Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC FPGA 512K CONFIG MEM 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione4.640 |
|
512kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC FLASH CONFIG 8M 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione6.992 |
|
8Mb | 2.97 V ~ 3.63 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 1M LV 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione3.968 |
|
1Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SRL CONFG EEPROM 4M LV 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione20.208 |
|
4Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC CONFIG SEEPROM 512K 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.056 |
|
512kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SRL CONFIG EEPROM 2M 44-PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione3.072 |
|
4Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 2M 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione4.304 |
|
2Mb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione20.856 |
|
1Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 44-PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione6.304 |
|
8Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Xilinx Inc. |
IC PROM PROG I-TEMP 5V 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione3.472 |
|
400kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER 100000 I-TEMP 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione4.960 |
|
1Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM PROG I-TEMP 3.3V 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.136 |
|
50kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM PROG C-TEMP 3.3V 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.232 |
|
50kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SRL CONFG EEPROM 256K 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione15.360 |
|
256Kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SERIAL CONFIG PROM 2M 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione3.536 |
|
2Mb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SERIAL CONFIG PROM 128K 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione91.452 |
|
128kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Altera |
IC CONFIG DEVICE 212KBIT 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione48.276 |
|
212kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Altera |
IC CONFIG DEVICE 32TQFP
|
pacchetto: 32-TQFP |
Azione5.792 |
|
440kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | -40°C ~ 85°C | 32-TQFP | 32-TQFP (7x7) |
||
Xilinx Inc. |
IC MEM PROM 16MB 3.3V 44PIN
|
pacchetto: 44-CCC (J-Lead) |
Azione3.776 |
|
16Mb | 3 V ~ 3.6 V | -55°C ~ 125°C (TC) | 44-CCC (J-Lead) | 44-CCCP (16.51x16.51) |
||
Xilinx Inc. |
IC PROM REPROGR 2MB 44-PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione8.676 |
|
2Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 1M 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione18.018 |
|
1Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Intel |
IC CONFIG DEVICE
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione4.000 |
|
1Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Intel |
IC CONFIG DEVICE
|
pacchetto: 88-LFBGA |
Azione2.912 |
|
16Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 88-LFBGA | 88-UBGA (11x8) |
||
Intel |
IC CONFIG DEVICE 100QFP
|
pacchetto: 100-BQFP |
Azione6.464 |
|
8MB | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (20x14) |
||
Intel |
IC CONFIG DEVICE 212KBIT 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione4.208 |
|
212kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Intel |
IC CONFIG DEVICE 1MBIT 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione8.736 |
|
1Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Intel |
IC CONFIG DEVICE 64MBIT 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione8.604 |
|
64Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Altera |
CONFIG MEMORY, 64KX1, SERIAL
|
pacchetto: - |
Request a Quote |
|
64kb | 3V ~ 3.6V | 0°C ~ 70°C (TA) | 32-TQFP | 32-TQFP (7x7) |