Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC CTRLR INT 256CH 323-FCLBGA
|
pacchetto: 323-BBGA, FCBGA |
Azione6.800 |
|
HDLC, PPP, SS7, TMA | - | 3 V ~ 3.6 V | 200mA | 3W | -40°C ~ 85°C | Surface Mount | 323-BBGA, FCBGA | 323-FCLBGA |
||
Microsemi Corporation |
IC VOICEPORT 2CH FXS 8KHZ 80LQFP
|
pacchetto: 80-LQFP |
Azione6.688 |
|
PCM | 2 | - | - | - | - | Surface Mount | 80-LQFP | 80-eLQFP |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 6CH 217BGA
|
pacchetto: 217-BBGA |
Azione3.056 |
|
LIU | 6 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 217-BBGA | 217-BGA (23x23) |
||
Cypress Semiconductor Corp |
IC TXRX HOTLINK II QUAD 256LBGA
|
pacchetto: 256-LBGA Exposed Pad |
Azione2.480 |
|
LVTTL | 4 | 3.135 V ~ 3.465 V | 870mA | - | 0°C ~ 70°C | Surface Mount | 256-LBGA Exposed Pad | 256-BGA |
||
Maxim Integrated |
IC TXRX QUAD E1 3.3V 256-BGA
|
pacchetto: 256-BGA |
Azione3.552 |
|
E1 | 4 | 3.3V | - | - | - | Surface Mount | 256-BGA | 256-BGA (27x27) |
||
Maxim Integrated |
IC LIU T1/J1 3.3V 28-PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione5.712 |
|
- | - | 3.135 V ~ 3.465 V | - | - | 0°C ~ 70°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Silicon Labs |
IC SLIC/CODEC 1CH 38TSSOP
|
pacchetto: 38-TFSOP (0.173", 4.40mm Width) |
Azione4.064 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | 0°C ~ 70°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
Microsemi Corporation |
IC DGTL SWITCH 4K X 2K 256MQFP
|
pacchetto: 256-BQFP |
Azione12.240 |
|
- | 1 | 3 V ~ 3.6 V | 480mA | - | -40°C ~ 85°C | Surface Mount | 256-BQFP | 256-MQFP (28x28) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 3CH 120LQFP
|
pacchetto: - |
Azione5.920 |
|
LIU | 3 | 3.135 V ~ 3.465 V | 350mA | - | -40°C ~ 85°C | - | - | - |
||
Maxim Integrated |
IC TXRX E1 3.3V 100-LQFP
|
pacchetto: 100-LQFP |
Azione5.968 |
|
E1, HDLC | 1 | 3.14 V ~ 3.47 V | 75mA | - | 0°C ~ 70°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Silicon Labs |
IC DAA FCC+ EMBEDDED 10SOIC
|
pacchetto: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Azione7.104 |
|
- | 1 | - | 9mA | - | 0°C ~ 70°C | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-MSOP |
||
Linear Technology |
IC RING TONE GENERATOR 14-DIP
|
pacchetto: 14-DIP (0.300", 7.62mm) |
Azione2.000 |
|
- | 1 | - | - | - | -40°C ~ 125°C | Through Hole | 14-DIP (0.300", 7.62mm) | 14-PDIP |
||
Silicon Labs |
IC PROSLIC FXS ISI -110V 42QFN
|
pacchetto: 42-WFQFN Exposed Pad |
Azione6.768 |
|
- | - | - | - | - | - | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
IXYS Integrated Circuits Division |
IC COLT MONITOR DETECTOR 16SOP
|
pacchetto: 16-SSOP (0.154", 3.90mm Width) |
Azione6.304 |
|
- | 1 | 3 V ~ 5.5 V | 1.72mA | 50mW | -40°C ~ 85°C | Surface Mount | 16-SSOP (0.154", 3.90mm Width) | 16-SOP |
||
Microsemi Solutions Sdn Bhd. |
25 PORT L2 SWITCH W/12 GIGE CUPH
|
pacchetto: - |
Azione6.360 |
|
Serial | 1 | 1V | - | - | - | Surface Mount | - | 302-TQFP (24x24) |
||
Microsemi Solutions Sdn Bhd. |
IC ETHERNET RGMII/RMII 48-QFN
|
pacchetto: - |
Azione9.912 |
|
RMII | 1 | - | - | - | -40°C ~ 125°C | Surface Mount | - | 48-QFN (6x6) |
||
NXP |
CABLE PREPROCESSOR LP TUNER
|
pacchetto: - |
Azione3.584 |
|
- | - | - | - | - | - | - | - | - |
||
Renesas Electronics America |
IC LINE DVR DIFF 300MHZ 16QFN
|
pacchetto: - |
Azione6.832 |
|
- | 1 | 4.5 V ~ 13.2 V | 6mA | - | -40°C ~ 85°C | - | - | - |
||
STMicroelectronics |
PROGRAMMABLE POWER-LINE COMMUNIC
|
pacchetto: 56-VFQFN Exposed Pad |
Azione4.576 |
|
I²C, SPI, UART/USART | 1 | 2.3 V ~ 2.75 V, 3 V ~ 3.6 V | - | - | -40°C ~ 105°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (7x7) |
||
Microchip Technology |
IC SLIC 1CH UNIV 100V 28QFN
|
pacchetto: - |
Azione7.344 |
|
Parallel | 1 | 3.3V | 40mA | - | - | - | - | - |
||
Microchip Technology |
IC TDM SWITCH 1K-CH ENH 256LQFP
|
pacchetto: 256-LQFP |
Azione3.760 |
|
- | 1 | 1.71V ~ 1.89V | 150mA | - | -40°C ~ 85°C | Surface Mount | 256-LQFP | 256-LQFP (28x28) |
||
Microchip Technology |
155 MBIT/S ATM AND PACKET-OVER-S
|
pacchetto: - |
Azione7.344 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
MICROPROCESSOR
|
pacchetto: - |
Azione6.640 |
|
JTAG, Microprocessor, Parallel, Serial | 1 | 1.2V | - | - | - | - | - | - |
||
MaxLinear, Inc. |
DATA COMM VRX517B1VC VQFN108 SLN
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
63168V+6303+53124S+4360
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
ETHERNET SWITCH 24X 10GE
|
pacchetto: - |
Request a Quote |
|
PCI Express | - | - | - | - | - | - | - | - |
||
Cirrus Logic Inc. |
TELECOM IC, CMOS, PQCC28
|
pacchetto: - |
Request a Quote |
|
E1, T1 | 1 | 4.75V ~ 5.25V | - | 350 mW | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Broadcom Limited |
64X100G MULTI-LAYER SWITCH
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |