Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK BUFFER 1:1 1MHZ
|
pacchetto: - |
Azione4.864 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CLK BUFFER 1:6 40MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione5.424 |
|
1 | 1:6 | No/No | Crystal | LVCMOS | 40MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Silicon Labs |
IC CLK BUFFER 1:24 200MHZ 48SSOP
|
pacchetto: 48-SSOP (0.295", 7.50mm Width) |
Azione7.504 |
|
1 | 1:24 | No/No | Clock | Clock | 200MHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 48-SSOP (0.295", 7.50mm Width) | 48-SSOP |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 1:18 200MHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione7.728 |
|
1 | 1:18 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 200MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
Texas Instruments |
IC CLK BUFFER 2:10 1.1GHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione8.040 |
|
1 | 2:10 | Yes/Yes | LVDS | LVDS | 1.1GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
Maxim Integrated |
IC CLK BUFFER 1:5 3GHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione2.704 |
|
2 | 1:5 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 3GHz | 2.25 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP/32-TQFP (7x7) |
||
Texas Instruments |
IC CLK BUFFER 2:10 1.1GHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione5.248 |
|
1 | 2:10 | Yes/Yes | LVDS | LVDS | 1.1GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-VQFN (5x5) |
||
Texas Instruments |
IC CLK BUFFER 2:10 3.5GHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione3.872 |
|
1 | 2:10 | Yes/Yes | HSTL, LVPECL | LVPECL | 3.5GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:3 2.5GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione2.896 |
|
1 | 1:3 | Yes/Yes | CML, HSTL, LVDS, LVPECL | LVPECL | 2.5GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microsemi Corporation |
IC CLK BUFF MUX 2:8 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione4.112 |
|
1 | 2:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microsemi Corporation |
IC CLK BUFFER 1:2 750MHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione5.872 |
|
1 | 1:2 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Texas Instruments |
IC CLK BUF 1:10 200MHZ 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione20.172 |
|
1 | 1:10 | No/No | LVTTL | LVTTL | 200MHz | 2.3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
Silicon Labs |
IC CLK BUFFER 1:5 LVPECL 32ELQFP
|
pacchetto: 32-VFQFN Exposed Pad |
Azione7.104 |
|
2 | 1:5 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 1.25GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Diodes Incorporated |
CLOCK BUFFER SSOP-20
|
pacchetto: - |
Azione4.112 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Diodes Incorporated |
IC CLK BUFFER 1:5 80MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione6.864 |
|
2 | 1:5 | No/No | CMOS, TTL | CMOS | 80MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Texas Instruments |
IC CLK BUFFER 2:2 75MHZ 8WSON
|
pacchetto: 8-VFDFN Exposed Pad |
Azione6.352 |
|
1 | 2:2 | No/No | Clock | Clock | 75MHz | 2.4 V ~ 5 V | -40°C ~ 85°C | Surface Mount | 8-VFDFN Exposed Pad | 8-WSON (3x3) |
||
Diodes Incorporated |
CLOCK BUFFER QSOP-16
|
pacchetto: - |
Azione3.264 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Texas Instruments |
IC CLK BUFFER 1:2 52MHZ 8DSBGA
|
pacchetto: 8-WFBGA, DSBGA |
Azione7.176 |
|
1 | 1:2 | No/No | Clock | Clock | 52MHz | 2.5 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-WFBGA, DSBGA | 8-DSBGA |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:8 500MHZ 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione6.976 |
|
1 | 1:8 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | HCSL | 500MHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
Analog Devices Inc. |
IC CLK BUFFER 1:2 1.6GHZ 32LFCSP
|
pacchetto: 32-VFQFN Exposed Pad, CSP |
Azione55.440 |
|
1 | 1:2 | Yes/Yes | Clock | CMOS, LVDS, LVPECL | 1.6GHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, CSP | 32-LFCSP-VQ (5x5) |
||
Analog Devices Inc. |
IC CLK BUFFER 1:9 8GHZ 32SMT
|
pacchetto: 32-VFQFN Exposed Pad |
Azione6.976 |
|
1 | 1:9 | Yes/Yes | CML, CMOS, LVDS, LVPECL | CML, LVPECL | 8GHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-SMT (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 800MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione2.288 |
|
1 | 2:4 | Yes/Yes | CML, HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVDS | 800MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Texas Instruments |
IC CLK BUFFER 1:2 52MHZ 8DSBGA
|
pacchetto: 8-WFBGA, DSBGA |
Azione324.000 |
|
1 | 1:2 | No/No | Clock | Clock | 52MHz | 2.5 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-WFBGA, DSBGA | 8-DSBGA |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:9 250MHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione9.156 |
|
1 | 2:9 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 250MHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:4 2.5GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione298.968 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 2.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Renesas Electronics Corporation |
IC CLK BUFFER 1:15 2GHZ 52PTQFP
|
pacchetto: - |
Request a Quote |
|
1 | 1:15 | Yes/Yes | PECL | PECL | 2 GHz | 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 52-LQFP Exposed Pad | 52-PTQFP (10x10) |
||
Analog Devices Inc. |
IC DIVIDER QFN
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Diodes Incorporated |
IC CLK BUFFER 1:4 160MHZ 8SOIC
|
pacchetto: - |
Request a Quote |
|
1 | 1:4 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 160 MHz | 1.425V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |