Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices Inc. |
IC CLK BUFFER 1:2 14GHZ 16SMD
|
pacchetto: 16-VFCQFN Exposed Pad |
Azione6.912 |
|
1 | 1:2 | Yes/Yes | CML | CML | 14GHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFCQFN Exposed Pad | 16-CSMT (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:8 200MHZ 28QSOP
|
pacchetto: 28-SSOP (0.154", 3.90mm Width) |
Azione5.968 |
|
2 | 1:8 | No/No | LVCMOS | LVCMOS | 200MHz | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 28-SSOP (0.154", 3.90mm Width) | 28-QSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 2GHZ 16VFQFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione2.272 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 1:4 450MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione2.272 |
|
1 | 1:4 | Yes/Yes | LVDS, LVPECL, LVTTL | LVPECL | 450MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUF 4:20/2:10 64TQFP
|
pacchetto: 64-TQFP Exposed Pad |
Azione2.304 |
|
1 or 2 | 4:20, 2:10 | Yes/Yes | HSTL, LVPECL | HSTL | 500MHz | 3.3 V ~ 3.47 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione6.368 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 4.2 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
NXP |
IC CLK BUFFER 1:5 1.5GHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione6.880 |
|
2 | 1:5 | Yes/Yes | ECL, PECL | PECL | 1.5GHz | 2.25 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
Diodes Incorporated |
IC CLK BUFFER 2:5 250MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione2.400 |
|
1 | 2:5 | Yes/No | LVDS, LVTTL | LVDS | 250MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
Diodes Incorporated |
IC CLK BUFFER 2:6 250MHZ 28QSOP
|
pacchetto: 28-SSOP (0.154", 3.90mm Width) |
Azione3.808 |
|
1 | 2:6 | Yes/Yes | LVDS, TTL | LVDS | 250MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 28-SSOP (0.154", 3.90mm Width) | 28-QSOP |
||
Microchip Technology |
IC CLK BUFFER 2:22 64TQFP
|
pacchetto: 64-TQFP Exposed Pad |
Azione7.200 |
|
1 | 2:22 | Yes/Yes | HSTL, LVPECL | HSTL | - | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione4.928 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
ON Semiconductor |
IC CLK BUFFER 2:4 700MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione3.008 |
|
1 | 2:4 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 700MHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microsemi Corporation |
IC CLK BUFF MUX 2:6 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione3.968 |
|
1 | 2:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Maxim Integrated |
IC CLK BUFFER 2:2 3GHZ 8UMAX
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione60.204 |
|
1 | 2:2 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 3GHz | 2.25 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-uMAX |
||
Diodes Incorporated |
CLOCK BUFFER TQFP-48
|
pacchetto: - |
Azione5.840 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
ON Semiconductor |
IC CLK BUFFER 1:1 200MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.904 |
|
1 | 1:1 | Yes/Yes | LVCMOS, LVDS | LVCMOS, LVDS | 200MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione2.416 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 100MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione11.448 |
|
1 | 1:10 | No/No | LVTTL | CMOS, TTL | 100MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Analog Devices Inc. |
IC CLK BUFFER 1:1 7.5GHZ 16LFCSP
|
pacchetto: 16-VFQFN Exposed Pad, CSP |
Azione8.760 |
|
2 | 1:1 | Yes/Yes | Clock | ECL, NECL, PECL | 7.5GHz | 2.375 V ~ 3.63 V | -40°C ~ 125°C | Surface Mount | 16-VFQFN Exposed Pad, CSP | 16-LFCSP-VQ (3x3) |
||
Texas Instruments |
IC CLK BUFFER 1:4 200MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione9.936 |
|
1 | 1:4 | No/No | LVTTL | LVTTL | 200MHz | 2.3 V ~ 3.6 V | -40°C ~ 105°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 1:18 200MHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione4.928 |
|
1 | 1:18 | Yes/No | LVCMOS, LVPECL, LVTTL | LVCMOS, LVTTL | 200MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:3 150MHZ 6SOT23
|
pacchetto: SOT-23-6 |
Azione6.840 |
|
1 | 1:3 | No/No | LVCMOS, Sine Wave | LVCMOS | 150MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | SOT-23-6 | SOT-23-6 |
||
Diodes Incorporated |
IC CLOCK
|
pacchetto: - |
Azione2.352 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Texas Instruments |
HI-REL DEVICE
|
pacchetto: - |
Azione5.568 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC CLK DIVIDER/BUFFER 64-TQFP
|
pacchetto: 64-LQFP Exposed Pad |
Azione5.440 |
|
1 | 1:20 | Yes/Yes | CML, LVDS, LVPECL, SSTL | LVDS, LVPECL | 650MHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP Exposed Pad | 64-TQFP-EP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC TIMING CLOCK
|
pacchetto: - |
Azione4.880 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
IC CLOCK MANANGEMENT
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CLK BUFFER 1:4 250MHZ 16VQFN
|
pacchetto: - |
Azione1.440 |
|
1 | 1:4 | Yes/Yes | HCSL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 16-VFQFN Exposed Pad | 16-VQFN (3x3) |