Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Fairchild/ON Semiconductor |
IC CLK BUF 1:2/1:6 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione19.284 |
|
2 | 1:2, 1:6 | No/No | GTLP, LVTTL | GTLP, LVTTL | 175MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:4 160MHZ 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione2.384 |
|
1 | 1:4 | Yes/Yes | PECL | TTL | 160MHz | 4.75 V ~ 5.25 V | 0°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
ON Semiconductor |
IC CLK BUFFER 1:2 3GHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.872 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, PECL | ECL, PECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ON Semiconductor |
IC CLK BUFFER 2:8 900MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione3.904 |
|
1 | 2:8 | Yes/Yes | ECL, PECL | ECL, PECL | 900MHz | 4.2 V ~ 5.7 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 8:8 80MHZ 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione8.400 |
|
1 | 8:8 | Yes/Yes | 3-State, TTL | TTL | 80MHz | 4.5 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Microchip Technology |
IC CLK BUFFER 2:12 1GHZ 44MLF
|
pacchetto: 44-VFQFN Exposed Pad, 44-MLF? |
Azione5.536 |
|
1 | 2:12 | Yes/Yes | CML, CMOS, HSTL, LVDS, LVPECL, TTL | LVDS | 1GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 44-VFQFN Exposed Pad, 44-MLF? | 44-MLF? (7x7) |
||
ON Semiconductor |
IC CLK BUFFER 2:10 2GHZ 52QFN
|
pacchetto: 52-VFQFN |
Azione4.736 |
|
1 | 2:10 | Yes/Yes | CML, LVCMOS, LVDS, LVPECL, LVTTL | LVPECL | 2GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 52-VFQFN | 52-QFN (8x8) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 266MHZ 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione6.416 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL, Crystal | LVCMOS, LVPECL | 266MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:8 266MHZ 28TSSOP
|
pacchetto: 28-TSSOP (0.173", 4.40mm Width) |
Azione7.520 |
|
1 | 2:8 | No/Yes | LVCMOS, LVTTL, Crystal | LVPECL | 266MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 28-TSSOP (0.173", 4.40mm Width) | 28-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:10 16MHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione5.200 |
|
1 | 2:10 | Yes/Yes | LVDS, LVPECL | LVDS | 16MHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 13.4MHZ 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione4.080 |
|
1 | 2:4 | No/Yes | LVCMOS, Sine Wave | LVDS | 13.4MHz | 2.25 V ~ 2.75 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Diodes Incorporated |
CLOCK SAW OSCILLATOR SEAM7050
|
pacchetto: - |
Azione2.128 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Diodes Incorporated |
IC CLK BUFFER 1:5 150MHZ 16QSOP
|
pacchetto: 16-SSOP (0.154", 3.90mm Width) |
Azione4.896 |
|
1 | 1:5 | No/No | CMOS, TTL | CMOS, TTL | 150MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 16-SSOP (0.154", 3.90mm Width) | 16-QSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 133MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione4.960 |
|
1 | 1:10 | No/No | Clock | TTL | 133MHz | 1.425 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
Silicon Labs |
2:10 LVPECL BUFFER (200MHZ), 2:1
|
pacchetto: 32-VFQFN Exposed Pad |
Azione7.888 |
|
1 | 2:10 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 200MHz | 2.38 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:1 200MHZ 16QFN
|
pacchetto: 16-WFQFN Exposed Pad |
Azione6.816 |
|
1 | 1:1 | No/No | LVCMOS, Sine Wave | LVCMOS | 200MHz | 2.5 V ~ 3.3 V | 0°C ~ 70°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Diodes Incorporated |
CLOCK BUFFER TSSOP-28
|
pacchetto: - |
Azione7.856 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
ON Semiconductor |
IC CLK BUFFER 2:10 3GHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione262.560 |
|
1 | 2:10 | Yes/Yes | ECL, HSTL, LVDS, PECL | ECL, PECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
ON Semiconductor |
IC CLK BUFFER 1:4 180MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.520 |
|
1 | 1:4 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 180MHz | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Texas Instruments |
LOW SKEW MULTIPLEXED FANOUT BUFF
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione3.312 |
|
- | - | - | - | - | - | - | - | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 700MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione17.424 |
|
1 | 1:4 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVDS | 700MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLOCK MANANGEMENT
|
pacchetto: - |
Azione6.384 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
MULTIMKT-TIMING
|
pacchetto: 10-WFDFN Exposed Pad |
Azione4.768 |
|
1 | 1:3 | No/No | LVCMOS | LVCMOS | 200MHz | 1.71 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 10-WFDFN Exposed Pad | 10-DFN (2x2) |
||
IDT, Integrated Device Technology Inc |
IC TIMING CLOCK
|
pacchetto: - |
Azione6.016 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Analog Devices Inc./Maxim Integrated |
IC CLK BUFFER 1:5 1GHZ 32LQFP
|
pacchetto: - |
Request a Quote |
|
2 | 1:5 | Yes/Yes | LVPECL | LVDS | 1 GHz | 2.375V ~ 2.625V, 3V ~ 3.6V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
Renesas Electronics Corporation |
IC CLK BUFFER 1:5 200MHZ 8SOIC
|
pacchetto: - |
Azione66 |
|
1 | 1:5 | No/No | LVCMOS | LVCMOS | 200 MHz | 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Renesas Electronics Corporation |
IC CLK BUFFER 2:8 200MHZ 16TSSOP
|
pacchetto: - |
Azione7.470 |
|
1 | 2:8 | No/No | LVCMOS | LVCMOS | 200 MHz | 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 105°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Diodes Incorporated |
IC CLK BUFFER 1:6 200MHZ 40TQFN
|
pacchetto: - |
Request a Quote |
|
1 | 1:6 | Yes/Yes | CMOS, HCSL | HCSL | 200 MHz | 1.7V ~ 1.9V | -40°C ~ 85°C (TA) | Surface Mount | 40-WFQFN Exposed Pad | 40-TQFN (3x6) |