Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC SRL CONFG EEPROM 512K LV 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione18.948 |
|
512kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione2.288 |
|
256Kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione16.584 |
|
1Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM PROG I-TEMP 5V 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.232 |
|
400kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM PROG I-TEMP 5V 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.520 |
|
300kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM PROG C-TEMP 5V 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.504 |
|
200kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER 10K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione126.300 |
|
1Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC 3V PROM PROG 50K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.408 |
|
50kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER I-TEMP 256K 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione14.400 |
|
256Kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SRL CONFIG EEPROM 1M 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione18.900 |
|
1Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC EEPROM FPGA 128KB 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.776 |
|
128kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC SER CFG PROM 512K 3.3V 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione116.532 |
|
512kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SERIAL CONFIG 65K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.100 |
|
65kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Altera |
IC CONFIG DEVICE 100QFP
|
pacchetto: 100-BQFP |
Azione2.640 |
|
8MB | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (14x20) |
||
Altera |
IC CONFIG DEVICE 212KBIT 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione7.792 |
|
212kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Altera |
IC CONFIG DEVICE 440KBIT 32TQFP
|
pacchetto: 32-TQFP |
Azione6.512 |
|
440kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 32-TQFP | 32-TQFP (7x7) |
||
Xilinx Inc. |
IC PROM SERIAL CONFIG 1M 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione4.256 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Altera |
IC CONFIG DEVICE 8MBIT 100QFP
|
pacchetto: 100-BQFP |
Azione6.576 |
|
8MB | 3 V ~ 3.6 V | -40°C ~ 85°C | 100-BQFP | 100-PQFP (14x20) |
||
Microchip Technology |
IC SRL CONFG EEPROM 2M LV 44TQFP
|
pacchetto: 44-TQFP |
Azione3.824 |
|
2Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 44-TQFP | 44-TQFP (10x10) |
||
Altera |
IC CONFIG DEVICE 64MBIT 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione6.224 |
|
64Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microchip Technology |
IC FLASH CONFIG 8M 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione7.308 |
|
8Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 2M 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione8.556 |
|
2Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Altera |
IC QUAD-SERIAL LOW VOLTAGE CONFI
|
pacchetto: 24-LBGA |
Azione6.420 |
|
1GB | 1.7 V ~ 2 V | -40°C ~ 85°C | 24-LBGA | 24-FBGA (6x8) |
||
Intel |
IC CONFIG DEVICE 128MBIT 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione5.408 |
|
128Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Intel |
IC CONFIG DEVICE 16MBIT 100QFP
|
pacchetto: 100-BQFP |
Azione12.480 |
|
16Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 100-BQFP | 100-PQFP (20x14) |
||
Intel |
IC CONFIG DEVICE 8MBIT 100QFP
|
pacchetto: 100-BQFP |
Azione5.904 |
|
8MB | 3 V ~ 3.6 V | -40°C ~ 85°C | 100-BQFP | 100-PQFP (20x14) |
||
AMD |
CONFIG MEMORY, 4MX1, SERIAL
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - |
||
AMD |
IC PROM ISP 2MB 3.3V 20TSSOP
|
pacchetto: - |
Request a Quote |
|
2Mb | 3V ~ 3.6V | -40°C ~ 85°C (TA) | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |