Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Silicon Labs |
IC CLK BUFFER 1:8 200MHZ 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione7.136 |
|
1 | 1:8 | Yes/No | CML, HCSL, LVDS, LVPECL | CMOS | 200MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
ON Semiconductor |
IC CLK BUFFER 2:24 1GHZ 64LQFP
|
pacchetto: 64-LQFP Exposed Pad |
Azione6.960 |
|
1 | 2:24 | Yes/Yes | ECL, LVDS, LVPECL, NECL, PECL | ECL, PECL | 1GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 64-LQFP Exposed Pad | 64-LQFP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:12 350MHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione6.416 |
|
1 | 1:12 | Yes/No | LVCMOS, LVPECL | LVCMOS | 350MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 650MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione5.552 |
|
1 | 1:5 | Yes/Yes | CML, HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 650MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 100MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione5.248 |
|
1 | 1:10 | No/No | TTL | TTL | 100MHz | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 3.2GHZ 16VFQFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione7.520 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL, SSTL | CML | 3.2GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 1:4 400MHZ 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione7.776 |
|
1 | 1:4 | Yes/Yes | LVDS, LVPECL, LVTTL | LVDS | 400MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
ON Semiconductor |
IC CLK BUFFER 1:2 1.5GHZ 8TSSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione6.208 |
|
1 | 1:2 | Yes/Yes | ECL, PECL | ECL, PECL | 1.5GHz | 4.2 V ~ 5.7 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-TSSOP |
||
NXP |
IC CLK BUFFER 1:5 1.5GHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione2.160 |
|
2 | 1:5 | Yes/Yes | ECL, PECL | PECL | 1.5GHz | 2.25 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:4 160MHZ 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione3.904 |
|
1 | 1:4 | Yes/Yes | PECL | TTL | 160MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
ON Semiconductor |
IC CLK BUFFER 2:15 1.5GHZ 52LQFP
|
pacchetto: 52-LQFP |
Azione20.676 |
|
1 | 2:15 | Yes/Yes | LVECL, LVPECL | ECL | 1.5GHz | 3 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 52-LQFP | 52-LQFP (10x10) |
||
Microchip Technology |
IC CLK BUFFER 2:10 2GHZ 64TQFP
|
pacchetto: 64-TQFP Exposed Pad |
Azione4.768 |
|
2 | 2:10 | Yes/Yes | LVDS, LVPECL | LVPECL | 2GHz | 2.37 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 1:10 650MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione4.736 |
|
1 | 1:10 | No/No | AVCMOS | AVCMOS | 650MHz | 1.71 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione5.952 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Diodes Incorporated |
CLOCK SAW OSCILLATOR SEAM7050
|
pacchetto: - |
Azione7.120 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione3.184 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.75 V ~ 5.25 V | 0°C ~ 70°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 166MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione2.816 |
|
1 | 1:10 | No/No | LVTTL | LVTTL | 166MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Microchip Technology |
IC CLK BUFFER 1:1 200MHZ 16WQFN
|
pacchetto: 16-VFQFN |
Azione6.720 |
|
1 | 1:1 | No/No | LVCMOS, Sine Wave | LVCMOS | 200MHz | 2.5 V ~ 3.3 V | 0°C ~ 70°C | Surface Mount | 16-VFQFN | 16-QFN (3x3) |
||
Texas Instruments |
IC CLK BUFFER 1:3 800MHZ 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione4.704 |
|
1 | 1:3 | Yes/Yes | CML, HSTL, LVDS, LVPECL, LVTTL, SSTL-2, VML | LVPECL | 800MHz | 3 V ~ 3.6 V | -55°C ~ 125°C | Surface Mount | 24-VFQFN Exposed Pad | 24-VQFN (4x4) |
||
Texas Instruments |
IC CLK BUFFER 2:10 3.5GHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione6.752 |
|
1 | 2:10 | Yes/Yes | CML, LVDS, LVPECL, SSTL | LVPECL | 3.5GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-VQFN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:6 100MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione2.192 |
|
1 | 1:6 | No/No | Crystal | LVCMOS, LVTTL | 100MHz | 1.6 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microsemi Corporation |
IC CLK BUFFER 1:2 750MHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione20.076 |
|
1 | 1:2 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 2:10 2.5GHZ 32PTQFP
|
pacchetto: 32-TQFP Exposed Pad |
Azione6.924 |
|
1 | 2:10 | Yes/Yes | LVDS, LVPECL, SSTL | ECL, LVPECL | 2.5GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-TQFP Exposed Pad | 32-PTQFP-EP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione18.900 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Diodes Incorporated |
IC CLK BUFFER 1:4 180MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione43.116 |
|
1 | 1:4 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 180MHz | 1.4 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Analog Devices Inc. |
IC CLK BUFFER 2:5 1.2GHZ 48LFCSP
|
pacchetto: 48-VFQFN Exposed Pad, CSP |
Azione10.272 |
|
1 | 2:5 | Yes/Yes | Clock | CMOS, LVDS, LVPECL | 1.2GHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad, CSP | 48-LFCSP-VQ (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:8 6GHZ 32MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione19.800 |
|
1 | 1:8 | Yes/Yes | CML, LVDS, LVPECL | CML | 6GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Renesas Electronics Corporation |
CXIN0006-AF-QFP-TR
|
pacchetto: - |
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