Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Xilinx Inc. |
IC PROM SERIAL 3.3V 300K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.496 |
|
300kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SERIAL 100K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.048 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Microchip Technology |
IC FPGA EEPROM 2M ALTERA 8LAP
|
pacchetto: 8-TDFN |
Azione3.824 |
|
2Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC FPGA 2M CONFIG MEM 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione2.576 |
|
2Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC SRL CONFIG EEPROM 512K 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione4.944 |
|
512kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SRL CONFIG EEPROM 1M 32TQFP
|
pacchetto: 32-TQFP |
Azione3.664 |
|
1Mb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 32-TQFP | 32-TQFP (7x7) |
||
Xilinx Inc. |
IC PROM SER C-TEMP 3.3V 44-VQFP
|
pacchetto: 44-TQFP |
Azione6.688 |
|
16Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-TQFP | 44-VQFP (10x10) |
||
Xilinx Inc. |
IC PROM SER 2MBIT 3.3V 44-VQFP
|
pacchetto: 44-TQFP |
Azione4.304 |
|
2Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-TQFP | 44-VQFP (10x10) |
||
Xilinx Inc. |
IC PROM PROG C-TEMP 3.3V 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione10.332 |
|
100kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC SERIAL CFG PROM 128K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.784 |
|
128kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Microchip Technology |
IC SRL CONFG EEPROM 256K 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione4.368 |
|
256Kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC EEPROM FPGA 256KB 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.864 |
|
256Kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Xilinx Inc. |
IC 3V SER CFG PROM 65K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione10.152 |
|
65kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Altera |
IC CONFIG DEVICE 32TQFP
|
pacchetto: 32-TQFP |
Azione4.368 |
|
440kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | -40°C ~ 85°C | 32-TQFP | 32-TQFP (7x7) |
||
Xilinx Inc. |
RE-PROGRAMMABLE 4MB PROM
|
pacchetto: 44-TQFP |
Azione2.288 |
|
4Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-TQFP | 44-VQFP (10x10) |
||
Microchip Technology |
IC FLASH CONFIG 16M 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione5.856 |
|
16Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC FLASH CONFIG 2MBIT 20-TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione6.016 |
|
2Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Altera |
IC CONFIG DEVICE 16MBIT 88UBGA
|
pacchetto: 88-LFBGA |
Azione10.296 |
|
16Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 88-LFBGA | 88-UBGA (11x8) |
||
Microchip Technology |
IC FLASH CONFIG 8M 32TQFP
|
pacchetto: 32-TQFP |
Azione7.392 |
|
8Mb | 2.97 V ~ 3.63 V | 0°C ~ 70°C | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 64K LV 8LAP
|
pacchetto: 8-TDFN |
Azione7.248 |
|
64kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC FLASH CONFIG 4M 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione6.288 |
|
4Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SRL 1.8V 8M GATE 48CSBGA
|
pacchetto: 48-TFBGA, CSPBGA |
Azione160.872 |
|
8Mb | 1.65 V ~ 2 V | -40°C ~ 85°C | 48-TFBGA, CSPBGA | 48-CSP (8x9) |
||
Intel |
IC CONFIG DEVICE 100QFP
|
pacchetto: 100-BQFP |
Azione4.016 |
|
16Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (20x14) |
||
Intel |
IC CONFIG DEVICE 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione11.424 |
|
65kb | 4.5 V ~ 5.5 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Intel |
IC CONFIG DEVICE 16MBIT 100QFP
|
pacchetto: 100-BQFP |
Azione5.360 |
|
16Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 100-BQFP | 100-PQFP (20x14) |
||
Intel |
IC CONFIG DEVICE 16MBIT 100QFP
|
pacchetto: 100-BQFP |
Azione6.096 |
|
16Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (20x14) |
||
Intel |
IC CONFIG DEVICE 1.6MBIT 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione28.524 |
|
1.6Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Intel |
MEMORY
|
pacchetto: - |
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