Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 16K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione5.280 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I²C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 16K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione6.800 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I²C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 16K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione7.472 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I²C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 4K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione3.488 |
|
EEPROM | EEPROM | 4Kb (256 x 8 x 2) | I²C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 4K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione5.008 |
|
EEPROM | EEPROM | 4Kb (256 x 8 x 2) | I²C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 4K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione7.888 |
|
EEPROM | EEPROM | 4Kb (256 x 8 x 2) | I²C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 2K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione4.928 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I²C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 2K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione6.000 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I²C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione3.024 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I²C | 400kHz | 5ms | 3500ns | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione2.768 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I²C | 400kHz | 5ms | 3500ns | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione5.472 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I²C | 400kHz | 5ms | 3500ns | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 1K I2C 400KHZ 8SOIC
|
pacchetto: Die |
Azione5.248 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I²C | 400kHz | 5ms | 3500ns | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 128 I2C 400KHZ WAFER
|
pacchetto: Die |
Azione2.496 |
|
EEPROM | EEPROM | 128b (16 x 8) | I²C | 400kHz | 4ms | 3500ns | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 128 I2C 400KHZ WAFER
|
pacchetto: Die |
Azione6.464 |
|
EEPROM | EEPROM | 128b (16 x 8) | I²C | 400kHz | 4ms | 3500ns | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 128 I2C 400KHZ 8SOIC
|
pacchetto: Die |
Azione5.968 |
|
EEPROM | EEPROM | 128b (16 x 8) | I²C | 400kHz | 4ms | 3500ns | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 64K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione6.128 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 64K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione6.336 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 64K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione4.016 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 64K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione5.232 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 64K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione3.568 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 64K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione2.576 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 64K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione5.760 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 512K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione4.224 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 512K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione3.296 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 512K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione2.032 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 512K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione3.680 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 512K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione3.040 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 512K I2C 400KHZ WAFER
|
pacchetto: Die |
Azione7.088 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |