Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Silego Technology |
A 5-OUTPUT GREENCLK. 12 MHZ, 2X
|
pacchetto: - |
Azione7.168 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 350MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione6.864 |
|
1 | 2:4 | Yes/No | HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, LVTTL, SSTL | LVCMOS, LVTTL | 350MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
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IDT, Integrated Device Technology Inc |
IC CLK MULTPX 2:6 250MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione2.160 |
|
1 | 2:6 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 250MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 100MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione3.040 |
|
1 | 1:10 | No/No | LVTTL | CMOS, TTL | 100MHz | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione3.952 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.75 V ~ 5.25 V | 0°C ~ 70°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:3 2GHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.216 |
|
2 | 1:3 | Yes/Yes | CML, LVDS, LVPECL, SSTL | ECL, LVPECL | 2GHz | 2.375 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:10 3GHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione4.816 |
|
1 | 2:10 | Yes/Yes | CML, LVDS, LVPECL, SSTL | ECL, LVPECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
Texas Instruments |
IC CLK BUFFER 1:10 100MHZ 24SOIC
|
pacchetto: 24-SOIC (0.295", 7.50mm Width) |
Azione3.792 |
|
1 | 1:10 | No/No | LVTTL | LVTTL, TRI-State | 100MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
||
Texas Instruments |
IC CLK BUFFER 1:6 100MHZ 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione57.960 |
|
1 | 1:6 | No/No | TTL | TTL | 100MHz | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
NXP |
IC CLK BUFFER 2:10 1.5GHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione4.400 |
|
1 | 2:10 | Yes/Yes | ECL, HSTL, PECL | PECL | 1.5GHz | 2.25 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 2:9 500MHZ 32TQFP
|
pacchetto: 32-TQFP |
Azione18.864 |
|
1 | 2:9 | Yes/Yes | HSTL, LVPECL | HSTL | 500MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:9 80MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione6.080 |
|
1 | 1:9 | Yes/Yes | PECL | TTL | 80MHz | 4.75 V ~ 5.25 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.000 |
|
1 | 1:2 | Yes/Yes | LVECL, LVPECL | LVECL, LVPECL | 3GHz | 2.375 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 8:8 80MHZ 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione5.120 |
|
1 | 8:8 | Yes/Yes | 3-State, TTL | TTL | 80MHz | 4.5 V ~ 5.5 V | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:24 200MHZ 48TQFP
|
pacchetto: 48-LQFP |
Azione5.616 |
|
1 | 2:24 | Yes/No | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVCMOS, LVTTL | 200MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:24 167MHZ 48TQFP
|
pacchetto: 48-LQFP |
Azione3.808 |
|
1 | 2:24 | Yes/No | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVCMOS | 167MHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 3:6 700MHZ 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione3.296 |
|
1 | 3:6 | Yes/Yes | HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, LVTTL, SSTL, Crystal | LVPECL | 700MHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
Silicon Labs |
IC TRANSLATOR BUFF/LEVEL 44QFN
|
pacchetto: 44-VFQFN Exposed Pad |
Azione2.016 |
|
1 | 2:10 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | CML, HCSL, LVCMOS, LVDS, LVPECL | 1.25GHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 44-VFQFN Exposed Pad | 44-QFN (7x7) |
||
Silicon Labs |
IC TRANSLATOR BUFF/LEVEL 44QFN
|
pacchetto: 44-VFQFN Exposed Pad |
Azione5.760 |
|
1 | 2:10 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | CML, HCSL, LVCMOS, LVDS, LVPECL | 725MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 44-VFQFN Exposed Pad | 44-QFN (7x7) |
||
Silicon Labs |
IC CLK BUFFER 1:9 220MHZ 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione3.472 |
|
1 | 1:9 | No/No | Clock | LVCMOS | 220MHz | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione4.384 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Diodes Incorporated |
IC CLK BUFFER 1:2 800MHZ 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.496 |
|
1 | 1:2 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 800MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTPX 2:1 900MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione5.488 |
|
2 | 2:1 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 900MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Diodes Incorporated |
IC CLK BUFFER 1:5 66MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione6.768 |
|
2 | 1:5 | No/No | CMOS, TTL | CMOS | 66MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 1:10 1.5GHZ 32TQFP
|
pacchetto: 32-TQFP |
Azione6.432 |
|
1 | 1:10 | Yes/Yes | LVDS | LVDS | 1.5GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Renesas Electronics Corporation |
IC CLK BUFFER 1:4 200MHZ 8VFQFN
|
pacchetto: - |
Azione12.000 |
|
1 | 1:4 | No/No | Clock | Clock | 200 MHz | 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 105°C (TA) | Surface Mount | 8-UFDFN | 8-VFQFN (2x2) |
||
Analog Devices Inc./Maxim Integrated |
CLOCK AND DATA DRIVER
|
pacchetto: - |
Request a Quote |
|
1 | 2:5 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 1.5 GHz | 3V ~ 3.8V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Renesas Electronics Corporation |
IC CLK BUFFER 1:6 200MHZ 16QFN
|
pacchetto: - |
Request a Quote |
|
1 | 1:6 | No/No | Crystal | LVCMOS | 200 MHz | 1.71V ~ 3.465V | -40°C ~ 105°C (TA) | Surface Mount | 16-UFQFN | 16-QFN (2.5x2.5) |