Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
IC CONFIG DEVICE
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione4.960 |
|
64Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Altera |
IC CONFIG DEVICE 100QFP
|
pacchetto: 100-BQFP |
Azione7.472 |
|
4MB | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (14x20) |
||
Xilinx Inc. |
IC PROM SERIEAL 10K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.208 |
|
100kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SERIAL 1K 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione3.488 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SER 50K C-TEMP 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.824 |
|
500kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM SRL CONFG 2M LV 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione4.208 |
|
2Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC FLASH CONFIG 4M 32TQFP
|
pacchetto: 32-TQFP |
Azione6.832 |
|
4Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 64K 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione5.584 |
|
64kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SER 2MBIT 3.3V 44-PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione4.944 |
|
2Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Xilinx Inc. |
IC PROM SER 5000 C-TEMP 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.280 |
|
150kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.016 |
|
65kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER I-TEMP 512K 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione7.616 |
|
512kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC SER CONFIG PROM 512K 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione78.048 |
|
512kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC EEPROM FPGA 256KB 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione3.232 |
|
256Kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC EEPROM FPGA 64KB 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.800 |
|
64kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM FPGA 128KB 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.592 |
|
128kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SERIAL CONFIG PROM 1M 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione4.032 |
|
1Mb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Altera |
IC CONFIG DEVICE 4MBIT 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.480 |
|
4MB | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Xilinx Inc. |
IC PROM REPROGR 2MB 44-VQFP
|
pacchetto: 44-TQFP |
Azione29.184 |
|
2Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-TQFP | 44-VQFP (10x10) |
||
Microchip Technology |
IC FLASH CONFIG 8M 8LAP
|
pacchetto: 8-TDFN |
Azione3.056 |
|
8Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 8-TDFN | 8-LAP (6x6) |
||
Altera |
IC QUAD-SERIAL LOW VOLTAGE CONFI
|
pacchetto: 24-TBGA |
Azione7.696 |
|
256MB | 1.7 V ~ 2 V | -40°C ~ 85°C | 24-TBGA | 24-FBGA (6x8) |
||
Microchip Technology |
IC FLASH CONFIG 8M 8LAP
|
pacchetto: 8-TDFN |
Azione4.992 |
|
8Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 8-TDFN | 8-LAP (6x6) |
||
Altera |
IC CONFIG DEVICE 32MBIT 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione9.768 |
|
32Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH CONFIG 4M 8LAP
|
pacchetto: 8-TDFN |
Azione6.096 |
|
4Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 8-TDFN | 8-LAP (6x6) |
||
Intel |
IC CONFIG DEVICE 1MBIT 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione10.020 |
|
1Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Intel |
IC CONFIG DEVICE 16MBIT 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione42.240 |
|
16Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Intel |
IC CONFIG DEVICE 1.6MBIT 32TQFP
|
pacchetto: 32-TQFP |
Azione7.560 |
|
1.6Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 32-TQFP | 32-TQFP (7x7) |
||
AMD |
IC PROM ISP 1MB 3.3V 20TSSOP
|
pacchetto: - |
Request a Quote |
|
1Mb | 3V ~ 3.6V | -40°C ~ 85°C (TA) | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |