Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 16K I2C 1MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione13.932 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I²C | 1MHz | 5ms | 450ns | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
1.6-5.5V, 1MHZ, IND TMP, 8-UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione29.796 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I²C | 1MHz | 5ms | 450ns | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 4K SPI 20MHZ 8UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione134.550 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 16K I2C 1MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione14.574 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I²C | 1MHz | 5ms | 450ns | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 2K SPI 2MHZ 8UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione148.272 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 2MHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 2K SPI 20MHZ 8UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione130.584 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 1K SPI 20MHZ 8UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione160.458 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | SPI | 20MHz | 5ms | 900ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 16K I2C 1MHZ 8UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione150.552 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I²C | 1MHz | 5ms | 550ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 16K I2C 1MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione21.594 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I²C | 1MHz | 5ms | 450ns | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 4K SPI 2MHZ 8UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione142.434 |
|
EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 2MHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 1K I2C 125KHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione27.420 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I²C, Single Wire | 125kHz | 5ms | - | 2.7 V ~ 4.5 V | -40°C ~ 85°C (TC) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 1K I2C 125KHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione28.638 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I²C, Single Wire | 125kHz | 5ms | - | 1.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 2K I2C 1MHZ 8UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione152.508 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I²C | 1MHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 8K I2C 1MHZ 8UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione137.880 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I²C | 1MHz | 5ms | 550ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 1K I2C 1MHZ 8UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione143.256 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I²C | 1MHz | 5ms | 550ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 16K I2C 1MHZ 8UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione126.360 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I²C | 1MHz | 5ms | 450ns | 1.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione3.712 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 1M PARALLEL 32CDIP
|
pacchetto: 32-CDIP (0.600", 15.24mm) Window |
Azione3.248 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 32-CDIP (0.600", 15.24mm) Window | 32-CDIP |
||
Microchip Technology |
IC EEPROM 1M PARALLEL 32CDIP
|
pacchetto: 32-CDIP (0.600", 15.24mm) Window |
Azione7.728 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 32-CDIP (0.600", 15.24mm) Window | 32-CDIP |
||
Microchip Technology |
IC EEPROM 256K PARALLEL 28CDIP
|
pacchetto: 28-CDIP (0.600", 15.24mm) |
Azione3.744 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP |
||
Microchip Technology |
IC EEPROM 1MBIT 150NS 44CLCC
|
pacchetto: 44-CLCC |
Azione4.752 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 44-CLCC | 44-CLCC (16.54x16.54) |
||
Microchip Technology |
IC EEPROM 1MBIT 120NS 44CLCC
|
pacchetto: 44-CLCC |
Azione6.880 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 44-CLCC | 44-CLCC (16.54x16.54) |
||
Microchip Technology |
IC EEPROM 1M PARALLEL 32CDIP
|
pacchetto: 32-CDIP (0.600", 15.24mm) Window |
Azione6.752 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 32-CDIP (0.600", 15.24mm) Window | 32-CDIP |
||
Microchip Technology |
IC EEPROM 1M PARALLEL 32CDIP
|
pacchetto: 32-CDIP (0.600", 15.24mm) Window |
Azione4.688 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 200ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 32-CDIP (0.600", 15.24mm) Window | 32-CDIP |
||
Microchip Technology |
IC EEPROM 1M PARALLEL 32CDIP
|
pacchetto: 32-CDIP (0.600", 15.24mm) Window |
Azione4.544 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 32-CDIP (0.600", 15.24mm) Window | 32-CDIP |
||
Microchip Technology |
IC EEPROM 1MBIT 150NS 44CLCC
|
pacchetto: 44-CLCC |
Azione2.768 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 44-CLCC | 44-CLCC (16.54x16.54) |
||
Microchip Technology |
IC EEPROM 1MBIT 120NS 44CLCC
|
pacchetto: 44-CLCC |
Azione2.720 |
|
EEPROM | EEPROM | 1Mb (128K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 44-CLCC | 44-CLCC (16.54x16.54) |
||
Microchip Technology |
IC EEPROM 256K PARALLEL 28CDIP
|
pacchetto: 28-CDIP (0.600", 15.24mm) |
Azione7.104 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 90ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP |