Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK BUFFER 1:1 266MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.320 |
|
1 | 1:1 | No/Yes | LVCMOS, LVTTL | LVPECL | 266MHz | 2.375 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
CTS-Frequency Controls |
IC CLOCK BUFFER 1:2 1.6GHZ
|
pacchetto: 8-XFDFN |
Azione5.840 |
|
1 | 1:2 | No/Yes | Clock | LVDS, LVPECL | 1.6GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-XFDFN | 8-SON |
||
Silicon Labs |
IC CLK BUFFER 1:8 200MHZ 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione4.736 |
|
1 | 1:8 | No/No | CMOS, HSTL, LVTTL, SSTL | CMOS | 200MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTIPLX 2:1 3GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione6.864 |
|
2 | 2:1 | Yes/Yes | ECL, LVDS, PECL | ECL, LVDS, PECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 166MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione5.216 |
|
1 | 1:10 | No/No | LVTTL | CMOS, TTL | 166MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Diodes Incorporated |
IC CLK BUFFER 1:5 140MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione14.412 |
|
1 | 1:5 | No/No | TTL | TTL | 140MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Diodes Incorporated |
IC CLK BUFFER 1:5 66MHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione4.176 |
|
2 | 1:5 | No/No | CMOS, TTL | CMOS | 66MHz | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC CLK BUFFER 2:8 160MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione46.908 |
|
1 | 2:8 | Yes/Yes | PECL, TTL | TTL | 160MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Maxim Integrated |
IC CLK BUFFER 2:5 1GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione4.624 |
|
1 | 2:5 | Yes/Yes | HSTL, LVPECL | LVDS | 1GHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Maxim Integrated |
IC CLK BUFFER 1:5 3GHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione3.408 |
|
2 | 1:5 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 3GHz | 2.25 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP/32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 2:4 235MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione3.920 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL, Crystal | LVPECL | 235MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
ON Semiconductor |
IC CLK BUFFER 4:2 7GHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione4.880 |
|
1 | 4:2 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 7GHz | 2.37 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
ON Semiconductor |
IC CLK BUFFER 1:2 6GHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.000 |
|
1 | 1:2 | Yes/Yes | CML, LVCMOS, LVDS, LVNECL, LVPECL, LVTTL | ECL | 6GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microsemi Corporation |
IC CLK BUFF MUX 2:6 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione4.672 |
|
1 | 2:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 350MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione21.912 |
|
1 | 1:2 | Yes/No | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVCMOS, LVTTL | 350MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 100MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione4.224 |
|
1 | 1:10 | No/No | TTL | TTL | 100MHz | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Silicon Labs |
IC CLK BUFFER 1:4 HCSL 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione5.408 |
|
1 | 1:4 | No/Yes | CMOS, HSTL, LVTTL, SSTL | HCSL | 250MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Texas Instruments |
IC CLK BUF 1:10 200MHZ 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione32.100 |
|
1 | 1:10 | No/No | LVTTL | LVTTL | 200MHz | 2.3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
Microchip Technology |
IC CLK BUFFER
|
pacchetto: 16-VFQFN Exposed Pad |
Azione4.912 |
|
1 | 2:2 | Yes/Yes | HCSL, LVDS | HCSL, LVDS | 267MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:22 500MHZ 64TQFP
|
pacchetto: 64-TQFP Exposed Pad |
Azione6.768 |
|
1 | 2:22 | Yes/Yes | CML, HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 500MHz | 3.135 V ~ 3.465 V | 0°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-TQFP-EP (10x10) |
||
Texas Instruments |
IC CLK BUFFER 1:10 100MHZ 24SOIC
|
pacchetto: 24-SOIC (0.295", 7.50mm Width) |
Azione5.408 |
|
1 | 1:10 | No/No | LVTTL | LVTTL, TRI-State | 100MHz | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
||
Texas Instruments |
IC CLK BUF 1:10 400MHZ 28TSSOP
|
pacchetto: 28-TSSOP (0.173", 4.40mm Width) |
Azione41.688 |
|
1 | 1:10 | Yes/Yes | LVDS, LVPECL, PECL | LVDS | 400MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 28-TSSOP (0.173", 4.40mm Width) | 28-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 100MHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione22.104 |
|
1 | 1:10 | No/No | TTL | TTL | 100MHz | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Diodes Incorporated |
IC CLOCK BUFFER
|
pacchetto: - |
Azione7.728 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC NETWORK TIMING
|
pacchetto: 20-VFQFN Exposed Pad |
Azione3.440 |
|
1 | 1:4 | Yes/Yes | LVCMOS, LVTTL | LVPECL | 1GHz | 1.65 V ~ 1.95 V | -40°C ~ 85°C | Surface Mount | 20-VFQFN Exposed Pad | 20-VFQFPN (4x4) |
||
Cypress Semiconductor Corp |
IC CLOCK DISTRIBUTION 8SOIC
|
pacchetto: - |
Azione51.078 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Diodes Incorporated |
IC CLK BUFFER 1:20 400MHZ 80AQFN
|
pacchetto: - |
Azione9.000 |
|
1 | 1:20 | Yes/Yes | CMOS, HCSL | HCSL | 400 MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 80-VFQFN Dual Rows, Exposed Pad | 80-aQFN (6x6) |
||
Microchip Technology |
IC CLK BUFFER 1:4 250MHZ 16VQFN
|
pacchetto: - |
Azione1.026 |
|
1 | 1:4 | Yes/Yes | HCSL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 16-VFQFN Exposed Pad | 16-VQFN (3x3) |