Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC SW CTRLR TANTOS-3G LFBGA-225
|
pacchetto: 225-LFBGA |
Azione5.776 |
|
TX / FX | 1 | 3.3V | - | - | - | Surface Mount | 225-LFBGA | PG-LFBGA-225 |
||
Microsemi Corporation |
IC SLIC 1CH UNIV 100V 48TQFP
|
pacchetto: - |
Azione6.800 |
|
Parallel | 1 | 3.3V | 40mA | - | - | - | - | - |
||
Microsemi Corporation |
IC TDM SWITCH 2K-CH ENH 256BGA
|
pacchetto: 256-BGA |
Azione5.072 |
|
- | 1 | 1.71 V ~ 1.89 V | 165mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Microsemi Corporation |
IC TXRX DTMF 3V 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.456 |
|
- | 1 | 2.7 V ~ 3.6 V | 3.1mA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CBSGA
|
pacchetto: 484-BGA |
Azione5.568 |
|
LIU | 1 | 3.135 V ~ 3.465 V | 150mA | - | -40°C ~ 85°C | Surface Mount | 484-BGA | 484-BGA (23x23) |
||
Cirrus Logic Inc. |
IC LIU DUAL T1/E1 64TQFP
|
pacchetto: 64-LQFP |
Azione41.472 |
|
E1, T1 | 2 | 4.75 V ~ 5.25 V | - | 310mW | -40°C ~ 85°C | Surface Mount | 64-LQFP | 64-TQFP |
||
ams |
IC TELEPHONE CMOS MULTIFU 28SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione4.048 |
|
- | 1 | 3.8 V ~ 5 V | 4mA | - | -25°C ~ 70°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Silicon Labs |
IC PROSLIC FXS DUAL -140V 50QFN
|
pacchetto: - |
Azione5.840 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | - | 50-QFN (6x8) |
||
Silicon Labs |
IC PROSLIC/CODEC DUAL 64TQFP
|
pacchetto: 64-TQFP |
Azione4.848 |
|
GCI, PCM, SPI | 2 | 3.3V, 5V | 65mA | 941mW | 0°C ~ 70°C | Surface Mount | 64-TQFP | 64-TQFP (10x10) |
||
Maxim Integrated |
IC TXRX E1 QUAD 5V 256BGA
|
pacchetto: 256-BGA |
Azione12.924 |
|
E1 | 4 | 5V | - | - | - | Surface Mount | 256-BGA | 256-BGA (27x27) |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/J1/E1 8CH 208-BGA
|
pacchetto: 208-BGA |
Azione6.192 |
|
LIU | - | 3.13 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 208-BGA | 208-PBGA (17x17) |
||
Microsemi Corporation |
IC TXRX DTMF 24SSOP
|
pacchetto: 24-SSOP (0.209", 5.30mm Width) |
Azione6.064 |
|
- | 1 | 4.75 V ~ 5.25 V | 7mA | - | -40°C ~ 85°C | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
Silicon Labs |
IC PROSLIC FXS ISI DTMF 48QFN
|
pacchetto: - |
Azione4.000 |
|
3-Wire, PCM | 2 | 3.3V | - | - | 0°C ~ 70°C | - | - | - |
||
Silicon Labs |
IC SYSTEM-SIDE DAA 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione422.856 |
|
DSP, Serial | 1 | 3 V ~ 3.6 V | 15mA | - | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microsemi Corporation |
IC FXS 1CH 100V BORSCHT 48QFN
|
pacchetto: 48-VQFN Exposed Pad |
Azione7.968 |
|
PCM | 1 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 48-VQFN Exposed Pad | 48-QFN (7x7) |
||
Microsemi Corporation |
IC SLIC 1CH NGCC 28QFN 4X5
|
pacchetto: 28-QFN |
Azione4.576 |
|
2-Wire | - | - | - | - | - | Surface Mount | 28-QFN | 28-QFN |
||
NXP |
CABLE FST DEMOD
|
pacchetto: - |
Azione7.024 |
|
- | - | - | - | - | - | - | - | - |
||
NXP |
CABLE FULL SPECTRUM TRANSCEIVER
|
pacchetto: - |
Azione4.832 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC ETHERNET RGMII/RMII 48-QFN
|
pacchetto: - |
Azione10.056 |
|
RMII | 1 | - | - | - | -40°C ~ 125°C | Surface Mount | - | 48-QFN (6x6) |
||
Microchip Technology |
IC SLIC 1CH UNIV 145V 48TQFP
|
pacchetto: - |
Azione5.600 |
|
Parallel | 1 | 3.3V | 40mA | - | - | - | - | - |
||
Microchip Technology |
IC VOICEPORT 2CH FXS 8KHZ 80LQFP
|
pacchetto: 80-LQFP |
Azione7.216 |
|
PCM | 2 | 4.75V ~ 35V | - | - | - | Surface Mount | 80-LQFP | 80-eLQFP |
||
Microchip Technology |
IC SLIC 1CH UNIV 100V 48QFN
|
pacchetto: 56-VFQFN Exposed Pad |
Azione3.776 |
|
4-Wire | 1 | 3.135V ~ 3.465V | 25mA | - | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
Texas Instruments |
320C6201 352PIN BGA REV3.1 FOR A
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
PCM INTERFACE CONTROLLER (PIC)
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Lantiq |
ISDN ST U INTERFACE, 192KBPS S/T
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Harris Corporation |
EIA/ITU PABX SLIC WITH 30MA LOOP
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
GX39420-QUAL
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Texas Instruments |
DIGITAL INTERFACE
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |