Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Xilinx Inc. |
PROM 16M-BIT 3.3V 44CCC
|
pacchetto: 44-CCC (J-Lead) |
Azione23.568 |
|
16Mb | 3 V ~ 3.6 V | -55°C ~ 125°C (TC) | 44-CCC (J-Lead) | 44-CCCP (16.51x16.51) |
||
Xilinx Inc. |
IC PROM SERIAL CONFIG 65K 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione6.128 |
|
65kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC FLASH CONFIG 16M 44TQFP
|
pacchetto: 44-TQFP |
Azione5.808 |
|
16Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 44-TQFP | 44-TQFP (10x10) |
||
Microchip Technology |
IC FLASH CONFIG 8M 44TQFP
|
pacchetto: 44-TQFP |
Azione2.544 |
|
8Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 44-TQFP | 44-TQFP (10x10) |
||
Microchip Technology |
IC SRL CONFG EEPROM 256K LV 8LAP
|
pacchetto: 8-TDFN |
Azione2.928 |
|
256Kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 1M LV 8LAP
|
pacchetto: 8-TDFN |
Azione2.464 |
|
1Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 64K 8LAP
|
pacchetto: 8-TDFN |
Azione6.480 |
|
64kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-TDFN | 8-LAP |
||
Microchip Technology |
IC SRL CONFIG EEPROM 2M 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione4.144 |
|
2Mb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC 3V PROM SER 200K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.656 |
|
200kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER 200K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.744 |
|
2Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM PROG 50K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.600 |
|
50kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER I-TEMP 256K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.280 |
|
256Kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER I-TEMP 128K 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione9.144 |
|
128kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 64K 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione3.616 |
|
64kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SRL CONFIG EEPROM 128K 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione168.216 |
|
128kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SERIAL CONFIG PROM 256K 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione33.360 |
|
256Kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SER CONFIG PROM 256K 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione5.024 |
|
256Kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SERIAL CONFIG PROM 1M 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione7.872 |
|
1Mb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Altera |
IC CONFIG DEVICE 1MBIT 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.608 |
|
1Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Xilinx Inc. |
IC PROM SERIAL 16MB DIE
|
pacchetto: Die |
Azione5.984 |
|
16Mb | 3 V ~ 3.6 V | - | Die | Die |
||
Microchip Technology |
IC FLASH CONFIG 8M 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione6.720 |
|
8Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Altera |
IC CONFIG DEVICE 400KBIT 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione138.828 |
|
440kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SRL 1.8V 16M 48CSBGA
|
pacchetto: 48-TFBGA, CSPBGA |
Azione65.880 |
|
16Mb | 1.65 V ~ 2 V | -40°C ~ 85°C | 48-TFBGA, CSPBGA | 48-CSP (8x9) |
||
Intel |
IC CONFIG DEVICE 88UBGA
|
pacchetto: 88-LFBGA |
Azione4.592 |
|
16Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 88-LFBGA | 88-UBGA (11x8) |
||
Intel |
IC CONFIG DEVICE 440KBIT 32TQFP
|
pacchetto: 32-TQFP |
Azione4.832 |
|
440kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 32-TQFP | 32-TQFP (7x7) |
||
Intel |
IC CONFIG DEVICE 1MBIT 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione4.592 |
|
1Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Intel |
IC CONFIG DEVICE 16MBIT 88UBGA
|
pacchetto: 88-LFBGA |
Azione7.020 |
|
16Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 88-LFBGA | 88-UBGA (11x8) |
||
Intel |
IC CONFIG DEVICE 1.6MBIT 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione6.192 |
|
1.6Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |