Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
IC SLIC VOICE ACCESS PDSO-20
|
pacchetto: 20-SOIC (0.433", 11.00mm Width) Exposed Pad |
Azione4.800 |
|
IOM-2, PCM | 2 | 5V | 60mA, 90mA | - | - | Surface Mount | 20-SOIC (0.433", 11.00mm Width) Exposed Pad | P-DSO-20 |
|
|
|
Exar Corporation |
IC TXRX E1 7-CH 128SQFP
|
pacchetto: - |
Azione4.976 |
|
- | - | - | - | - | - | - | - | - |
|
|
Microsemi Corporation |
IC CESOP PROCESSOR 256CH 552BGA
|
pacchetto: 552-BGA |
Azione6.576 |
|
TDM | 1 | 1.65 V ~ 1.95 V | 950mA | - | -40°C ~ 85°C | Surface Mount | 552-BGA | 552-PBGA (35x35) |
|
|
Microsemi Corporation |
IC LINE CARD LCAS 1CHIPLE 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione3.696 |
|
- | 1 | 4.5 V ~ 5.5 V | - | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
|
|
Exar Corporation |
IC LIU E3/DS3/STS-1 1CH 52TQFP
|
pacchetto: 52-LQFP |
Azione6.192 |
|
LIU | 1 | 3.135 V ~ 3.465 V | 120mA | - | -40°C ~ 85°C | Surface Mount | 52-LQFP | 52-TQFP (10x10) |
|
|
Exar Corporation |
IC LIU E3/DS3/STS-1 3CH 128LQFP
|
pacchetto: 128-LQFP |
Azione5.280 |
|
LIU | 3 | 3.135 V ~ 3.465 V | 410mA | - | -40°C ~ 85°C | Surface Mount | 128-LQFP | 128-LQFP (14x20) |
|
|
Texas Instruments |
IC RES RING GEN CTRLR 16DIP
|
pacchetto: 16-DIP (0.300", 7.62mm) |
Azione2.784 |
|
- | 1 | 12V | 500µA | - | -40°C ~ 125°C | Through Hole | 16-DIP (0.300", 7.62mm) | 16-PDIP |
|
|
Maxim Integrated |
IC TRANSCEIVER E1 QUAD 5V 256BGA
|
pacchetto: 256-BGA |
Azione16.548 |
|
E1 | 4 | 5V | - | - | - | Surface Mount | 256-BGA | 256-BGA (27x27) |
|
|
Maxim Integrated |
IC LIU T3/E3/STS-1 49-BGA
|
pacchetto: 49-LFBGA, CSPBGA |
Azione4.720 |
|
LIU | 1 | 3.135 V ~ 3.465 V | - | - | 0°C ~ 70°C | Surface Mount | 49-LFBGA, CSPBGA | 49-CSBGA (7x7) |
|
|
Exar Corporation |
IC LIU E3/DS3/STS-1 4CH 176LQFP
|
pacchetto: 176-LQFP |
Azione9.552 |
|
LIU | 4 | 3.135 V ~ 3.465 V | 450mA | - | -40°C ~ 85°C | Surface Mount | 176-LQFP | 176-TQFP (24x24) |
|
|
|
Microsemi Corporation |
IC TDM/TSI SWITCH 512X256 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione2.000 |
|
- | 1 | 3 V ~ 3.6 V | 6mA | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.51x16.51) |
|
|
ams |
IC TELEPHONE CMOS MULTIFU 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione4.800 |
|
- | 1 | 3.8 V ~ 5 V | 4mA | - | -25°C ~ 70°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
|
|
Rohm Semiconductor |
IC TONE GEN LSI SSOP-B16 TR
|
pacchetto: 16-LSSOP (0.173", 4.40mm Width) |
Azione5.152 |
|
- | 1 | 2.2 V ~ 3.6 V | - | 450mW | -40°C ~ 85°C | Surface Mount | 16-LSSOP (0.173", 4.40mm Width) | 16-SSOPB |
|
|
Silicon Labs |
IC SLIC/CODEC PROG 38QFN
|
pacchetto: 38-VFQFN Exposed Pad |
Azione37.884 |
|
PCM, SPI | 1 | 3.3V, 5V | 88mA | 700mW | 0°C ~ 70°C | Surface Mount | 38-VFQFN Exposed Pad | 38-QFN (5x7) |
|
|
IXYS Integrated Circuits Division |
IC LITELINK III FULL RING 32SOIC
|
pacchetto: 32-SOIC (0.295", 7.50mm Width) |
Azione119.916 |
|
- | 1 | 3 V ~ 5.5 V | 9mA | 1W | -40°C ~ 85°C | Surface Mount | 32-SOIC (0.295", 7.50mm Width) | 32-SOIC |
|
|
|
Microsemi Corporation |
IC VOICEPORT 2CH SLIC 150V 24QFN
|
pacchetto: 24-QFN |
Azione3.328 |
|
PCM | 2 | - | - | - | - | Surface Mount | 24-QFN | 24-QFN (6x6) |
|
|
|
Maxim Integrated |
IC MUX TEMPE T3/E3 256-BGA
|
pacchetto: 256-BGA |
Azione6.880 |
|
Parallel/Serial | - | 3.135 V ~ 3.465 V | 150mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-PBGA (27x27) |
|
|
Maxim Integrated |
IC TXRX T1/E1/J1 64-LQFP
|
pacchetto: 64-LQFP |
Azione6.288 |
|
LIU | 1 | 3.135 V ~ 3.465 V | 104mA | - | -40°C ~ 85°C | Surface Mount | 64-LQFP | - |
|
|
|
Microchip Technology |
10 PORT MANAGED FE LAYER 2-SWITC
|
pacchetto: - |
Azione6.000 |
|
- | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
4P 10G WAN/LAN XFI-SFI MACSEC+15
|
pacchetto: 256-BBGA |
Azione4.032 |
|
SPI | 4 | 970mV, 1.2V | - | - | - | Surface Mount | 256-BBGA | 256-FCBGA (17x17) |
|
|
Renesas Electronics America |
IC XDSL LINE DVR DUAL-PORT 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione3.728 |
|
Serial | 2 | 10 V ~ 14.7 V | 19.5mA | - | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
|
|
|
Microchip Technology |
IC SLIC 1CH 8KHZ 150V HV 16SOIC
|
pacchetto: - |
Azione5.104 |
|
PCM | 1 | - | - | - | - | Surface Mount | - | 16-SOIC |
|
|
|
Microchip Technology |
IC TDM SWITCH 512CH 144LBGA
|
pacchetto: 144-LBGA |
Azione3.472 |
|
- | 1 | 3V ~ 3.6V | 250mA | - | -40°C ~ 85°C | Surface Mount | 144-LBGA | 144-LBGA (13x13) |
|
|
|
Microchip Technology |
IC SLAC NG EXT RING 196BGA
|
pacchetto: - |
Azione2.352 |
|
- | 1 | - | - | - | - | Surface Mount | - | 196-BGA |
|
|
Microchip Technology |
IC VOICEPORT 2CH FXS 8KHZ 80LQFP
|
pacchetto: 80-LQFP |
Azione4.960 |
|
PCM | 2 | 4.75V ~ 35V | - | - | - | Surface Mount | 80-LQFP | 80-eLQFP |
|
|
|
Infineon Technologies |
DUSLIC DUAL CHANNEL SUBSCRIBER L
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
|
|
|
Harris Corporation |
ITU LOW COST, PABX SLIC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
|
|
|
Harris Corporation |
EIA/ITU PABX SLIC WITH 40MILLI A
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
