Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cypress Semiconductor Corp |
IC CLK BUFFER 1:2 1.5GHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.680 |
|
1 | 1:2 | Yes/Yes | CML, HCSL, LVDS, LVPECL | LVPECL | 1.5GHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 625MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.240 |
|
1 | 1:2 | Yes/Yes | PECL | HSTL | 625MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 2GHZ 16VFQFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione7.920 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 2GHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
Texas Instruments |
IC CLK BUFFER 1:2 800MHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione36.000 |
|
2 | 1:2 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVDS | 800MHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
ON Semiconductor |
IC CLK BUFFER 2:10 3GHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione16.152 |
|
1 | 2:10 | Yes/Yes | ECL, HSTL, LVDS, PECL | ECL, PECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione4.416 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Silicon Labs |
IC CLK BUFFER 1:4 HCSL 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione6.192 |
|
1 | 1:4 | No/Yes | CMOS, HSTL, LVTTL, SSTL | HCSL | 250MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 250MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione5.488 |
|
1 | 2:4 | Yes/No | CMOS, PECL | 3-State, CMOS | 250MHz | 2.375 V ~ 5.5 V | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Diodes Incorporated |
CLOCK SAW OSCILLATOR SEAM2016
|
pacchetto: - |
Azione4.080 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Silicon Labs |
IC CLK BUFFER 1:8 CMOS 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione5.264 |
|
1 | 1:8 | Yes/No | CML, HCSL, LVDS, LVPECL | CMOS | 200MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Diodes Incorporated |
IC CLK BUFFER 1:3 25MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione6.192 |
|
1 | 1:3 | No/No | LVCMOS, Crystal | LVCMOS | 25MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 100MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione6.672 |
|
1 | 1:10 | No/No | LVTTL | CMOS, TTL | 100MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
Diodes Incorporated |
IC CLK BUFFER 1:6 1.5GHZ 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione4.688 |
|
1 | 1:6 | Yes/Yes | LVCMOS, LVTTL | LVDS | 1.5GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
Texas Instruments |
IC CLK BUFFER 2:10 3.5GHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione6.696 |
|
1 | 2:10 | Yes/Yes | CML, LVDS, LVPECL, SSTL | LVPECL | 3.5GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC BUFFER DL 1:4 LVPECL 28VFQFPN
|
pacchetto: 28-WFQFN Exposed Pad |
Azione3.456 |
|
2 | 1:4 | Yes/Yes | CML, LVCMOS, LVDS, LVPECL | LVPECL | 2GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 28-WFQFN Exposed Pad | 28-VFQFPN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 3GHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione7.664 |
|
2 | 1:2 | Yes/Yes | CML, LVDS, LVPECL, SSTL | LVDS, LVPECL | 3GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Texas Instruments |
IC CLK BUFFER 1:18 100MHZ 48SSOP
|
pacchetto: 48-BSSOP (0.295", 7.50mm Width) |
Azione8.292 |
|
1 | 1:18 | No/No | LVTTL | LVTTL, TTL | 100MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:8 2GHZ 28VFQFN
|
pacchetto: 28-VFQFN Exposed Pad |
Azione13.608 |
|
1 | 2:8 | Yes/Yes | LVDS, LVPECL | LVDS | 2GHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 28-VFQFN Exposed Pad | 28-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:8 3GHZ 32MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione15.936 |
|
1 | 1:8 | Yes/Yes | CML, LVDS, PECL | LVPECL | 3GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
IDT, Integrated Device Technology Inc |
IC NETWORK TIMING VFQFPN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione6.480 |
|
2 | 2:1, 1:2 | Yes/Yes | LVDS, LVPECL, SSTL | LVDS | 3GHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-VFQFPN (4x4) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 32VFQFPN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione3.440 |
|
1 | 2:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | CML, HCSL, LVCMOS, LVDS, LVPECL | 700MHz | 1.71 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |
||
Diodes Incorporated |
IC CLOCK
|
pacchetto: - |
Azione5.808 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:6 16DFN
|
pacchetto: 16-UFQFN |
Azione8.880 |
|
1 | 1:6 | No/No | LVCMOS | LVCMOS | 200MHz | 1.71 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-UFQFN | 16-QFN (2.5x2.5) |
||
Diodes Incorporated |
IC CLK BUFFER 1:4 200MHZ 32TQFN
|
pacchetto: - |
Request a Quote |
|
1 | 1:4 | Yes/Yes | CMOS, HCSL | HCSL | 200 MHz | 1.7V ~ 1.9V | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-TQFN (5x5) |
||
Analog Devices Inc. |
IC DIVIDER QFN
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - |
||
SiTime |
-40C TO 125C, 8PIN, 2020, 1.8V-3
|
pacchetto: - |
Request a Quote |
|
1 | 1:4 | No/No | Clock | LVCMOS | 200 MHz | 1.8V ~ 3.3V | -40°C ~ 125°C (TA) | Surface Mount | 8-WFDFN | 8-DFN (2x2) |
||
Microchip Technology |
AUTOMOTIVE 4 OUTPUT CMOS BUFFER
|
pacchetto: - |
Request a Quote |
|
1 | 1:4 | No/No | - | LVCMOS | 160 MHz | 1.71V ~ 3.63V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Texas Instruments |
IC CLK BUFFER 1:3 250MHZ 8TSSOP
|
pacchetto: - |
Azione3.507 |
|
1 | 1:3 | No/No | LVCMOS | LVCMOS | 250 MHz | 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |