Pagina 174 - Interfaccia - per telecomunicazioni | Circuiti integrati (CI) | Heisener Electronics
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Interfaccia - per telecomunicazioni

Record 4.847
Pagina  174/174
Immagine
Numero di parte
Produttore
Descrizione
pacchetto
Azione
Quantità
Interface
Number of Circuits
Voltage - Supply
Current - Supply
Power (Watts)
Operating Temperature
Mounting Type
Package / Case
Supplier Device Package
VSC8489YJU-01
Microchip Technology

DUAL 10G (R)-XAUI TO XFI/SFI PHY

  • Function: Ethernet
  • Interface: SPI
  • Number of Circuits: 2
  • Voltage - Supply: 1V, 1.2V
  • Current - Supply: -
  • Power (Watts): -
  • Operating Temperature: -40°C ~ 110°C
  • Mounting Type: Surface Mount
  • Package / Case: 196-BGA
  • Supplier Device Package: 196-FCBGA (15x15)
pacchetto: 196-BGA
Azione4.096
SPI
2
1V, 1.2V
-
-
-40°C ~ 110°C
Surface Mount
196-BGA
196-FCBGA (15x15)
LE88231DLCT
Microchip Technology

IC VOICEPORT 2CH FXS 4KHZ 80LQFP

  • Function: Telecom Circuit
  • Interface: PCM
  • Number of Circuits: 2
  • Voltage - Supply: -
  • Current - Supply: -
  • Power (Watts): -
  • Operating Temperature: -
  • Mounting Type: Surface Mount
  • Package / Case: 80-LQFP
  • Supplier Device Package: 80-eLQFP
pacchetto: 80-LQFP
Azione4.256
PCM
2
-
-
-
-
Surface Mount
80-LQFP
80-eLQFP
BCM68901IMLG
Broadcom Limited

XPON PMD DEVICE

  • Function: EPON OLT
  • Interface: -
  • Number of Circuits: -
  • Voltage - Supply: -
  • Current - Supply: -
  • Power (Watts): -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
pacchetto: -
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