Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:5 2GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione3.728 |
|
1 | 2:5 | Yes/Yes | ECL, HSTL, LVDS, PECL | ECL, PECL | 2GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 100MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione38.556 |
|
1 | 1:10 | No/No | LVTTL | CMOS, TTL | 100MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 450MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione2.448 |
|
1 | 1:2 | Yes/Yes | CML, eHSTL, HSTL, LVDS, LVEPECL, LVPECL, LVTTL | LVDS | 450MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 1:10 233MHZ 48TSSOP
|
pacchetto: 48-TFSOP (0.240", 6.10mm Width) |
Azione6.192 |
|
1 | 1:10 | No/Yes | Clock | SSTL-2 | 233MHz | 2.3 V ~ 2.7 V | 0°C ~ 85°C | Surface Mount | 48-TFSOP (0.240", 6.10mm Width) | 48-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:1 2.5GHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione3.248 |
|
1 | 1:1 | Yes/Yes | CML, LVDS, LVPECL | ECL, LVPECL | 2.5GHz | 2.375 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 8:8 80MHZ 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione6.880 |
|
1 | 8:8 | Yes/Yes | 3-State | LVTTL | 80MHz | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 1:10 650MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione3.056 |
|
1 | 1:10 | No/No | LVCMOS | AVCMOS | 650MHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Diodes Incorporated |
IC CLK BUFFER 2:4 266MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione5.744 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL | LVPECL | 266MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 2:9 500MHZ 32TQFP
|
pacchetto: 32-TQFP |
Azione2.224 |
|
1 | 2:9 | Yes/Yes | HSTL, LVPECL | HSTL | 500MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 2:4 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione6.176 |
|
1 | 2:4 | Yes/Yes | ECL, PECL | ECL, PECL | - | 4.75 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Texas Instruments |
IC CLK BUFFER 1:8 80MHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione20.904 |
|
1 | 1:8 | No/No | TTL | TTL | 80MHz | 4.75 V ~ 5.25 V | 0°C ~ 70°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microsemi Corporation |
IC CLK BUFF MUX 2:8 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione5.120 |
|
1 | 2:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
ON Semiconductor |
IC CLK MULTIPLEXR 2:1 7GHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione3.056 |
|
1 | 2:1 | Yes/Yes | CML, LVDS, LVPECL | CML | 7GHz | 1.71 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Microsemi Corporation |
IC CLK BUFFER 1:6 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione5.936 |
|
1 | 1:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Diodes Incorporated |
IC CLK BUFFER 1:7 150MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione22.944 |
|
1 | 1:7 | No/No | CMOS, TTL | CMOS, TTL | 150MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.536 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Texas Instruments |
IC CLK BUFFER 2:2 75MHZ 8WSON
|
pacchetto: 8-WFDFN Exposed Pad |
Azione7.584 |
|
1 | 2:2 | No/No | Clock | Clock | 75MHz | 2.4 V ~ 5 V | -40°C ~ 85°C | Surface Mount | 8-WFDFN Exposed Pad | 8-WSON (3x3) |
||
Diodes Incorporated |
CLOCK BUFFER TSSOP-16
|
pacchetto: - |
Azione4.752 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Diodes Incorporated |
IC CLOCK BUFFER MUX 2:10 32TQFP
|
pacchetto: 32-TQFP |
Azione7.044 |
|
1 | 2:10 | Yes/Yes | CML, LVDS, LVPECL, SSTL | LVPECL | 1.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 1:4 2.1GHZ 16VFQFPN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione6.108 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL, SSTL | ECL, LVPECL | 2.1GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFPN (3x3) |
||
Diodes Incorporated |
IC CLOCK BUFFER 2:4 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione6.180 |
|
1 | 2:4 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVPECL | 1.5GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Silicon Labs |
2:10 LVDS BUFFER (1.25GHZ), 2:1
|
pacchetto: 32-VFQFN Exposed Pad |
Azione17.052 |
|
1 | 2:10 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | CML, HCSL, LVCMOS, LVDS, LVPECL | 12.5GHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 156MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione15.708 |
|
1 | 1:2 | No/No | CMOS | 3-State, CMOS | 156MHz | 3 V ~ 5.5 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 2:8 2GHZ 32MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione5.968 |
|
1 | 2:8 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Cypress Semiconductor Corp |
IC FANOUT BUFFER 32PLCC
|
pacchetto: - |
Request a Quote |
|
- | 1:8 | No/No | CMOS | CMOS | - | 4.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Renesas Electronics Corporation |
IC CLK BUFFER 4:4 3GHZ 24TSSOP
|
pacchetto: - |
Request a Quote |
|
1 | 4:4 | Yes/Yes | CML, LVDS, LVPECL | CML, LVDS, LVPECL | 3 GHz | 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 1:8 350MHZ 38TSSOP
|
pacchetto: - |
Request a Quote |
|
1 | 1:8 | Yes/Yes | LVDS, LVPECL, LVTTL | LVPECL | 350 MHz | 3.135V ~ 3.465V | 0°C ~ 70°C (TA) | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
Renesas Electronics Corporation |
8L30205I LVCMOS/LVTTL CLOCK BUFF
|
pacchetto: - |
Request a Quote |
|
1 | 2:5 | Yes/No | HCSL, LVCMOS, LVDS, LVPECL, LVTTL, Crystal | LVCMOS, LVTTL | 200 MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |