Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Maxim Integrated |
IC PLC MODEM OFDM BASED
|
pacchetto: 48-LQFP |
Azione4.848 |
|
UART | 1 | 2.7 V ~ 3.6 V | 7.4mA | - | -40°C ~ 85°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
Microsemi Corporation |
IC VOICEPORT 2CH FXS 8KHZ 80LQFP
|
pacchetto: 80-LQFP |
Azione5.984 |
|
PCM | 2 | - | - | - | - | Surface Mount | 80-LQFP | 80-eLQFP |
||
Microsemi Corporation |
IC LINE CARD LCAS 1CH 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione106.488 |
|
- | 1 | 4.5 V ~ 5.5 V | - | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Silicon Labs |
IC PROSLIC FXS WIDEB -110V 60QFN
|
pacchetto: 60-WFQFN Exposed Pad |
Azione4.832 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 60-WFQFN Exposed Pad | 60-QFN (8x8) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 2CH 100TQFP
|
pacchetto: 100-LQFP |
Azione3.808 |
|
LIU | 2 | 3.135 V ~ 3.465 V | 260mA | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
IXYS Integrated Circuits Division |
IC TONE DETECTOR PREC 22-DIP
|
pacchetto: 22-DIP (0.400", 10.16mm) |
Azione4.368 |
|
- | 1 | 2.7 V ~ 5.5 V | 15mA | - | -40°C ~ 85°C | Through Hole | 22-DIP (0.400", 10.16mm) | 22-DIP |
||
Maxim Integrated |
IC BUFFER RECEIVE T1 IND 28-PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione5.136 |
|
TDM | 1 | - | 5mA | - | 0°C ~ 70°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Maxim Integrated |
IC CONTROLLER E1 5V LP 44-PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione5.312 |
|
Parallel/Serial | - | 4.5 V ~ 5.5 V | 10mA | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
NXP |
IC C2K 1.2GHZ 16CH VOIP 625BGA
|
pacchetto: - |
Azione2.704 |
|
- | - | - | - | - | - | - | - | - |
||
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SW 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.744 |
|
- | 1 | 4.5 V ~ 5.5 V | 2mA | 10.5mW | -40°C ~ 110°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SW 20-SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.520 |
|
TTL | 1 | 4.5 V ~ 5.5 V | 2mA | 10.5mW | -40°C ~ 110°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
IXYS Integrated Circuits Division |
IC RELAY OPTO 120MA 8SMD
|
pacchetto: 8-SMD, Gull Wing |
Azione7.824 |
|
- | 2 | - | - | 800mW | -40°C ~ 85°C | Surface Mount | 8-SMD, Gull Wing | 8-SMD |
||
Broadcom Limited |
ETHERNET SWITCH 10GE
|
pacchetto: - |
Azione2.752 |
|
- | - | - | - | - | - | - | - | - |
||
Renesas Electronics America |
IC SLIC RINGING 3.3V VOB 32-QFN
|
pacchetto: 32-VQFN Exposed Pad |
Azione6.144 |
|
- | 1 | 3.3V | - | 305mW | 0°C ~ 85°C | Surface Mount | 32-VQFN Exposed Pad | 32-QFN (7x7) |
||
Microsemi Corporation |
TEMUX-84 WITH E3 MAPPERS, DS3/E3
|
pacchetto: 324-FBGA |
Azione2.640 |
|
E1, J1, T1 | - | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 324-FBGA | 324-PBGA (23x23) |
||
Microsemi Corporation |
TELECOM INTERFACE ICS 32 LINK
|
pacchetto: - |
Azione7.040 |
|
- | - | - | - | - | - | - | - | - |
||
Renesas Electronics America |
IC VDSL2 LINE DVR AMP 16QFN
|
pacchetto: 16-VQFN Exposed Pad |
Azione6.128 |
|
- | 2 | ±2.25 V ~ 6 V, 4.5 V ~ 12 V | 6mA | - | -45°C ~ 85°C | Surface Mount | 16-VQFN Exposed Pad | 16-QFN (4x4) |
||
Microchip Technology |
IC SLIC 1CH UNIV 100V 28QFN
|
pacchetto: - |
Azione2.000 |
|
Parallel | 1 | 3.3V | 40mA | - | - | - | - | - |
||
Microchip Technology |
ARROW-1X192
|
pacchetto: - |
Azione2.608 |
|
SFI-4 | - | 1.2V | - | - | - | Surface Mount | - | 1292-FCBGA |
||
Microchip Technology |
ARROW 2XGE PB FREE
|
pacchetto: 896-BGA |
Azione6.240 |
|
GMII, SerDes | 2 | 1.8V | - | - | -40°C ~ 85°C | Surface Mount | 896-BGA | 896-FCBGA |
||
Microchip Technology |
IC SLIC 1CH NGCC 28QFN 4X5
|
pacchetto: 28-VFQFN Exposed Pad |
Azione5.136 |
|
2-Wire | - | - | - | - | - | Surface Mount | 28-VFQFN Exposed Pad | 28-QFN |
||
Microchip Technology |
IC TXRX DTMF 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione7.040 |
|
- | 1 | 4.75V ~ 5.25V | 7mA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Lantiq |
SOCRATES SDFE 4 CHANNEL SYMMETRI
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
R-O-E FRONT-HAUL SWITCH 64 PORTS
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
CML Microcircuits |
IC TELECOM INTERFACE 48VQFN
|
pacchetto: - |
Azione738 |
|
C-Bus | 1 | 3V ~ 3.6V | 17.5mA | 1.75 W | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-VQFN (7x7) |
||
Microchip Technology |
11 PORT MANAGED SGMII ENTERPRISE
|
pacchetto: - |
Request a Quote |
|
SPI, UART, 2-Wire | 11 | - | - | 1.6 W | -40°C ~ 125°C | Surface Mount | 284-QFP | 284-TQFP (24x24) |
||
Broadcom Limited |
BACKHAUL ACCESS SWITCH. BLOWN
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
NETWORK TERMINATION CONTROLLER
|
pacchetto: - |
Request a Quote |
|
ISDN | 1 | - | - | - | - | Surface Mount | 64-QFP | P-MQFP-64 |