICHANNEL SUBSCRIBER L
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |