Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 128K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione5.296 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 128K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione3.408 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 128K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione7.792 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 128K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione3.648 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 128K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione6.128 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 8K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione5.312 |
|
EEPROM | EEPROM | 8Kb (256 x 8 x 4) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 8K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione2.080 |
|
EEPROM | EEPROM | 8Kb (256 x 8 x 4) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 8K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione5.424 |
|
EEPROM | EEPROM | 8Kb (256 x 8 x 4) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 8K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione2.048 |
|
EEPROM | EEPROM | 8Kb (256 x 8 x 4) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 8K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione5.680 |
|
EEPROM | EEPROM | 8Kb (256 x 8 x 4) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 8K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione6.880 |
|
EEPROM | EEPROM | 8Kb (256 x 8 x 4) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 8K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione5.232 |
|
EEPROM | EEPROM | 8Kb (256 x 8 x 4) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 8K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione5.120 |
|
EEPROM | EEPROM | 8Kb (256 x 8 x 4) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 8K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione2.128 |
|
EEPROM | EEPROM | 8Kb (256 x 8 x 4) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 8K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione2.288 |
|
EEPROM | EEPROM | 8Kb (256 x 8 x 4) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 8K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione5.760 |
|
EEPROM | EEPROM | 8Kb (256 x 8 x 4) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 4K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione5.568 |
|
EEPROM | EEPROM | 4Kb (256 x 8 x 2) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 4K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione2.128 |
|
EEPROM | EEPROM | 4Kb (256 x 8 x 2) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 4K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione4.048 |
|
EEPROM | EEPROM | 4Kb (256 x 8 x 2) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 4K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione4.896 |
|
EEPROM | EEPROM | 4Kb (256 x 8 x 2) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 4K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione6.864 |
|
EEPROM | EEPROM | 4Kb (256 x 8 x 2) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 4K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione3.184 |
|
EEPROM | EEPROM | 4Kb (256 x 8 x 2) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 2K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione5.904 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 2K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione7.328 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 2K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione6.288 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 2K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione6.448 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 2K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione5.184 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 2K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione3.712 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |