Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 1K SGL WIRE 4CSP
|
pacchetto: Die |
Azione2.624 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | Single Wire | 100kHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Microchip Technology |
IC EEPROM 512K I2C 8VFBGA
|
pacchetto: 8-VFBGA |
Azione4.400 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VFBGA | 8-VFBGA (2.35x3.73) |
||
Microchip Technology |
IC EEPROM 512K I2C 8VFBGA
|
pacchetto: 8-VFBGA |
Azione4.128 |
|
EEPROM | EEPROM | 512Kb (64K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VFBGA | 8-VFBGA (2.35x3.73) |
||
Microchip Technology |
IC EEPROM 8K I2C 1MHZ 4WLCSP
|
pacchetto: 4-XFBGA |
Azione6.000 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I²C | 1MHz | 5ms | 4.5µs | 1.7 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 4-XFBGA | 4-WLCSP (2x2) |
||
Microchip Technology |
IC EEPROM 64K PARALLEL 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione13.878 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC EPROM 1M PARALLEL 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione19.932 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 90ns | 2.7 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EPROM 2M PARALLEL 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione14.496 |
|
EPROM | EPROM - OTP | 2Mb (256K x 8) | Parallel | - | - | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EPROM 1M PARALLEL 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione20.952 |
|
EPROM | EPROM - OTP | 1Mb (128K x 8) | Parallel | - | - | 45ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 256K SPI 20MHZ 8UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione150.684 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
128 KBIT I2C SERIAL EEPROM WITH
|
pacchetto: 4-XFBGA, CSPBGA |
Azione39.600 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I²C | 1MHz | 5ms | 450ns | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 4-XFBGA, CSPBGA | 4-CSP |
||
Microchip Technology |
128 KBIT I2C SERIAL EEPROM WITH
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione21.192 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I²C | 1MHz | 5ms | 450ns | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
128 KBIT I2C SERIAL EEPROM WITH
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione19.956 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I²C | 1MHz | 5ms | 450ns | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
128 KBIT I2C SERIAL EEPROM WITH
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione21.042 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I²C | 1MHz | 5ms | 450ns | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 64K I2C 1MHZ 4CSP
|
pacchetto: 4-XFBGA, CSPBGA |
Azione38.568 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I²C | 1MHz | 5ms | 450ns | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 4-XFBGA, CSPBGA | 4-CSP |
||
Microchip Technology |
IC EEPROM 64K I2C 1MHZ 4CSP
|
pacchetto: 4-XFBGA, WLCSP |
Azione52.938 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I²C | 1MHz | 5ms | 450ns | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 4-XFBGA, WLCSP | 4-WLCSP |
||
Microchip Technology |
IC EEPROM 32K SPI 20MHZ 8UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione139.038 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 128K I2C 1MHZ 8UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione155.598 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | I²C | 1MHz | 5ms | 550ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 64K I2C 1MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione23.640 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I²C | 1MHz | 5ms | 450ns | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 64K I2C 1MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione13.314 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I²C | 1MHz | 5ms | 450ns | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
1.6-5.5V, 1MHZ, IND TMP, 8-UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione26.214 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I²C | 1MHz | 5ms | 450ns | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 4K I2C 1MHZ 8UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione150.138 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I²C | 1MHz | 5ms | - | 1.7 V ~ 3.6 V | -20°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 16K SPI 20MHZ 8UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione154.692 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 32K I2C 1MHZ SOT23-5
|
pacchetto: SC-74A, SOT-753 |
Azione22.884 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I²C | 1MHz | 5ms | 450ns | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | SC-74A, SOT-753 | SOT-23-5 |
||
Microchip Technology |
IC EEPROM 32K I2C 1MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione16.026 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I²C | 1MHz | 5ms | 450ns | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 8K SPI 20MHZ 8UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione145.920 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 20MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 32K I2C 1MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione12.510 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I²C | 1MHz | 5ms | 450ns | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
1.6-5.5V, 1MHZ, IND TMP, 8-UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione28.356 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I²C | 1MHz | 5ms | 450ns | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 64K I2C 1MHZ 8UDFN
|
pacchetto: 8-UFDFN Exposed Pad |
Azione142.644 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I²C | 1MHz | 5ms | 450ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |