Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Corporation |
IC DIGITAL SWITCH 24K CH 484BGA
|
pacchetto: 484-BGA |
Azione4.880 |
|
- | 1 | 1.71 V ~ 1.89 V | 500mA | - | -40°C ~ 85°C | Surface Mount | 484-BGA | 484-PBGA (23x23) |
||
Microsemi Corporation |
IC DIGITAL SWITCH 12K CH 256BGA
|
pacchetto: 252-BGA |
Azione6.208 |
|
- | 1 | 1.71 V ~ 1.89 V | 240mA | - | -40°C ~ 85°C | Surface Mount | 252-BGA | 256-BGA (17x17) |
||
Microsemi Corporation |
IC CODEC 2CH VOSLAC SWT 44TQFP
|
pacchetto: 44-TQFP |
Azione37.200 |
|
PCM | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 44-TQFP | 44-TQFP (10x10) |
||
Silicon Labs |
IC PROSLIC FXS DTMF -110V 42QFN
|
pacchetto: 42-WFQFN Exposed Pad |
Azione5.712 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Silicon Labs |
IC PROSLIC LINE FEED 125V 40QFN
|
pacchetto: 40-VFQFN Exposed Pad |
Azione5.520 |
|
GCI, PCM, SPI | 2 | 3.3V | - | - | - | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (6x6) |
||
Maxim Integrated |
IC ELASTIC STORE T1/CEPT 16-SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione6.368 |
|
PCM | 1 | 4.5 V ~ 5.5 V | 9mA | - | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Maxim Integrated |
IC LIU 5V E1/T1/J1 144-BGA
|
pacchetto: 144-BBGA |
Azione9.672 |
|
LIU | - | 4.75 V ~ 5.25 V | 95mA | - | -40°C ~ 85°C | Surface Mount | 144-BBGA | 144-PBGA (17x17) |
||
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione4.048 |
|
- | 1 | 4.5 V ~ 5.5 V | 1.3mA | 10mW | -40°C ~ 110°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microsemi Corporation |
IC DIGITAL SWITCH 32K CH 484BGA
|
pacchetto: 484-BGA |
Azione2.960 |
|
- | 1 | 1.71 V ~ 1.89 V | 500mA | - | -40°C ~ 85°C | Surface Mount | 484-BGA | 484-PBGA (23x23) |
||
Exar Corporation |
IC LIU/FRAMER 28CHAN 568BGA
|
pacchetto: - |
Azione2.480 |
|
- | - | 3.3V | - | - | -40°C ~ 85°C | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC LINE INTERFACE UNIT 640BGA
|
pacchetto: 640-BGA Exposed Pad |
Azione4.336 |
|
E1, J1, T1 | 1 | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 640-BGA Exposed Pad | 640-PBGA-EP (31x31) |
||
Microsemi Corporation |
IC TRANSCODER QUAD ADPCM 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione2.688 |
|
- | 4 | 4.5 V ~ 5.5 V | 5mA | - | -40°C ~ 85°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microsemi Corporation |
IC SLIC 2CH UNIV 150V 48QFN
|
pacchetto: 56-VFQFN Exposed Pad |
Azione31.896 |
|
4-Wire | 2 | 3.135 V ~ 3.465 V | 25mA | - | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
Intersil |
IC LINE DRIVER VDSL2 DIFF 16QFN
|
pacchetto: 16-TQFN Exposed Pad |
Azione5.760 |
|
- | 1 | ±4 V ~ 6.6 V, 8 V ~ 13.2 V | - | - | -40°C ~ 85°C | Surface Mount | 16-TQFN Exposed Pad | 16-QFN (4x4) |
||
Maxim Integrated |
IC LIU 6PORT SMD
|
pacchetto: - |
Azione7.600 |
|
LIU | - | 1.8V, 3.3V | - | - | -40°C ~ 85°C | - | - | - |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
pacchetto: - |
Azione7.632 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
pacchetto: - |
Azione5.856 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
155 MBIT/S ATM AND PACKET-OVER-S
|
pacchetto: - |
Azione3.680 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
STRATAXGS LAYER 2 SWITCH W/HIG
|
pacchetto: - |
Azione6.848 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
10PRT UNMAN L2 SW W/8 INT CU PHY
|
pacchetto: 672-BGA |
Azione7.308 |
|
Serial | 1 | 1V | - | - | 0°C ~ 125°C | Surface Mount | 672-BGA | 672-HSBGA (27x27) |
||
Microchip Technology |
IC ETHERNET RGMII/RMII 68QFN
|
pacchetto: 68-VFQFN Exposed Pad |
Azione13.380 |
|
RMII | 1 | - | - | - | - | Surface Mount | 68-VFQFN Exposed Pad | 68-QFN (8x8) |
||
Infineon Technologies |
OCTAT-P OCTAL TRANSCEICER
|
pacchetto: - |
Request a Quote |
|
IOM-2, PCM | - | 4.75V ~ 5.25V | 20mA | - | 0°C ~ 70°C | Through Hole | 24-DIP (0.600", 15.24mm) | P-DIP-24 |
||
Infineon Technologies |
ISDN PRIMARY ACCESS TRANSCEICER
|
pacchetto: - |
Request a Quote |
|
ISDN | 1 | 4.75V ~ 5.25V | 190mA | - | 0°C ~ 70°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.48x11.48) |
||
Infineon Technologies |
NETWORK TERMINATION CONTROLLER
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Intersil |
TELECOM CIRCUIT, 1-FUNC, BIMOS
|
pacchetto: - |
Request a Quote |
|
- | 1 | 4.5V ~ 5.5V | - | - | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Agere Systems |
LUC4AC01 - ATM CROSSBAR ELEMENT
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Harris Corporation |
EIA/ITU PABX SLIC
|
pacchetto: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | -42V ~ -58V, 4.75V ~ 5.25V, 10.8V ~ 13.2V | - | 690 mW | 0°C ~ 75°C | Through Hole | 24-CDIP (0.600", 15.24mm) | 24-CERDIP |
||
Broadcom Limited |
IC,TK3715A EPON ONU TFBGA W/FEC
|
pacchetto: - |
Request a Quote |
|
Ethernet | - | - | - | - | - | - | - | - |