Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
IC CONFIG DEVICE 100QFP
|
pacchetto: 100-BQFP |
Azione5.712 |
|
16Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (14x20) |
||
Xilinx Inc. |
IC PROM SERIAL 256K 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione2.880 |
|
256Kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC FPGA 1M CONFIG MEM 10MHZ 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione6.192 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC FLASH CONFIG 16M 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione3.648 |
|
16Mb | 2.97 V ~ 3.63 V | 0°C ~ 70°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC CONFIG SEEPROM 4M 3.3V 44TQFP
|
pacchetto: 44-TQFP |
Azione6.896 |
|
4Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 44-TQFP | 44-TQFP (10x10) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 64K 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione4.816 |
|
64kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC CONFIG SEEPROM 512K 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione6.544 |
|
512kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SRL CONFIG EEPROM 256K 8LAP
|
pacchetto: 8-TDFN |
Azione6.112 |
|
256Kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-TDFN | 8-LAP (6x6) |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 44-VQFP
|
pacchetto: 44-TQFP |
Azione32.016 |
|
4Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 44-TQFP | 44-VQFP (10x10) |
||
Xilinx Inc. |
IC PROM SER 4MBIT 3.3V 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione25.476 |
|
4Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SER 50000 C-TEMP 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione14.772 |
|
500kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM SER 300K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.624 |
|
300kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER 30000 C-TEMP 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione7.136 |
|
300kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM PROG I-TEMP 5V 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione4.624 |
|
200kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER C-TEMP 3.3V 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione169.584 |
|
65kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione6.480 |
|
65kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC 3V SER CFG PROM 128K 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.736 |
|
128kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Microchip Technology |
IC SRL CONFG EEPROM 512K 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione7.280 |
|
512kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SER CONFIG PROM 512K 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione4.192 |
|
512kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SERIAL CONFIG PROM 2M 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione4.448 |
|
2Mb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC EEPROM FPGA 256KB 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.120 |
|
256Kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SER CONFIG PROM 256K 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione6.144 |
|
256Kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC SERIAL CFG PROM 256K 20-PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione6.480 |
|
256Kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC MEM PROM 16MB 3.3V 44PIN
|
pacchetto: 44-CCC (J-Lead) |
Azione7.120 |
|
16Mb | 3 V ~ 3.6 V | -55°C ~ 125°C (TC) | 44-CCC (J-Lead) | 44-CCCP (16.51x16.51) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 256K 8-DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione79.800 |
|
256Kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Intel |
IC CONFIG DEVICE
|
pacchetto: 88-LFBGA |
Azione4.832 |
|
16Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 88-LFBGA | 88-UBGA (11x8) |
||
Intel |
IC CONFIG DEVICE 100QFP
|
pacchetto: 100-BQFP |
Azione7.312 |
|
16Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (20x14) |
||
Intel |
IC CONFIG DEVICE 212KBIT 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione6.576 |
|
212kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |