Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
IC CONFIG DEVICE 16MBIT 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione722.184 |
|
16Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Xilinx Inc. |
IC PROM SERIAL 10K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione12.600 |
|
100kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Microchip Technology |
IC FPGA 256K CONFIG MEM 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione4.864 |
|
256Kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC FPGA 4M CONFIG MEM 44TQFP
|
pacchetto: 44-TQFP |
Azione3.872 |
|
4Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 44-TQFP | 44-TQFP (10x10) |
||
Microchip Technology |
IC FLASH CONFIG 16M 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione4.432 |
|
16Mb | 2.97 V ~ 3.63 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC FLASH CONFIG 4M 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione5.792 |
|
4Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC 1 MB 3.3V SER CONF PROM 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione67.644 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione4.800 |
|
512kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SRL CONFIG 256K 44-VQFP
|
pacchetto: 44-TQFP |
Azione4.640 |
|
256Kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-TQFP | 44-VQFP (10x10) |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 44-PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione4.784 |
|
16Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Xilinx Inc. |
IC PROM SER 1M 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.696 |
|
1Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER 1MBIT 3.3V 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione6.640 |
|
1Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SER 30000 I-TEMP 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione4.016 |
|
300kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER 30000 C-TEMP 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione4.880 |
|
300kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER 200000 C-TEMP 44VQFP
|
pacchetto: 44-TQFP |
Azione4.112 |
|
2Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-TQFP | 44-VQFP (10x10) |
||
Microchip Technology |
IC PROM SER CONF 2M 3.3V 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione7.760 |
|
2Mb | 3.15 V ~ 3.45 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC EEPROM FPGA 65KB 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione6.768 |
|
64kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC SER CONFIG PROM 256K 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione5.904 |
|
256Kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SER I-TEMP 1K 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.952 |
|
1Mb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SERIAL CONFIG PROM 64K 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione5.024 |
|
64kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SERIAL CONFIG 65K 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.596 |
|
65kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Altera |
IC CONFIG DEVICE 400KBIT 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione18.804 |
|
440kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Altera |
IC CONFIG DEVICE 1MBIT 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.175.152 |
|
1Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FPGA EEPROM 512K ALTERA 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione6.032 |
|
512kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SRL FOR 1M GATE 20-TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione277.920 |
|
1Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Intel |
IC CONFIG DEVICE 400KBIT 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione6.000 |
|
440kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Intel |
IC CONFIG DEVICE 400KBIT 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione14.604 |
|
440kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |