Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:10 625MHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione6.608 |
|
1 | 2:10 | Yes/Yes | HSTL, PECL | HSTL | 625MHz | 3.135 V ~ 3.465 V | -40°C ~ 110°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione4.864 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione3.968 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 3 V ~ 5.5 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 4:4 2.5GHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione6.324 |
|
1 | 4:4 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 2.5GHz | 2.97 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione44.340 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 3 V ~ 5.5 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Texas Instruments |
IC CLK BUFFER 1:4 800MHZ 24VQFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione2.080 |
|
1 | 1:4 | Yes/Yes | CML, HSTL, LVDS, LVPECL, LVTTL, SSTL-2, VML | LVCMOS, LVPECL | 800MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-VQFN Exposed Pad (4x4) |
||
NXP |
IC CLK BUFFER 2:16 350MHZ 48LQFP
|
pacchetto: 48-LQFP |
Azione11.808 |
|
1 | 2:16 | Yes/No | LVCMOS, LVPECL | LVCMOS | 350MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:22 500MHZ 64TQFP
|
pacchetto: 64-TQFP Exposed Pad |
Azione3.984 |
|
1 | 2:22 | Yes/Yes | CML, HCSL, HSTL, LVDS, LVHSTL, LVPECL, SSTL | HSTL | 500MHz | 3.135 V ~ 3.465 V | 0°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-TQFP-EP (10x10) |
||
Microsemi Corporation |
10 OUTPUT PROGRAMMABLE FANOUT BU
|
pacchetto: - |
Azione7.808 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:8 266MHZ 28TSSOP
|
pacchetto: 28-TSSOP (0.173", 4.40mm Width) |
Azione7.888 |
|
1 | 2:8 | No/Yes | LVCMOS, LVTTL, Crystal | LVPECL | 266MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 28-TSSOP (0.173", 4.40mm Width) | 28-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 2:4 267MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione6.384 |
|
1 | 2:4 | Yes/Yes | HCSL, LVDS | HCSL, LVDS | 267MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Diodes Incorporated |
IC CLOCK BUFFER MUX 2:10 32TQFP
|
pacchetto: 32-TQFP |
Azione24.168 |
|
1 | 2:10 | Yes/Yes | CML, LVDS, LVPECL, SSTL | LVPECL | 500MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Silicon Labs |
IC CLK BUFFER 1:8 CMOS 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione5.872 |
|
1 | 1:8 | Yes/No | CML, HCSL, LVDS, LVPECL | CMOS | 200MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Silicon Labs |
2:12 CMOS BUFFER (200MHZ), 2:1 L
|
pacchetto: 24-VFQFN Exposed Pad |
Azione7.696 |
|
1 | 2:6 | No/No | LVCMOS | LVCMOS | 200MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
ON Semiconductor |
IC CLK BUFFER 1:9 800MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione6.072 |
|
1 | 1:9 | Yes/Yes | ECL, PECL | ECL, PECL | 800MHz | 4.2 V ~ 5.7 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 2:4 250MHZ 32VFQFPN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione8.676 |
|
1 | 2:4 | Yes/No | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVCMOS, LVTTL | 250MHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |
||
Texas Instruments |
IC CLK BUFFER 1:10 100MHZ 24SSOP
|
pacchetto: 24-SSOP (0.209", 5.30mm Width) |
Azione5.600 |
|
1 | 1:10 | No/No | LVTTL | LVTTL, TRI-State | 100MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 200MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione94.104 |
|
1 | 1:4 | No/No | CMOS | CMOS | 200MHz | 2.375 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:2 650MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione5.600 |
|
1 | 2:2 | Yes/Yes | CML, HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 650MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 160MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione23.076 |
|
1 | 1:4 | No/No | CMOS | CMOS | 160MHz | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Renesas Electronics Corporation |
IC CLK BUFFER 1:8 200MHZ 16TSSOP
|
pacchetto: - |
Azione7.500 |
|
1 | 1:8 | No/No | LVCMOS | LVCMOS | 200 MHz | 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 105°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Texas Instruments |
IC CLK BUFFER 2:12 2GHZ 40VQFN
|
pacchetto: - |
Request a Quote |
|
1 | 2:12 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | Clock, LVDS | 2 GHz | 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 105°C (TA) | Surface Mount | 40-VFQFN Exposed Pad | 40-VQFN (6x6) |
||
Texas Instruments |
IC CLK BUFFER 2:8 2GHZ 40VQFN
|
pacchetto: - |
Azione7.137 |
|
1 | 2:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 2 GHz | 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 105°C (TA) | Surface Mount | 40-VFQFN Exposed Pad | 40-VQFN (6x6) |
||
Renesas Electronics Corporation |
IC CLOCK
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
9QXL2001B DB2000QL
|
pacchetto: - |
Request a Quote |
|
1 | 1:20 | Yes/Yes | HCSL | HCSL | 400 MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 80-VFQFN Dual Rows, Exposed Pad | 80-GQFN (6x6) |
||
onsemi |
IC CLK BUFF MUX 2:10 3GHZ 32LQFP
|
pacchetto: - |
Request a Quote |
|
- | 2:10 | - | - | - | - | - | - | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
SiTime |
-40C TO 125C, 8PIN, 2020, 1.8V-3
|
pacchetto: - |
Azione6.000 |
|
1 | 1:4 | No/No | Clock | LVCMOS | 200 MHz | 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 125°C (TA) | Surface Mount | 8-WFDFN | 8-DFN (2x2) |
||
Broadcom Limited |
GNSS FILTER-LNA FRONT-END MODULE
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - |