Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cypress Semiconductor Corp |
ROBOCLOCK MGMT
|
pacchetto: 32-LCC (J-Lead) |
Azione13.752 |
|
- | - | - | - | - | - | - | - | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:10 625MHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione7.568 |
|
1 | 2:10 | Yes/Yes | HSTL, PECL | HSTL | 625MHz | 3.135 V ~ 3.465 V | -40°C ~ 110°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:5 2GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione12.948 |
|
1 | 2:5 | Yes/Yes | ECL, HSTL, LVDS, PECL | ECL, PECL | 2GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 56TSSOP
|
pacchetto: 56-TFSOP (0.240", 6.10mm Width) |
Azione2.000 |
|
4 | 2:4 | No/No | Clock | 3-State | - | 2.3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 56-TFSOP (0.240", 6.10mm Width) | 56-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 100MHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione4.416 |
|
2 | 1:5 | No/No | TTL | TTL | 100MHz | 4.75 V ~ 5.25 V | 0°C ~ 70°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 3GHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione2.176 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL, SSTL | CML | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 700MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.992 |
|
1 | 1:2 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVHSTL | 700MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 3GHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione3.840 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL, SSTL | ECL, LVPECL | 3GHz | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
ON Semiconductor |
IC CLK BUFFER 1:8 80MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione7.536 |
|
1 | 1:8 | Yes/No | ECL, TTL | TTL | 80MHz | 4.75 V ~ 5.25 V, -4.68 V ~ -5.72 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTPX 2:12 48PTQFP
|
pacchetto: 48-TQFP Exposed Pad |
Azione4.960 |
|
1 | 2:12 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 700MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 48-TQFP Exposed Pad | 48-PTQFP-EP (7x7) |
||
Texas Instruments |
IC CLK BUFFER 1:3 800MHZ 24VQFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione4.336 |
|
1 | 1:3 | Yes/Yes | CML, HSTL, LVDS, LVPECL, SSTL-2, VML | LVCMOS, LVPECL | 800MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-VQFN Exposed Pad (4x4) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER/DIVIDER 32VFQFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione6.592 |
|
1 | 1:8 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 500MHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFN (5x5) |
||
Diodes Incorporated |
FANOUT BUFFER WITH INTERNAL TERM
|
pacchetto: - |
Azione2.736 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
ON Semiconductor |
IC CLK BUFFER 3:10 200MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione5.616 |
|
1 | 3:10 | Yes/No | HCSL, LVDS, LVPECL, SSTL, Crystal | LVCMOS, LVTTL | 200MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12MSOP
|
pacchetto: 12-TSSOP (0.118", 3.00mm Width) |
Azione3.280 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 125°C | Surface Mount | 12-TSSOP (0.118", 3.00mm Width) | 12-MSOP |
||
Silicon Labs |
IC BUFFER/LEVEL XLATOR 1:4 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione6.800 |
|
1 | 1:4 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | CML, HCSL, LVCMOS, LVDS, LVPECL | 725MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:5 2GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione6.160 |
|
1 | 2:5 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 2GHz | 2.37 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Silicon Labs |
IC CLK BUFFER 1:4 LVDS 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione6.640 |
|
1 | 1:4 | Yes/Yes | CML, HCSL, LVDS, LVPECL | LVDS | 710MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Linear Technology |
IC POWER MANAGEMENT
|
pacchetto: 12-WFDFN Exposed Pad |
Azione5.248 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVPECL | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK DIVIDER/BUFFER 16VFQFPN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione5.120 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL | LVCMOS, LVPECL | 1GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFPN (3x3) |
||
IDT, Integrated Device Technology Inc |
MULTIMKT-TIMING
|
pacchetto: 8-UFDFN |
Azione4.864 |
|
1 | 1:5 | No/No | LVCMOS | LVCMOS | 200MHz | 1.71 V ~ 3.465 V | -40°C ~ 105°C (TA) | Surface Mount | 8-UFDFN | 8-VFQFN (2x2) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK OCTAL 20VFQFPN
|
pacchetto: 20-VFQFN Exposed Pad |
Azione16.860 |
|
1 | 1:8 | No/No | Crystal | LVCMOS | 100kHz | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C | Surface Mount | 20-VFQFN Exposed Pad | 20-QFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:4 8DFN
|
pacchetto: 8-UFDFN |
Azione35.952 |
|
1 | 1:4 | No/No | Clock | Clock | 200MHz | 1.71 V ~ 3.465 V | -40°C ~ 105°C | Surface Mount | 8-UFDFN | 8-DFN (2x2) |
||
IDT, Integrated Device Technology Inc |
QS5813 - CLOCK DRIVER
|
pacchetto: - |
Request a Quote |
|
- | 1:13 | No/No | - | Clock | - | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Through Hole | 28-SSOP (0.209", 5.30mm Width) | 28-SSOP |
||
Cypress Semiconductor Corp |
IC ZD BUFFER 8SOIC
|
pacchetto: - |
Request a Quote |
|
- | 1:5 | No/No | - | - | - | 2.97V ~ 3.63V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Texas Instruments |
PROTOTYPE
|
pacchetto: - |
Request a Quote |
|
1 | 2:12 | Yes/Yes | LVCMOS, LVDS, LVPECL, LVTTL | LVPECL | 2 GHz | 2.375V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 40-VFQFN Exposed Pad | 40-VQFN (6x6) |
||
National Semiconductor |
IC CLOCK DRIVER 14CFP
|
pacchetto: - |
Request a Quote |
|
- | 1:8 | No/No | - | - | - | 2V ~ 6V | -55°C ~ 125°C | Surface Mount | 14-CFlatPack | 14-CFP |
||
Texas Instruments |
PROTOTYPE
|
pacchetto: - |
Request a Quote |
|
1 | 2:8 | Yes/Yes | Clock | LVDS, LVPECL | 1.6 GHz | 3.15V ~ 3.45V | -40°C ~ 85°C (TA) | Surface Mount | 48-WFQFN Exposed Pad | 48-WQFN (7x7) |