Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC NETWORK TERMINATOR MQFP-64
|
pacchetto: 64-QFP |
Azione5.712 |
|
ISDN | 1 | 3.3V | 30mA | - | -40°C ~ 85°C | Surface Mount | 64-QFP | P-64-MQFP |
||
Infineon Technologies |
IC SPEECH AND VOICE MQFP-44
|
pacchetto: 44-QFP |
Azione2.624 |
|
IOM-2, SCI | 1 | 5V | 97.5mA | - | - | Surface Mount | 44-QFP | P-MQFP-44 |
||
Microsemi Corporation |
IC TDM SWITCH 1K-CH ENH 256BGA
|
pacchetto: 256-BGA |
Azione7.440 |
|
- | 1 | 1.71 V ~ 1.89 V | 115mA | - | -45°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Microsemi Corporation |
IC DGTL SWITCH F16KDX 272BGA
|
pacchetto: 272-BGA |
Azione11.520 |
|
- | 1 | 3 V ~ 3.6 V | 160mA | - | -40°C ~ 85°C | Surface Mount | 272-BGA | 272-PBGA (27x27) |
||
Microsemi Corporation |
IC SLIC 1CH 60DB LGBAL 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione102.888 |
|
2-Wire | 1 | 4.75 V ~ 5.25 V | - | - | -40°C ~ 85°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Maxim Integrated |
IC FRAMER DUAL DS3/E3 144TCBGA
|
pacchetto: 144-BGA, CSPBGA |
Azione3.392 |
|
LIU | 2 | 3.135 V ~ 3.465 V | 155mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-CSPBGA (13x13) |
||
Exar Corporation |
IC LIU T1/E1/J1 QUAD 128TQFP
|
pacchetto: 128-LQFP |
Azione6.864 |
|
LIU | 4 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 128-LQFP | 128-TQFP (14x20) |
||
Exar Corporation |
IC FSK DEMOD/TONE DECOD 14SOIC
|
pacchetto: 14-SOIC (0.154", 3.90mm Width) |
Azione90.000 |
|
- | - | 4.5 V ~ 20 V | 5mA | 900mW | 0°C ~ 70°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/J1/E1 1CH 44-TQFP
|
pacchetto: 44-LQFP |
Azione5.152 |
|
LIU | - | 3.13 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 44-LQFP | 44-TQFP |
||
Microsemi Corporation |
IC CODEC A-LAW CCITT PCM 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione416.736 |
|
PCM | 1 | 4.75 V ~ 5.25 V | 3mA | - | 0°C ~ 70°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microsemi Corporation |
IC CODEC A-LAW CCITT PCM 18DIP
|
pacchetto: 18-DIP (0.300", 7.62mm) |
Azione5.808 |
|
PCM | 1 | 4.75 V ~ 5.25 V | 3mA | - | 0°C ~ 70°C | Through Hole | 18-DIP (0.300", 7.62mm) | 18-PDIP |
||
Microsemi Corporation |
IC RECEIVER DTMF 18SOIC
|
pacchetto: 18-SOIC (0.295", 7.50mm Width) |
Azione5.488 |
|
- | 1 | 4.75 V ~ 5.25 V | 3mA | - | -40°C ~ 85°C | Surface Mount | 18-SOIC (0.295", 7.50mm Width) | 18-SOIC |
||
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SW 28-SOIC
|
pacchetto: 28-SOIC (0.295", 7.50mm Width) |
Azione4.816 |
|
- | 1 | 4.5 V ~ 5.5 V | 2mA | 10.5mW | -40°C ~ 110°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microsemi Solutions Sdn Bhd. |
12 PORT GE PHY W/QSGMII MAC I/F
|
pacchetto: - |
Azione4.272 |
|
Ethernet | 1 | - | - | - | 0°C ~ 125°C | - | - | - |
||
Microsemi Corporation |
IC TXRX DTMF 24SSOP
|
pacchetto: 24-SSOP (0.209", 5.30mm Width) |
Azione6.528 |
|
- | 1 | 4.75 V ~ 5.25 V | 7mA | - | -40°C ~ 85°C | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
Renesas Electronics America |
IC SLIC UNIVERSAL LP 28-PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione2.192 |
|
- | 1 | 4.75 V ~ 5.25 V | 2.25mA | 1.5W | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microsemi Corporation |
ARROW-2X192
|
pacchetto: 1292-BGA, FCBGA |
Azione6.704 |
|
SFI-4 | - | 1.2V | - | - | - | Surface Mount | 1292-BGA, FCBGA | 1292-FCBGA |
||
Microchip Technology |
IC TDM SWITCH 2K-CH ENH 256BGA
|
pacchetto: 256-BGA |
Azione7.968 |
|
- | 1 | 1.71V ~ 1.89V | 165mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Microchip Technology |
IC SLIC 1CH SWREG 63DB 44TQFP
|
pacchetto: 44-TQFP |
Azione7.216 |
|
2-Wire | 1 | 4.75V ~ 5.25V | - | - | -40°C ~ 85°C | Surface Mount | 44-TQFP | 44-TQFP (10x10) |
||
Microchip Technology |
IC SYNCHRONIZER T1/E1 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione4.032 |
|
- | 1 | 4.5V ~ 5.5V | 60mA | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
Microchip Technology |
IC SLIC 1CH 40DB LGBAL 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione7.472 |
|
2-Wire | 1 | 4.75V ~ 5.25V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Microchip Technology |
1CH 100V MISLIC, 36QFN, T&R
|
pacchetto: - |
Azione3.600 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
10G XPON HGW
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
16*HG16 FABRIC
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Lantiq |
GEMINAX D8 MAX IS A 8 CHANNEL AD
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Cypress Semiconductor Corp |
TELECOM CIRCUIT, 1-FUNC, BICMOS,
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
XWAY AR7 HIGH-END SINGLE-CHIP AD
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Lantiq |
ISAC-S TE ISDN ACCESS CONTROLLER
|
pacchetto: - |
Request a Quote |
|
ISDN, SCI | 1 | 3.3V | 30mA | - | 0°C ~ 70°C | Surface Mount | 64-LQFP | PG-TQFP-64 |