Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC SPEECH/VOICE INCA-S TQFP-144
|
pacchetto: 144-LQFP |
Azione3.392 |
|
IOM-2 | 1 | - | - | - | - | Surface Mount | 144-LQFP | P-TQFP-144 |
||
Maxim Integrated |
IC LINE INTERFACE 5V T1/J1 PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione2.368 |
|
LIU | 1 | 4.75 V ~ 5.25 V | - | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Silicon Labs |
IC SLIC/CODEC 1CH 38TSSOP
|
pacchetto: 38-TFSOP (0.173", 4.40mm Width) |
Azione5.456 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | -40°C ~ 85°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/E1 8CH SHORT 144-TQFP
|
pacchetto: 144-LQFP |
Azione4.272 |
|
LIU | - | 3.13 V ~ 3.47 V | 55mA | - | -40°C ~ 85°C | Surface Mount | 144-LQFP | 144-TQFP (20x20) |
||
Microsemi Corporation |
IC SLIC 1CH 52DB LGBAL 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione17.292 |
|
2-Wire | 1 | 4.75 V ~ 5.25 V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Silicon Labs |
IC PROSLIC FXS DUAL -110V 50QFN
|
pacchetto: - |
Azione5.136 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | - | 50-QFN (6x8) |
||
Silicon Labs |
IC SLIC/CODEC PROG 38QFN
|
pacchetto: 38-VFQFN Exposed Pad |
Azione7.728 |
|
PCM, SPI | 1 | 3.3V, 5V | 88mA | 700mW | -40°C ~ 85°C | Surface Mount | 38-VFQFN Exposed Pad | 38-QFN (5x7) |
||
Silicon Labs |
IC PROSLIC FXS ISI -110V 42QFN
|
pacchetto: 42-WFQFN Exposed Pad |
Azione7.616 |
|
- | - | - | - | - | - | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Microsemi Corporation |
IC SLIC 2CH UNIV 100V 48TQFP
|
pacchetto: - |
Azione168.648 |
|
Parallel | 2 | 3.3V | 40mA | - | - | Surface Mount | - | 48-eTQFP |
||
Silicon Labs |
IC PROSLIC PCM/SPI -110V 42QFN
|
pacchetto: 42-WFQFN Exposed Pad |
Azione16.764 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | 0°C ~ 70°C | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Silicon Labs |
IC SLIC/CODEC 1CH 38QFN
|
pacchetto: 38-VFQFN Exposed Pad |
Azione4.176 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | -40°C ~ 85°C | Surface Mount | 38-VFQFN Exposed Pad | 38-QFN (5x7) |
||
Maxim Integrated |
IC LIU T1/E1/J1 3.3V 44-TQFP
|
pacchetto: 44-TQFP |
Azione26.856 |
|
- | 1 | 3.135 V ~ 3.465 V | 66mA | - | -40°C ~ 85°C | Surface Mount | 44-TQFP | 44-TQFP (10x10) |
||
Broadcom Limited |
GIGABIT ETH SWITCH 24GE 4XHG
|
pacchetto: - |
Azione4.992 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC ETHERNET RGMII/RMII 48-QFN
|
pacchetto: - |
Azione6.304 |
|
RMII | 1 | - | - | - | -40°C ~ 125°C | Surface Mount | - | 68-QFN (8x8) |
||
Microsemi Corporation |
WSE-40 (PB FREE)
|
pacchetto: 672-BGA, FCBGA |
Azione5.280 |
|
Serial | - | 1.2V | - | - | - | Surface Mount | 672-BGA, FCBGA | 672-FCBGA (27x27) |
||
Microchip Technology |
10GBE DUAL XFI TO XAUI XCVR W/ED
|
pacchetto: - |
Azione2.640 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
pacchetto: 256-BGA |
Azione4.192 |
|
- | - | - | - | - | - | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
pacchetto: - |
Azione3.200 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
pacchetto: - |
Azione3.168 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
MULTI LAYER SWITCH--1588 ENABLED
|
pacchetto: - |
Azione4.576 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
24GE + 4X10GE SWITCH
|
pacchetto: - |
Azione2.416 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CESOP PROCESSOR 64CH 324BGA
|
pacchetto: 324-BGA |
Azione2.192 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Microchip Technology |
IC TDM/TSI SWITCH 256X256 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione7.696 |
|
- | 1 | 3V ~ 3.6V | 4mA | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.51x16.51) |
||
Broadcom Limited |
TRAFFIC MGR PACKETPROC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
EPON/GPON HGU INDUSTRIAL - HIGH
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | 0°C ~ 70°C | - | - | - |
||
Broadcom Limited |
QUAD-CHANNEL 10-GBE SFI-TO-XAUI
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
212, BONDED 106, V/ADSL GW, NO S
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
TWIN SUBSCRIBER LINE INTERFACE
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |