Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
IC CONFIG DEVICE
|
pacchetto: 88-LFBGA |
Azione6.560 |
|
16Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 88-LFBGA | 88-UBGA (11x8) |
||
Altera |
IC CONFIG DEVICE 88UBGA
|
pacchetto: 88-LFBGA |
Azione5.008 |
|
16Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 88-LFBGA | 88-UBGA (11x8) |
||
Altera |
IC QUAD-SERIAL CONFIG DEVICE 512
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione2.480 |
|
512Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microchip Technology |
IC FPGA 1M CONFIG MEM 10MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.808 |
|
1Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM FLASH 32MBIT 44-PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione7.152 |
|
32Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC SRL CONFG EEPROM 256K 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione3.728 |
|
256Kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFG EEPROM 4M LV 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione2.336 |
|
4Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC CONFIG SEEPROM 1M 3.3V 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione45.840 |
|
1Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SRL CONFIG EEPROM 1M 8-LAP
|
pacchetto: 8-TDFN |
Azione2.576 |
|
1Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 1M 8LAP
|
pacchetto: 8-TDFN |
Azione4.320 |
|
1Mb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 2M 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione3.200 |
|
2Mb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Xilinx Inc. |
IC PROM SER 4MBIT 3.3V 44-PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione5.824 |
|
4Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Xilinx Inc. |
IC PROM PROG I-TEMP 3.3V 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione9.348 |
|
400kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.560 |
|
65kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Xilinx Inc. |
IC PROM SER I-TEMP 128K 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione18.684 |
|
128kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER C-TEMP 1K 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione4.016 |
|
1Mb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC SER CONFIG PROM 65K 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione7.392 |
|
64kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SERIAL CONFIG PROM 128K 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione76.248 |
|
128kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SER CONFIG PROM 128K 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione3.632 |
|
128kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC 3V SER CFG PROM 256K 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione16.320 |
|
256Kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC 3V SER CFG PROM 128K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione16.188 |
|
128kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Altera |
IC CONFIG DEVICE 1MBIT 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione3.152 |
|
1Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM REPROGR 4MB 44-VQFP
|
pacchetto: 44-TQFP |
Azione3.616 |
|
4Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-TQFP | 44-VQFP (10x10) |
||
Xilinx Inc. |
IC PROM REPROGR 512KB 44-VQFP
|
pacchetto: 44-TQFP |
Azione99.000 |
|
512kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-TQFP | 44-VQFP (10x10) |
||
Microchip Technology |
IC CONFIG SEEPROM 512K 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione6.976 |
|
512kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Altera |
IC CONFIG DEVICE 64MBIT 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione20.664 |
|
64Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Altera |
IC CONFIG DEVICE 65KBIT 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.696 |
|
65kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SRL FOR 4M GATE 20-TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione261.708 |
|
4Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |