Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 166MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.736 |
|
1 | 1:4 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 250MHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 3:4 266MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione7.632 |
|
1 | 3:4 | No/Yes | LVCMOS, LVTTL | LVPECL | 266MHz | 2.375 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 100MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione4.144 |
|
1 | 1:10 | No/No | TTL | TTL | 100MHz | 4.75 V ~ 5.25 V | 0°C ~ 70°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 133MHZ 28SSOP
|
pacchetto: 28-SSOP (0.209", 5.30mm Width) |
Azione38.676 |
|
1 | 1:10 | No/No | Clock | Clock | 133MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | 28-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTIPLEXER 2:1 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.400 |
|
1 | 2:1 | No/Yes | LVCMOS, LVTTL | LVPECL | - | 2.375 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ON Semiconductor |
IC CLK BUFFER 2:8 80MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione5.456 |
|
1 | 2:8 | Yes/No | PECL, TTL | TTL | 80MHz | 4.75 V ~ 5.25 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Diodes Incorporated |
IC CLK BUFFER 2:4 500MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione5.312 |
|
1 | 2:4 | Yes/Yes | LVCMOS, LVTTL, Crystal | LVPECL | 500MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
NXP |
IC CLK BUFFER 2:10 250MHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione5.376 |
|
1 | 2:10 | No/No | LVCMOS | LVCMOS | 250MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:3 2GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione2.160 |
|
1 | 1:3 | Yes/Yes | CML, HSTL, LVDS, LVPECL | LVDS | 2GHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione34.872 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 4.2 V ~ 5.5 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
ON Semiconductor |
IC CLK BUFFER 4:2 6GHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione7.392 |
|
1 | 4:2 | Yes/Yes | CML, LVDS, LVPECL | CML | 6GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 1:2 1.5GHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione7.312 |
|
1 | 1:2 | Yes/Yes | CML, LVPECL | CML | 1.5GHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Texas Instruments |
IC CLK BUFFER 1:18 100MHZ 48SSOP
|
pacchetto: 48-BSSOP (0.295", 7.50mm Width) |
Azione15.552 |
|
1 | 1:18 | No/No | LVTTL | LVTTL, TTL | 100MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP |
||
Diodes Incorporated |
IC CLOCK BUFFER 3:4 28TSSOP
|
pacchetto: - |
Azione4.432 |
|
1 | 3:4 | Yes/Yes | Clock, Crystal | HCSL, LVDS, LVPECL | 1.5GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | - | - | - |
||
Microsemi Corporation |
IC CLK BUFFER 1:2 750MHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione3.200 |
|
1 | 1:2 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:3 40MHZ
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.192 |
|
1 | 1:3 | No/No | Crystal | LVCMOS | 40MHz | 1.62 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Texas Instruments |
IC CLK BUFFER 1:1 108MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione6.224 |
|
1 | 1:1 | No/No | LVCMOS | LVCMOS | 108MHz | 3 V ~ 3.6 V | -40°C ~ 105°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFF 2:5 2GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione7.104 |
|
1 | 2:5 | Yes/Yes | CML, LVDS, LVPECL, SSTL | ECL, LVPECL | 2GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 266MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione5.072 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL | LVPECL | 266MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microsemi Corporation |
LOW SKEW, LOW ADDITIVE JITTER 3
|
pacchetto: 48-VFQFN Exposed Pad |
Azione7.520 |
|
- | - | - | - | - | - | - | - | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 2:6 3.2GHZ 32VFQFPN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione11.256 |
|
1 | 2:6 | Yes/Yes | CML, LVDS, LVPECL, SSTL | ECL, LVPECL | 3.2GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |
||
ON Semiconductor |
IC CLK BUFFER 1:4 8.5GHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione10.716 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | CML | 8.5GHz | 1.71 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 2GHZ 16VFQFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione21.876 |
|
1 | 2:4 | Yes/Yes | LVDS, LVPECL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:2 750MHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione5.216 |
|
1 | 1:2 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Diodes Incorporated |
CLOCK BUFFER W-QFN5050-32
|
pacchetto: 32-WFQFN Exposed Pad |
Azione25.464 |
|
1 | 1:4 | Yes/Yes | HCSL | HCSL | 200MHz | 1.7V ~ 1.9V | -40°C ~ 105°C (TA) | Surface Mount | 32-WFQFN Exposed Pad | 32-TQFN (5x5) |
||
Analog Devices Inc. |
IC DIVIDER QFN
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
QS52807ZATSO
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 2:12 160MHZ 32TQFP
|
pacchetto: - |
Request a Quote |
|
1 | 2:12 | Yes/No | LVCMOS, LVPECL, LVTTL | Clock | 160 MHz | 2.97V ~ 3.63V | -40°C ~ 85°C (TA) | Surface Mount | 32-TQFP | 32-TQFP (7x7) |