Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:16 700MHZ 48LQFP
|
pacchetto: 48-LQFP |
Azione6.544 |
|
1 | 1:16 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVDS | 700MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
Silicon Labs |
IC CLK BUFFER 1:4 140MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione5.584 |
|
1 | 1:4 | No/No | Clock | LVCMOS | 140MHz | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione2.608 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 650MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione6.704 |
|
1 | 2:4 | Yes/Yes | CML, HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVDS | 650MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione7.072 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 4.2 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Diodes Incorporated |
IC CLK BUF 1:10 250MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione6.112 |
|
1 | 1:10 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 250MHz | 1.65 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Diodes Incorporated |
IC CLK BUFFER 2:4 266MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione6.016 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL | LVPECL | 266MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC CLK MULTIPLXR 2:10 2GHZ 44MLF
|
pacchetto: 44-VFQFN Exposed Pad, 44-MLF? |
Azione7.840 |
|
1 | 2:10 | Yes/Yes | CML, LVDS, PECL | LVPECL | 2GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 44-VFQFN Exposed Pad, 44-MLF? | 44-MLF? (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione2.672 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 4.2 V ~ 5.5 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:4 160MHZ 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione3.056 |
|
1 | 1:4 | Yes/Yes | PECL | TTL | 160MHz | 4.75 V ~ 5.25 V | 0°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTIPLX 4:1 2GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione6.016 |
|
1 | 4:1 | Yes/Yes | CML, LVDS, LVPECL, SSTL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC CLK MULTIPLX 2:1 4.5GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione4.016 |
|
1 | 2:1 | Yes/Yes | CML, LVDS, LVPECL | CML | 4.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:8 1.5GHZ 32MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione4.544 |
|
1 | 1:8 | Yes/Yes | CML, LVDS, PECL | LVDS | 1.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Texas Instruments |
IC CLK BUFFER 1:6 80MHZ 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione78.852 |
|
1 | 1:6 | No/No | TTL | CMOS | 80MHz | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 100MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione3.856 |
|
1 | 1:10 | No/No | TTL | TTL | 100MHz | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 3:4 200MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione2.032 |
|
1 | 3:4 | No/No | LVCMOS, LVTTL, Crystal | LVCMOS, LVTTL | 200MHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Diodes Incorporated |
IC CLOCK BUFFER MUX 3:6 32TQFN
|
pacchetto: 32-TQFP |
Azione6.960 |
|
1 | 3:6 | Yes/Yes | LVCMOS, LVTTL, Crystal | HCSL, LVDS, LVPECL | 1.5GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Silicon Labs |
IC CLK BUFFER 1:3 52MHZ 10TDFN
|
pacchetto: 10-WFDFN |
Azione4.048 |
|
1 | 1:3 | No/No | LVCMOS | LVCMOS | 52MHz | 1.7 V ~ 3.65 V | -40°C ~ 85°C | Surface Mount | 10-WFDFN | 10-TDFN (2x1.4) |
||
Microchip Technology |
IC CLK BUFFER
|
pacchetto: 16-VFQFN Exposed Pad |
Azione5.648 |
|
1 | 2:2 | Yes/Yes | HCSL, LVDS | HCSL, LVDS | 267MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Silicon Labs |
IC CLK BUFFER 1:8 CMOS 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione3.488 |
|
1 | 1:8 | No/No | CMOS, HSTL, LVTTL, SSTL | CMOS | 200MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Silicon Labs |
IC CLK BUFFER 2:4 LVDS 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione6.880 |
|
1 | 2:4 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | CML, HCSL, LVCMOS, LVDS, LVPECL | 1.25GHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Diodes Incorporated |
IC CLK BUFFER 1:10 80MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione4.400 |
|
1 | 1:10 | No/No | CMOS, TTL | CMOS, TTL | 80MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:18 250MHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione3.984 |
|
1 | 2:18 | Yes/No | CML, LVCMOS, LVPECL, LVTTL, SSTL | LVCMOS, LVTTL | 250MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
Texas Instruments |
IC CLK BUFFER 6:6 80MHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.056 |
|
1 | 6:6 | No/No | CMOS | CMOS | 80MHz | 4.75 V ~ 5.25 V | 25°C ~ 70°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:16 700MHZ 48TQFP
|
pacchetto: 48-LQFP |
Azione7.128 |
|
1 | 1:16 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVDS | 700MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
pacchetto: 12-WFDFN Exposed Pad |
Azione108.000 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVDS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Analog Devices Inc./Maxim Integrated |
CLOCK AND DATA DRIVER
|
pacchetto: - |
Request a Quote |
|
1 | 1:9 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 1.5 GHz | ±2.375V ~ 3.8V | -40°C ~ 85°C | Surface Mount | 28-VFQFN Exposed Pad | 28-QFN (5x5) |
||
Skyworks Solutions Inc. |
IC CLK BUFFER 2:6 725MHZ 32QFN
|
pacchetto: - |
Request a Quote |
|
1 | 2:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | CML, HCSL, LVCMOS, LVDS, LVPECL | 725 MHz | 1.71V ~ 1.89V, 2.38V ~ 2.63V, 2.97V ~ 3.63V | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |