Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Silicon Labs |
IC CLK BUFFER 1:24 200MHZ 48SSOP
|
pacchetto: 48-SSOP (0.295", 7.50mm Width) |
Azione11.292 |
|
1 | 1:24 | No/No | Clock | Clock | 200MHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 48-SSOP (0.295", 7.50mm Width) | 48-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 100MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione3.904 |
|
2 | 1:5 | No/No | LVCMOS | LVCMOS | 100MHz | 3.13 V ~ 3.46 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 1GHZ 52PTQFP
|
pacchetto: 52-LQFP Exposed Pad |
Azione3.584 |
|
2 | 1:10 | Yes/Yes | ECL, PECL | LVPECL | 1GHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 52-LQFP Exposed Pad | 52-PTQFP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 100MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione5.952 |
|
2 | 1:5 | No/No | TTL | TTL | 100MHz | 4.75 V ~ 5.25 V | 0°C ~ 70°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 100MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione3.232 |
|
1 | 1:10 | No/No | TTL | TTL | 100MHz | 4.75 V ~ 5.25 V | 0°C ~ 70°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 200MHZ 28TSSOP
|
pacchetto: 28-TSSOP (0.173", 4.40mm Width) |
Azione3.040 |
|
1 | 1:5 | No/No | LVTTL | LVCMOS, LVTTL | 200MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 28-TSSOP (0.173", 4.40mm Width) | 28-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione4.592 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.75 V ~ 5.25 V | 0°C ~ 70°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
NXP |
IC CLK BUFFER 1:10 125MHZ 24SSOP
|
pacchetto: 24-SSOP (0.209", 5.30mm Width) |
Azione6.464 |
|
1 | 1:10 | No/No | LVTTL | LVTTL | 125MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione4.832 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
NXP |
IC CLK BUFFER 1:5 1.5GHZ 32HVQFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione4.960 |
|
2 | 1:5 | Yes/Yes | ECL, PECL | PECL | 1.5GHz | 2.25 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) |
||
NXP |
IC CLK BUFFER 2:9 350MHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione4.912 |
|
1 | 2:9 | No/No | LVCMOS | LVCMOS | 350MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:9 500MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione4.144 |
|
1 | 2:9 | Yes/Yes | CML, HCSL, HSTL, LVDS, LVHSTL, LVPECL, SSTL | HSTL | 500MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.5x11.5) |
||
Texas Instruments |
IC CLK BUFFER 1:10 100MHZ 24SSOP
|
pacchetto: 24-SSOP (0.209", 5.30mm Width) |
Azione5.616 |
|
1 | 1:10 | No/No | LVTTL | LVTTL, TRI-State | 100MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
Texas Instruments |
IC CLK BUFFER 1:8 800MHZ 48VQFN
|
pacchetto: 48-VFQFN Exposed Pad |
Azione4.416 |
|
2 | 1:8 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVDS | 800MHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-VQFN (7x7) |
||
Texas Instruments |
IC CLK BUFFER 2:10 3.5GHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione3.040 |
|
1 | 2:10 | Yes/Yes | HSTL, LVPECL | LVPECL | 3.5GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:8 2GHZ 28VFQFN
|
pacchetto: 28-VFQFN Exposed Pad |
Azione6.048 |
|
1 | 2:8 | Yes/Yes | LVDS, LVPECL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 28-VFQFN Exposed Pad | 28-VQFN (5x5) |
||
ON Semiconductor |
IC CLK BUFFER 2:10 3GHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione6.912 |
|
1 | 2:10 | Yes/Yes | ECL, HSTL, PECL | ECL, PECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
Diodes Incorporated |
IC CLK BUFFER 1:4 140MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione96.240 |
|
1 | 1:4 | No/No | CMOS, TTL | LVCMOS | 140MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Diodes Incorporated |
IC CLK BUFFER 1:4 140MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione11.292 |
|
1 | 1:4 | No/No | CMOS, TTL | LVCMOS | 140MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 166MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione3.504 |
|
1 | 1:10 | No/No | LVTTL | CMOS, TTL | 166MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
Analog Devices Inc. |
IC CLK BUFFER 1:6 4.8GHZ 24LFCSP
|
pacchetto: 24-VFQFN Exposed Pad, CSP |
Azione26.928 |
|
1 | 1:6 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVPECL | 4.8GHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad, CSP | 24-LFCSP-VQ (4x4) |
||
Diodes Incorporated |
CLOCK BUFFER V-QFN6060-48 T&R 3K
|
pacchetto: 48-VFQFN Exposed Pad |
Azione2.896 |
|
1 | 2:12 | Yes/Yes | HCSL | HCSL | 125MHz | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | 48-TQFN (6x6) |
||
IDT, Integrated Device Technology Inc |
IC TIMING CLOCK
|
pacchetto: - |
Azione2.192 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC TIMING CLOCK
|
pacchetto: - |
Azione3.296 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
IC CLK BUFFER 1:3 200MHZ 10DFN
|
pacchetto: - |
Request a Quote |
|
1 | 1:3 | No/No | LVCMOS | LVCMOS | 200 MHz | 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 105°C (TA) | Surface Mount | 10-WFDFN Exposed Pad | 10-DFN (2x2) |
||
Renesas Electronics Corporation |
IC CLK BUFFER 2:12 2GHZ 40VFQFPN
|
pacchetto: - |
Request a Quote |
|
1 | 2:12 | Yes/Yes | CML, LVCMOS, LVDS, LVPECL | LVPECL | 2 GHz | 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 40-VFQFN Exposed Pad | 40-VFQFPN (6x6) |
||
Texas Instruments |
IC CLK BUFFER 2:4 2GHZ 16VQFN
|
pacchetto: - |
Azione11.103 |
|
1 | 2:4 | Yes/Yes | HCSL, LVCMOS, LVDS, LVPECL | LVDS | 2 GHz | 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 105°C (TA) | Surface Mount | 16-VFQFN Exposed Pad | 16-VQFN (3x3) |
||
Renesas Electronics Corporation |
IC CLK BUFFER 1:3 200MHZ 10DFN
|
pacchetto: - |
Azione2.880 |
|
1 | 1:3 | No/No | LVCMOS | LVCMOS | 200 MHz | 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 105°C (TA) | Surface Mount | 10-WFDFN Exposed Pad | 10-DFN (2x2) |