Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Corporation |
IC LINE DRIVER 2CH ADSL+ 24QFN
|
pacchetto: 24-VQFN Exposed Pad |
Azione7.264 |
|
- | 2 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 24-VQFN Exposed Pad | 24-QFN (6x6) |
||
Microsemi Corporation |
IC LINE CARD LCAS 1CHIPLE 32QFN
|
pacchetto: 32-VQFN Exposed Pad |
Azione3.216 |
|
- | 1 | 4.5 V ~ 5.5 V | - | - | -40°C ~ 85°C | Surface Mount | 32-VQFN Exposed Pad | 32-QFN (8x8) |
||
Maxim Integrated |
IC MODULATOR DRVR 10GBPS 24-TQFN
|
pacchetto: 24-WFQFN Exposed Pad |
Azione4.464 |
|
- | 1 | -5.5 V ~ -4.9 V | 140mA | - | -40°C ~ 85°C | Surface Mount | 24-WFQFN Exposed Pad | 24-TQFN (4x4) |
||
Maxim Integrated |
IC LIU E1/T1/J1 3.3V 144-ELQFP
|
pacchetto: 144-LQFP Exposed Pad |
Azione2.896 |
|
LIU | 8 | 3.135 V ~ 3.465 V | 250mA | - | -40°C ~ 85°C | Surface Mount | 144-LQFP Exposed Pad | 144-LQFP-EP (20x20) |
||
Silicon Labs |
IC PROSLIC/CODEC DUAL 64TQFP
|
pacchetto: 64-TQFP |
Azione5.760 |
|
GCI, PCM, SPI | 2 | 3.3V, 5V | 65mA | 941mW | -40°C ~ 85°C | Surface Mount | 64-TQFP | 64-TQFP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/J1/E1 8CH 208-TQFP
|
pacchetto: 208-BFQFP |
Azione7.072 |
|
LIU | - | 3.13 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 208-BFQFP | 208-PQFP (28x28) |
||
Maxim Integrated |
IC FRAMER T1 4X4 16CH 300-BGA
|
pacchetto: 300-BBGA |
Azione3.264 |
|
Parallel/Serial | - | 2.97 V ~ 3.63 V | 300mA | - | -40°C ~ 85°C | Surface Mount | 300-BBGA | 300-PBGA (27x27) |
||
Texas Instruments |
IC CIRCUIT TIME SLOT 20-DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione219.144 |
|
Serial | 1 | - | 1mA | - | -25°C ~ 125°C | Through Hole | 20-DIP (0.300", 7.62mm) | 20-DIP |
||
NXP |
IC C2K 900MHZ 8CH VOIP 625FCBGA
|
pacchetto: - |
Azione4.528 |
|
- | - | - | - | - | - | - | - | - |
||
Silicon Labs |
IC PROSLIC FXS 1CH -136V 42QFN
|
pacchetto: 42-WFQFN Exposed Pad |
Azione5.040 |
|
- | - | - | - | - | - | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SW 16-SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione4.912 |
|
- | 1 | 4.5 V ~ 5.5 V | - | 10mW | -40°C ~ 110°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microsemi Corporation |
IC SLIC 2CH UNIV 145V 48QFN
|
pacchetto: - |
Azione2.144 |
|
Parallel | 2 | 3.3V | 40mA | - | - | - | - | - |
||
Silicon Labs |
IC PROSLIC PCM/SPI -140V 42QFN
|
pacchetto: 42-WFQFN Exposed Pad |
Azione5.088 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | 0°C ~ 70°C | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
IXYS Integrated Circuits Division |
IC PHONE LINE INTERFACE 32SOIC
|
pacchetto: 32-SOIC (0.295", 7.50mm Width) |
Azione77.520 |
|
- | 1 | 3 V ~ 5.5 V | 9mA | 1W | -40°C ~ 85°C | Surface Mount | 32-SOIC (0.295", 7.50mm Width) | 32-SOIC |
||
Microsemi Corporation |
IC ABS VOICEPORT 2CH 64QFN
|
pacchetto: 64-VFQFN Exposed Pad |
Azione142.140 |
|
PCM | 1 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 64-VFQFN Exposed Pad | 64-QFN (9x9) |
||
IXYS Integrated Circuits Division |
IC RELAY OPTO 120MA 8DIP
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione9.432 |
|
- | 2 | - | - | 800mW | -40°C ~ 85°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
Microsemi Solutions Sdn Bhd. |
IC ETHERNET RGMII/RMII 68QFN
|
pacchetto: - |
Azione6.696 |
|
RMII | 1 | - | - | - | -40°C ~ 125°C | Surface Mount | - | 68-QFN (8x8) |
||
Microsemi Corporation |
MODULE SONET/SDH
|
pacchetto: - |
Azione3.920 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
33 CHANNEL T1/E1 FRAMER
|
pacchetto: - |
Azione6.080 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC TIMING-OVER-PACKET 324BGA
|
pacchetto: 324-BGA |
Azione4.576 |
|
- | 1 | 3V ~ 3.6V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Microchip Technology |
IC DIGITAL SWITCH 16K CH 272BGA
|
pacchetto: 272-BBGA |
Azione5.088 |
|
- | 1 | 1.71V ~ 1.89V | 240mA | - | -40°C ~ 85°C | Surface Mount | 272-BBGA | 272-PBGA (27x27) |
||
Microchip Technology |
IC TXRX DTMF 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione7.088 |
|
- | 1 | 4.75V ~ 5.25V | 7mA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Broadcom Limited |
BACKHAUL ACCESS SWITCH. BLOWN
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Harris Corporation |
SLIC
|
pacchetto: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | -42V ~ -58V, 4.75V ~ 5.25V | - | 200 mW | 0°C ~ 75°C | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CERDIP |
||
Skyworks Solutions Inc. |
WIDEBAND DUAL FXS, ISI INTERFACE
|
pacchetto: - |
Request a Quote |
|
3-Wire, PCM, SPI | 2 | 3.13V ~ 3.47V | 51.71mA | - | 0°C ~ 70°C | Surface Mount | 68-VFQFN Exposed Pad | 68-QFN (8x8) |
||
Harris Corporation |
EIA/ITU PABX SLIC
|
pacchetto: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | -42V ~ -58V, 10.8V ~ 13.2V | - | 580 mW | 0°C ~ 75°C | Through Hole | 24-DIP (0.600", 15.24mm) | 24-PDIP |
||
Broadcom Limited |
VDSL 35B + 11AX WIFI INTEGRATED
|
pacchetto: - |
Request a Quote |
|
ADSL, DSL, USB | 1 | - | - | - | - | - | - | - |
||
Microchip Technology |
S/UNI-TETRA SATURN User Network
|
pacchetto: - |
Request a Quote |
|
Serial | 1 | 2.97V ~ 3.63V | 770mA | - | -40°C ~ 85°C | Surface Mount | 304-LBGA Exposed Pad | 304-SBGA (31x31) |