Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 512K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione7.952 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 512K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione7.152 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 512K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione3.600 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 512K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione2.528 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 512K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione3.968 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 512K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione4.016 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 512K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione6.256 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 32K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione2.880 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I²C | 400kHz | 5ms | 900ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 32K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione4.640 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I²C | 400kHz | 5ms | 900ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 32K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione7.616 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I²C | 400kHz | 5ms | 900ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 32K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione5.568 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I²C | 400kHz | 5ms | 900ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 32K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione4.768 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I²C | 400kHz | 5ms | 900ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 32K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione7.328 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I²C | 400kHz | 5ms | 900ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 256K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione6.496 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 256K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione5.088 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 256K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione5.936 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 256K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione5.344 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 256K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione4.832 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 256K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione6.336 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 16K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione3.264 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 16K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione5.136 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 16K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione6.224 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 16K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione5.344 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 16K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione3.696 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 16K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione4.688 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 16K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione5.360 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 128K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione4.032 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 128K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione7.024 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |