Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK BUFFER 1:4 150MHZ 16TSSOP
|
pacchetto: - |
Azione5.760 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 150MHz | 2.25 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | - | - |
||
Diodes Incorporated |
IC CLK BUFFER 1:10 100MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione2.544 |
|
1 | 1:10 | No/No | CMOS, TTL | CMOS, TTL | 100MHz | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
Silicon Labs |
IC CLK BUFFER 1:4 140MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione5.376 |
|
1 | 1:4 | No/No | Clock | LVCMOS | 140MHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 2:9 500MHZ 32TQFP
|
pacchetto: 32-TQFP |
Azione6.336 |
|
1 | 2:9 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 500MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 166MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione3.776 |
|
1 | 1:10 | No/No | LVTTL | CMOS, TTL | 166MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
NXP |
IC CLK BUFFER 1:18 250MHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione5.584 |
|
1 | 1:18 | Yes/Yes | LVCMOS, LVPECL | LVCMOS | 250MHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 2:8 160MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione5.184 |
|
1 | 2:8 | Yes/Yes | PECL, TTL | TTL | 160MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Texas Instruments |
IC CLK BUFFER 1:4 60MHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.664 |
|
2 | 1:4 | No/No | TTL | CMOS | 60MHz | 4.5 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
ON Semiconductor |
IC CLK BUFFER 1:4 8.5GHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione4.256 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | CML | 8.5GHz | 1.71 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:5 2GHZ 32MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione5.952 |
|
1 | 2:5 | Yes/Yes | CML, LVDS, PECL | LVPECL | 2GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 2:4 250MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione7.216 |
|
1 | 2:4 | No/Yes | LVCMOS | LVPECL | 250MHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTPX 2:2 270MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione5.424 |
|
1 | 2:2 | No/No | Clock | Clock | 270MHz | 2.5 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 140MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.944 |
|
1 | 1:4 | No/No | Clock | Clock | 140MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:2 200MHZ 6DFN
|
pacchetto: 6-UFDFN Exposed Pad |
Azione2.704 |
|
1 | 1:2 | No/No | LVCMOS | LVCMOS | 200MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 6-UFDFN Exposed Pad | 6-DFN (1.3x2) |
||
ON Semiconductor |
IC CLK BUFFER 2:10 5.5GHZ 52QFN
|
pacchetto: 52-VFQFN Exposed Pad |
Azione14.748 |
|
1 | 2:10 | Yes/Yes | CML, LVCMOS, LVDS, LVNECL, LVPECL, LVTTL | CML | 5.5GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 52-VFQFN Exposed Pad | 52-QFN (8x8) |
||
Microchip Technology |
IC CLK BUFFER 2:6 7.5GHZ 32MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione5.664 |
|
1 | 2:6 | Yes/Yes | CML, LVDS, PECL | CML | 7.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 350MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione18.960 |
|
1 | 2:4 | Yes/No | HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, LVTTL, SSTL | LVCMOS, LVTTL | 350MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Analog Devices Inc. |
IC CLOCK BUFFER 1:2 16SMT
|
pacchetto: 16-VFQFN Exposed Pad |
Azione7.644 |
|
1 | 1:2 | Yes/Yes | CML | CML | 14GHz | -3 V ~ -3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-SMT (3x3) |
||
Microchip Technology |
IC CLK BUFF MUX 2:8 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione3.504 |
|
1 | 2:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Renesas Electronics Corporation |
CXIN0006-AF-QFP-ES
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CLK BUFFER 1:4 250MHZ 16VQFN
|
pacchetto: - |
Azione27.723 |
|
1 | 1:4 | Yes/Yes | HCSL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 16-VFQFN Exposed Pad | 16-VQFN (3x3) |
||
Analog Devices Inc./Maxim Integrated |
CLOCK AND DATA DRIVER
|
pacchetto: - |
Request a Quote |
|
1 | 1:2 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 3 GHz | ±2.25V ~ 3.8V | -40°C ~ 85°C | Surface Mount | SOT-23-8 | SOT-23-8 |
||
NXP |
PROCESSOR
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - |
||
onsemi |
LOW SKEW CLOCK DRIVER
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
IC CLK 20VFQFPN
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | Surface Mount | 20-VFQFN Exposed Pad | 20-VFQFPN (4x4) |
||
Skyworks Solutions Inc. |
IC CLK BUFFER 1:4 100MHZ 32QFN
|
pacchetto: - |
Request a Quote |
|
1 | 1:4 | Yes/Yes | HCSL | HCSL | 100 MHz | 1.71V ~ 3.46V | -40°C ~ 105°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
onsemi |
IC CLK BUFF DVDR MUX 2:15 52LQFP
|
pacchetto: - |
Request a Quote |
|
- | 2:15 | - | - | - | - | - | - | Surface Mount | 52-LQFP | 52-LQFP (10x10) |
||
onsemi |
IC CLK BUFF MUX 2:5 1GHZ 20-SOIC
|
pacchetto: - |
Request a Quote |
|
- | 2:5 | - | - | - | - | - | - | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |