Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK MULTPLX
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione3.232 |
|
1 | 1:1 | No/Yes | Crystal | LVPECL | 170MHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 1:10 233MHZ 48TSSOP
|
pacchetto: 48-TFSOP (0.240", 6.10mm Width) |
Azione3.824 |
|
1 | 1:10 | No/Yes | Clock | SSTL-2 | 233MHz | 2.3 V ~ 2.7 V | 0°C ~ 85°C | Surface Mount | 48-TFSOP (0.240", 6.10mm Width) | 48-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:10 3GHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione3.632 |
|
1 | 2:10 | Yes/Yes | CML, LVDS, LVPECL, SSTL | ECL, LVPECL | 3GHz | 2.375 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 160MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione103.596 |
|
1 | 1:4 | No/No | CMOS | CMOS | 160MHz | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:9 135MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione6.624 |
|
1 | 1:9 | Yes/Yes | PECL | TTL | 135MHz | 4.75 V ~ 5.25 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione5.552 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:2 2.5GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione3.648 |
|
1 | 1:2 | Yes/Yes | CML, HSTL, LVDS, LVPECL | LVPECL | 2.5GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:2 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione52.116 |
|
1 | 1:2 | Yes/Yes | Clock | Clock | - | 3 V ~ 5.5 V | 0°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTIPLX 12:2 3GHZ 48LQFP
|
pacchetto: 48-LQFP |
Azione5.648 |
|
1 | 12:2 | Yes/Yes | HCSL, HSTL, LVDS, LVPECL, SSTL | LVDS | 3GHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
ON Semiconductor |
IC CLK BUFFER 1:9 750MHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione5.264 |
|
2 | 1:9 | Yes/Yes | HSTL, LVDS, LVPECL | HSTL | 750MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:16 200MHZ 28QSOP
|
pacchetto: 28-SSOP (0.154", 3.90mm Width) |
Azione5.904 |
|
1 | 1:16 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 200MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 28-SSOP (0.154", 3.90mm Width) | 28-QSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTIPLX 4:1 3GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione7.264 |
|
1 | 4:1 | Yes/Yes | CML, LVDS, LVPECL, SSTL | ECL, LVPECL | 3GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 166MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione2.112 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | 166MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 200MHZ 6DFN
|
pacchetto: 6-UFDFN Exposed Pad |
Azione2.464 |
|
1 | 1:2 | No/No | LVCMOS | LVCMOS | 200MHz | 1.62 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 6-UFDFN Exposed Pad | 6-DFN (1.3x2) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 166MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione5.424 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | 166MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
Diodes Incorporated |
CLOCK BUFFER QSOP-20
|
pacchetto: - |
Azione7.968 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Texas Instruments |
IC CLK BUFFER 1:4 60MHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione16.644 |
|
2 | 1:4 | No/No | TTL | CMOS | 60MHz | 4.5 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Texas Instruments |
IC CLK BUFFER 1:10 100MHZ 24SSOP
|
pacchetto: 24-SSOP (0.209", 5.30mm Width) |
Azione83.232 |
|
1 | 1:10 | No/No | LVTTL | LVTTL | 100MHz | 3 V ~ 3.6 V | -55°C ~ 125°C | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
ON Semiconductor |
IC CLK BUF 1:5 133.33MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.624 |
|
1 | 1:5 | No/No | CMOS | CMOS | 133.33MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:10 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione5.632 |
|
1 | 1:10 | No/No | LVCMOS | LVCMOS | 200MHz | 1.71 V ~ 3.465 V | -40°C ~ 105°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:12 250MHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione7.140 |
|
1 | 1:12 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 250MHz | 1.6 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 2GHZ 16VFQFPN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione7.408 |
|
1 | 2:4 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 2GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:12 1GHZ 44MLF
|
pacchetto: 44-VFQFN Exposed Pad, 44-MLF? |
Azione13.860 |
|
1 | 2:12 | Yes/Yes | CML, CMOS, HSTL, LVDS, LVPECL, TTL | LVDS | 1GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 44-VFQFN Exposed Pad, 44-MLF? | 44-MLF? (7x7) |
||
Intersil |
100163 - MULTIPLEXER, 100K SERIE
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Analog Devices Inc./Maxim Integrated |
IC CLK DATA DRVR 1:1 3GHZ 8SOIC
|
pacchetto: - |
Request a Quote |
|
1 | 1:1 | Yes/Yes | ECL, PECL, LVECL, LVPECL | ECL, PECL, LVECL, LVPECL | 3 GHz | 3V ~ 5.5V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Renesas Electronics Corporation |
IC CLK BUF 1:2 1.2GHZ 16VFQFPN
|
pacchetto: - |
Request a Quote |
|
1 | 1:2 | Yes/Yes | CML, LVDS | LVDS | 1.2 GHz | 1.71V ~ 1.89V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFPN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:2 250MHZ 16VQFN
|
pacchetto: - |
Request a Quote |
|
1 | 1:2 | Yes/Yes | HCSL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 16-VFQFN Exposed Pad | 16-VQFN (3x3) |
||
Quality Semiconductor |
LOW SKEW CLOCK DRIVER/BUFFER
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - |