Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 800MHZ 20TSSOP
|
pacchetto: - |
Azione5.840 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CLK BUFFER 1:1 4.5GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione7.600 |
|
2 | 1:1 | Yes/Yes | CML, LVDS, LVPECL | CML | 4.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 100MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione7.840 |
|
2 | 1:5 | No/No | TTL | TTL | 100MHz | 4.75 V ~ 5.25 V | 0°C ~ 70°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione22.068 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione38.460 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTIPLX 2:1 2GHZ 16VFQFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione5.056 |
|
1 | 2:1 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 2GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 650MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione4.464 |
|
1 | 2:4 | Yes/Yes | CML, HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVDS | 650MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione19.800 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 3 V ~ 5.5 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 2:4 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione5.616 |
|
1 | 2:4 | Yes/Yes | ECL, PECL | ECL, PECL | - | 4.75 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
NXP |
IC CLK BUFFER 1:4 533MHZ 8SO
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.256 |
|
1 | 1:4 | No/No | LVTTL | LVTTL | 533MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione2.100 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 4.2 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Analog Devices Inc. |
IC CLOCK BUFFER 1:2 16SMT
|
pacchetto: 16-VFQFN Exposed Pad |
Azione8.892 |
|
1 | 1:2 | Yes/Yes | CML | CML | 14GHz | -3 V ~ -3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-SMT (3x3) |
||
Texas Instruments |
IC CLK BUFFER 1:9 650MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione13.356 |
|
1 | 1:9 | Yes/Yes | LVPECL | LVPECL | 650MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 1:2 1.5GHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.656 |
|
1 | 1:2 | Yes/Yes | CML, HCSL, LVDS, LVPECL | LVPECL | 1.5GHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ON Semiconductor |
IC CLK BUFFER 3:10 200MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione4.992 |
|
1 | 3:10 | Yes/No | HCSL, LVDS, LVPECL, SSTL, Crystal | LVCMOS, LVTTL | 200MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 166MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione2.240 |
|
1 | 1:10 | No/No | LVTTL | LVTTL | 166MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
ON Semiconductor |
IC CLK BUFFER 1:2 1GHZ 8TSSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione105.612 |
|
1 | 1:2 | Yes/Yes | ECL, PECL | ECL, PECL | 1GHz | 3 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-TSSOP |
||
Silicon Labs |
IC CLK BUFFER 1:8 CMOS 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione5.968 |
|
1 | 1:8 | No/No | CMOS, HSTL, LVTTL, SSTL | CMOS | 200MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Diodes Incorporated |
IC CLK BUFFER 1:10 156MHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.472 |
|
1 | 1:10 | No/No | CMOS, TTL | CMOS, TTL | 156MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Diodes Incorporated |
IC CLK BUFFER 1:6 160MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione6.832 |
|
1 | 1:6 | No/No | Crystal | LVCMOS | 160MHz | 1.425 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione7.472 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
Analog Devices Inc. |
IC CLK BUFFER 1:4 7GHZ 16LFCSP
|
pacchetto: 16-WFQFN Exposed Pad, CSP |
Azione9.468 |
|
1 | 1:4 | Yes/Yes | CML, CMOS, LVDS, LVPECL | ECL, LVPECL | 7GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-WFQFN Exposed Pad, CSP | 16-LFCSP-WQ (3x3) |
||
Diodes Incorporated |
IC CLK BUFFER 1:10 66MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione5.888 |
|
1 | 1:10 | No/No | CMOS, TTL | CMOS, TTL | 66MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:5 700MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione5.056 |
|
1 | 2:5 | Yes/Yes | HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, LVTTL, SSTL | LVPECL | 700MHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:8 1.5GHZ 32MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione14.772 |
|
1 | 1:8 | Yes/Yes | CML, LVDS, PECL | LVPECL | 1.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
ON Semiconductor |
IC CLK BUFFER 1:2 1.5GHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.232 |
|
1 | 1:2 | Yes/Yes | ECL, PECL | ECL, PECL | 1.5GHz | 4.2 V ~ 5.7 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ON Semiconductor |
IC CLK BUFFER 1:2 2GHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione27.732 |
|
1 | 1:2 | Yes/Yes | CML, LVCMOS, LVDS, LVPECL, LVTTL | LVDS | 2GHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 2:15 200MHZ 52TQFP
|
pacchetto: - |
Request a Quote |
|
1 | 2:15 | Yes/Yes | LVCMOS, LVPECL, LVTTL | LVCMOS, LVTTL | 200 MHz | 2.375V ~ 2.625V, 2.97V ~ 3.63V | 0°C ~ 70°C | Surface Mount | 52-TQFP | 52-TQFP (10x10) |