Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLOCK BUFFER 1:1 125MHZ DIE
|
pacchetto: Die |
Azione2.608 |
|
1 | 1:1 | No/Yes | Crystal | LVPECL | 125MHz | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | Die | Die |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTPX 8:1 2.5GHZ 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione3.728 |
|
1 | 8:1 | Yes/Yes | CML, LVDS, LVPECL, SSTL | LVDS | 2.5GHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 3GHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.688 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL, SSTL | ECL, LVPECL | 3GHz | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 27MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione9.540 |
|
1 | 1:4 | No/No | Clock, Crystal | Clock | 27MHz | 2.375 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 140MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione3.056 |
|
1 | 1:4 | No/No | LVTTL | Clock | 140MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
NXP |
IC CLK BUFFER 2:10 150MHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione6.432 |
|
1 | 2:10 | No/No | LVCMOS, LVTTL | CMOS | 150MHz | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 8:8 80MHZ 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione5.312 |
|
1 | 8:8 | Yes/Yes | 3-State | LVTTL | 80MHz | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 166MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.968 |
|
1 | 1:4 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 166MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ON Semiconductor |
IC CLK MULTI 1:6/1:3 3GHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione2.448 |
|
1 or 2 | 1:6, 1:3 | Yes/Yes | LVCMOS, LVPECL | LVPECL | 3GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
ON Semiconductor |
IC CLK BUFFER 2:4 266MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione7.984 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL, Crystal | LVPECL | 266MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Silicon Labs |
IC BUFFER/LEVEL XLATOR 1:3 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione7.152 |
|
2 | 1:3 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | CML, HCSL, LVCMOS, LVDS, LVPECL | 725MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Silicon Labs |
IC TRANSLATOR BUFF/LEVEL 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione4.128 |
|
1 | 2:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | CML, HCSL, LVCMOS, LVDS, LVPECL | 1.25GHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 700MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione7.440 |
|
1 | 1:4 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVDS | 700MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Diodes Incorporated |
CLOCK BUFFER TSSOP-16
|
pacchetto: - |
Azione2.736 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CLK BUFFER 16QFN
|
pacchetto: 16-WFQFN Exposed Pad |
Azione4.352 |
|
1 | 1:9 | No/No | LVCMOS | LVCMOS | 150MHz | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione6.256 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microsemi Corporation |
LOW SKEW, LOW ADDITIVE JITTER 2
|
pacchetto: - |
Azione5.984 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 2:4 1.5GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione13.536 |
|
1 | 2:4 | Yes/Yes | LVPECL | LVPECL | 1.5GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:9 1.6GHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione5.680 |
|
1 | 2:9 | Yes/Yes | CML, HCSL, LVDS, LVHSTL, LVPECL, SSTL | ECL, PECL | 1.6GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
Texas Instruments |
IC CLK BUFFER 2:10 1.1GHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione7.168 |
|
1 | 2:10 | Yes/Yes | LVDS | LVDS | 1.1GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
Texas Instruments |
IC CLK BUFFER 1:4 800MHZ 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione5.232 |
|
1 | 1:4 | Yes/Yes | CML, HSTL, LVDS, LVPECL, LVTTL, SSTL-2, VML | LVCMOS, LVPECL | 800MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-VQFN (4x4) |
||
ON Semiconductor |
IC CLK BUFFER 1:2 3GHZ 8TSSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione60.396 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, PECL | ECL, PECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione16.368 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 3GHz | 2.375 V ~ 2.635 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Cypress Semiconductor Corp |
IC ROBOCLOCK SKEW MGMT 44TQFP
|
pacchetto: - |
Azione6.528 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Texas Instruments |
3-GHZ 10-OUTPUT DIFFERENTIAL CLO
|
pacchetto: 48-WFQFN Exposed Pad |
Azione6.800 |
|
1 | 3:11 | Yes/Yes | CML, HCSL, HSTL, LVDS, LVPECL, SSTL, Crystal | HCSL, LVCMOS, LVDS, LVPECL | 3.1GHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 48-WFQFN Exposed Pad | 48-WQFN (7x7) |
||
Renesas Electronics Corporation |
IC CLK BUF 3:11 1.5GHZ 48VFQFPN
|
pacchetto: - |
Azione480 |
|
1 | 3:11 | Yes/Yes | HCSL, HSTL, LVDS, LVPECL, Crystal | HSCL, LVCMOS, LVDS, LVPECL | 1.5 GHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | 48-VFQFPN (7x7) |
||
Renesas Electronics Corporation |
IC CLK BUFFER 1:4 200MHZ 8VFQFN
|
pacchetto: - |
Request a Quote |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 200 MHz | 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN | 8-VFQFN (2x2) |
||
Renesas Electronics Corporation |
8P34S2108I DUAL 1:8 LVDS OUTPUT
|
pacchetto: - |
Request a Quote |
|
2 | 1:8 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVDS | 2 GHz | 1.71V ~ 1.89V | -40°C ~ 85°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | 48-VFQFPN (7x7) |