Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
IC CONFIG DEVICE 100QFP
|
pacchetto: 100-BQFP |
Azione3.424 |
|
8MB | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (14x20) |
||
Xilinx Inc. |
IC PROM SERIAL CONFIG 2M 44-PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione6.992 |
|
2Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC FPGA 512K CONFIG MEM 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione2.928 |
|
512kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM FLASH 32MBIT 44-PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione4.880 |
|
32Mb | 2.97 V ~ 3.63 V | 0°C ~ 70°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC FLASH CONFIG 8M 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione5.888 |
|
8Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC FLASH CONFIG 4M 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione6.848 |
|
4Mb | 2.97 V ~ 3.63 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 512K 8LAP
|
pacchetto: 8-TDFN |
Azione6.672 |
|
512kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 128K 8LAP
|
pacchetto: 8-TDFN |
Azione3.568 |
|
128kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 1M 32TQFP
|
pacchetto: 32-TQFP |
Azione5.136 |
|
1Mb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 32-TQFP | 32-TQFP (7x7) |
||
Xilinx Inc. |
IC PROM SRL CONFIG 256K 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione3.584 |
|
256Kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 44-PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione5.200 |
|
4Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Xilinx Inc. |
IC PROM SER 1MBIT 3.3V 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.712 |
|
1Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM SER 5000 C-TEMP 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione12.144 |
|
150kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER I-TEMP 36K 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione12.300 |
|
36kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER I-TEMP 256K 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione5.008 |
|
256Kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SER I-TEMP 256K 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione4.240 |
|
256Kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC PROM SER CONF 2M 3.3V 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione6.464 |
|
2Mb | 3.15 V ~ 3.45 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Altera |
IC CONFIG DEVICE 1MBIT 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione31.380 |
|
1Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
QPRO FLASH PROM 32MBIT VOG48
|
pacchetto: 48-TFSOP (0.724", 18.40mm Width) |
Azione2.432 |
|
32Mb | 1.65 V ~ 2 V | -55°C ~ 125°C | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Xilinx Inc. |
IC PROM REPROGR 1MB 44-VQFP
|
pacchetto: 44-TQFP |
Azione61.440 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 44-TQFP | 44-VQFP (10x10) |
||
Altera |
IC CONFIG DEVICE 4MBIT 100QFP
|
pacchetto: 100-BQFP |
Azione48.948 |
|
4MB | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (14x20) |
||
Altera |
IC CONFIG DEVICE 16MBIT 100QFP
|
pacchetto: 100-BQFP |
Azione13.476 |
|
16Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (14x20) |
||
Altera |
IC CONFIG DEVICE 440KBIT 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione7.392 |
|
440kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 1M 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione11.616 |
|
1Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFG EEPROM 256K 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione6.576 |
|
256Kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Intel |
IC CONFIG DEVICE 32TQFP
|
pacchetto: 32-TQFP |
Azione2.100 |
|
440kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | -40°C ~ 85°C | 32-TQFP | 32-TQFP (7x7) |
||
Intel |
IC CONFIG DEVICE 16MBIT 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione191.292 |
|
16Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Intel |
IC QUAD-SERIAL CONFIG DEVICE 512
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione5.936 |
|
512Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |