Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Xilinx Inc. |
IC PROM SERIAL 200K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione67.884 |
|
2Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Microchip Technology |
IC FLASH CONFIG 8M 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione2.848 |
|
8Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC FLASH CONFIG 4M 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione3.056 |
|
4Mb | 2.97 V ~ 3.63 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 2M 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione6.576 |
|
2Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione17.976 |
|
512kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM SER 1MBIT 3.3V 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione6.288 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC 3V PROM SER 300K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.960 |
|
300kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM PROG C-TEMP 5V 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione3.808 |
|
300kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER 150000 I-TEMP 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione7.888 |
|
1.5Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC SER CFG PROM 65K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.592 |
|
65kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.248 |
|
65kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Microchip Technology |
IC SRL CONFG EEPROM 256K 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione3.888 |
|
256Kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC SER CONFIG PROM 65K 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione6.560 |
|
64kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SER CONFIG PROM 128K 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione7.888 |
|
128kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
1C SERIAL CONFIG PROM 2M 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione3.936 |
|
2Mb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC EEPROM FPGA 64KB 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.576 |
|
64kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SER CNFIG PROM 256K 3.3V 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione119.208 |
|
256Kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SRL FOR 2M GATE 44-VQFP
|
pacchetto: 44-TQFP |
Azione56.628 |
|
2Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-TQFP | 44-VQFP (10x10) |
||
Xilinx Inc. |
IC PROM REPROGR 512KB 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione8.820 |
|
512kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM SRL 1.8V 8M GATE 48CSBGA
|
pacchetto: 48-TFBGA, CSPBGA |
Azione148.308 |
|
8Mb | 1.65 V ~ 2 V | -40°C ~ 85°C | 48-TFBGA, CSPBGA | 48-CSP (8x9) |
||
Altera |
IC CONFIG DEVICE 128MBIT 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione12.180 |
|
128Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microchip Technology |
IC FLASH CONFIG 4M 8LAP
|
pacchetto: 8-TDFN |
Azione6.204 |
|
4Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 8-TDFN | 8-LAP (6x6) |
||
Xilinx Inc. |
IC PROM SRL FOR 4M GATE 44-VQFP
|
pacchetto: 44-TQFP |
Azione458.700 |
|
4Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-TQFP | 44-VQFP (10x10) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 1M 8-LAP
|
pacchetto: 8-TDFN |
Azione14.844 |
|
1Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-TDFN | 8-LAP (6x6) |
||
Xilinx Inc. |
IC PROM SRL 1.8V 8M GATE 48TSOP
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione113.772 |
|
8Mb | 1.65 V ~ 2 V | -40°C ~ 85°C | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Intel |
IC CONFIG DEVICE
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.368 |
|
4MB | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Intel |
IC CONFIG DEVICE 4MBIT 100QFP
|
pacchetto: 100-BQFP |
Azione5.264 |
|
4MB | 3 V ~ 3.6 V | -40°C ~ 85°C | 100-BQFP | 100-PQFP (20x14) |
||
Xilinx Inc. |
IC PROM IN SYST PRG 3.3V 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione15.804 |
|
2Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |