Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC CODEC VOIP 100-TQFP
|
pacchetto: 100-LQFP |
Azione4.688 |
|
ADPCM | 1 | - | - | - | - | Surface Mount | 100-LQFP | PG-TQFP-100 |
||
Infineon Technologies |
IC LINE INTERFACE SLIC PLCC-28
|
pacchetto: 28-LCC (J-Lead) |
Azione11.028 |
|
- | 1 | 5V | 2.8mA | 290mW | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | P/PG-LCC-28 |
||
Microsemi Corporation |
IC VOICEPORT 2CH SLAC ZSI 48QFN
|
pacchetto: - |
Azione4.944 |
|
4-Wire Serial | 2 | 3.3 V ~ 35 V | - | - | - | Surface Mount | - | 48-QFN |
||
Microsemi Corporation |
IC VOICEPORT 2CH SLAC ZSI 48QFN
|
pacchetto: - |
Azione2.736 |
|
4-Wire Serial | 2 | 3.3 V ~ 35 V | - | - | - | Surface Mount | - | 48-QFN |
||
Microsemi Corporation |
IC DGTL TELEPHONE CIRCUIT 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione2.912 |
|
- | 1 | 4.75 V ~ 5.25 V | 6mA | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC |
||
Microsemi Corporation |
IC SLIC 1CH P RV 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione6.784 |
|
2-Wire | - | 4.75 V ~ 5.25 V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Exar Corporation |
IC LIU SH T1/E1/J1 8CH 225BGA
|
pacchetto: 225-BGA |
Azione3.504 |
|
- | 8 | 3.14 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 225-BGA | 225-BGA (19x19) |
||
Maxim Integrated |
IC CONTROLLER T1 5V 44-PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione4.576 |
|
Parallel/Serial | - | 4.5 V ~ 5.5 V | 10mA | - | 0°C ~ 70°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Exar Corporation |
IC LIU SH T1/E1/J1 14CH 304TBGA
|
pacchetto: 304-LBGA |
Azione6.744 |
|
LIU | 14 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 304-LBGA | 304-TBGA (31x31) |
||
Microsemi Corporation |
IC TDM SWITCH 2K-CH ENH 256LQFP
|
pacchetto: 256-LQFP |
Azione7.344 |
|
- | 1 | 1.71 V ~ 1.89 V | 165mA | - | -40°C ~ 85°C | Surface Mount | 256-LQFP | 256-LQFP (28x28) |
||
NXP |
IC C2K 900MHZ 8CH VOIP 625FCBGA
|
pacchetto: - |
Azione5.072 |
|
- | - | - | - | - | - | - | - | - |
||
Maxim Integrated |
IC T1/E1/J1 64KCC ELEMENT 64LQFP
|
pacchetto: 64-LQFP |
Azione7.440 |
|
64KCC, E1, T1 | 1 | 3.14 V ~ 3.47 V | 150mA | - | -40°C ~ 85°C | Surface Mount | 64-LQFP | 64-LQFP (10x10) |
||
Silicon Labs |
IC FCC+ EMBEDDED DAA 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) Exposed Pad |
Azione43.728 |
|
- | 1 | - | 9mA | - | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) Exposed Pad | 8-SOIC-EP |
||
Microsemi Corporation |
IC SUBSCRIBER NETWRK DNIC 24SSOP
|
pacchetto: - |
Azione8.376 |
|
- | 1 | 4.75 V ~ 5.25 V | 10mA | - | -40°C ~ 85°C | Surface Mount | - | 24-SSOP |
||
Maxim Integrated |
IC LIU T1/E1/J1 3.3V 49-BGA
|
pacchetto: 49-LFBGA, CSPBGA |
Azione37.932 |
|
Serial | 1 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 49-LFBGA, CSPBGA | 49-CSBGA (7x7) |
||
Microsemi Corporation |
IC DGTL SWITCH ISO-CMOS 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione15.228 |
|
- | 1 | 4.75 V ~ 5.25 V | 6mA | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC |
||
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SW 44-TQFP
|
pacchetto: 44-TQFP |
Azione4.368 |
|
- | 1 | 4.75 V ~ 5.25 V | 1.6mA | - | -40°C ~ 110°C | Surface Mount | 44-TQFP | 44-TQFP (10x10) |
||
Microsemi Solutions Sdn Bhd. |
DUAL PORT GIGABIT DUAL MEDIA R/S
|
pacchetto: - |
Azione6.804 |
|
- | 1 | 1V | - | - | - | Surface Mount | - | 256-BGA (17x17) |
||
Microsemi Corporation |
33 LINK, 672 HDLC CHANNEL FRAME
|
pacchetto: - |
Azione6.600 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
pacchetto: 256-BGA |
Azione4.928 |
|
- | - | - | - | - | - | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Microchip Technology |
IC SLIC 1CH 8KHZ 150V HV 16SOIC
|
pacchetto: - |
Azione2.592 |
|
PCM | 1 | - | - | - | - | Surface Mount | - | 16-SOIC |
||
Microchip Technology |
IC TXRX DTMF 24SSOP
|
pacchetto: - |
Azione4.784 |
|
- | 1 | 4.75V ~ 5.25V | 7mA | - | -40°C ~ 85°C | Surface Mount | - | 24-SSOP |
||
Broadcom Limited |
48-PORT MULTI-GB ETHERNET ENT SW
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
63168V BASED VDSL IAD WITH 3X3 1
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
HIGH PERFORMANCE VDSL GATEWAY/RO
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Lantiq |
XWAY HIGH-END SINGLE-CHIP ADSL2/
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
HIGH PERFORMANCE VDSL2/ADSL2 ROU
|
pacchetto: - |
Request a Quote |
|
ADSL, DSL | 1 | - | - | - | - | - | - | - |
||
Infineon Technologies |
SLIC FILTER
|
pacchetto: - |
Request a Quote |
|
IOM-2, PCM | 2 | 3.135V ~ 3.465V | - | - | -40°C ~ 85°C | Surface Mount | 64-QFP | P-MQFP-64-1 |