Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione6.528 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 1:5 166MHZ 20VFQFPN
|
pacchetto: 20-VFQFN Exposed Pad |
Azione4.976 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | 166MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 20-VFQFN Exposed Pad | 20-VFQFPN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:5 2GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione22.020 |
|
1 | 2:5 | Yes/Yes | CML, LVDS, LVPECL, SSTL | ECL, LVPECL | 2GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 200MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione5.904 |
|
1 | 1:4 | Yes/Yes | PECL | LVPECL | 200MHz | 3.15 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:4 160MHZ 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione5.456 |
|
1 | 1:4 | Yes/Yes | PECL | TTL | 160MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Texas Instruments |
IC CLK BUFFER 1:10 100MHZ 24SOIC
|
pacchetto: 24-SOIC (0.295", 7.50mm Width) |
Azione6.208 |
|
1 | 1:10 | No/No | LVTTL | LVTTL, TRI-State | 100MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
||
Texas Instruments |
IC CLK BUFFER 1:8 80MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione2.400 |
|
1 | 1:8 | No/No | TTL | TTL | 80MHz | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
NXP |
IC CLK BUF 1:10 300MHZ 28TSSOP
|
pacchetto: 28-TSSOP (0.173", 4.40mm Width) |
Azione4.544 |
|
1 | 1:10 | No/No | LVTTL | LVTTL | 300MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 28-TSSOP (0.173", 4.40mm Width) | 28-TSSOP |
||
Texas Instruments |
IC CLK BUFFER 1:3 800MHZ 24VQFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione2.608 |
|
1 | 1:3 | Yes/Yes | CML, HSTL, LVCMOS, LVDS, LVTTL, SSTL-2, VML | LVPECL | 800MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-VQFN Exposed Pad (4x4) |
||
ON Semiconductor |
IC CLK BUFFER 1:2 12GHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione4.576 |
|
1 | 1:2 | Yes/Yes | CML, LVCMOS, LVDS, LVTTL, NECL, RSNECL, PECL | RSECL, RSNECL, RSPECL | 12GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 1:16 500MHZ 48PTQFP
|
pacchetto: 48-TQFP Exposed Pad |
Azione4.592 |
|
1 | 1:16 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 500MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 48-TQFP Exposed Pad | 48-PTQFP-EP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK DIVIDR 2:4 200MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione4.272 |
|
1 | 2:4 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 250MHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
ON Semiconductor |
IC CLK BUFFER 2:4 266MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione2.768 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL, Crystal | LVPECL | 266MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microsemi Corporation |
IC CLK BUFF MUX 2:6 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione7.136 |
|
1 | 2:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:5 700MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione20.124 |
|
1 | 2:5 | Yes/Yes | HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, LVTTL, SSTL | LVPECL | 700MHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Diodes Incorporated |
LVPECL CLOCK BUFFER WITH /2 FEAT
|
pacchetto: - |
Azione6.800 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
ON Semiconductor |
IC CLK BUFFER 1:6 100MHZ 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione7.920 |
|
1 | 1:6 | No/No | LVCMOS, LVTTL, Crystal | LVCMOS, LVTTL | 100MHz | 1.6 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione22.068 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Texas Instruments |
IC CLK BUFFER 3:7 3.1GHZ 36WQFN
|
pacchetto: 36-WFQFN Exposed Pad |
Azione4.736 |
|
1 | 3:7 | Yes/Yes | CML, HCSL, HSTL, LVDS, LVPECL, SSTL, Crystal | HCSL, LVCMOS, LVDS, LVPECL | 3.1GHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 36-WFQFN Exposed Pad | 36-WQFN (6x6) |
||
Texas Instruments |
IC CLK BUFFER 3:10 200MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione59.592 |
|
1 | 3:10 | Yes/No | HCSL, LVCMOS, LVDS, LVPECL, SSTL, Crystal | LVCMOS | 200MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-VQFN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:10 700MHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione6.792 |
|
1 | 2:10 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | ECL, LVPECL | 700MHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
pacchetto: 16-VFQFN Exposed Pad |
Azione5.760 |
|
2 | 2:4 | Yes/Yes | LVDS, LVPECL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C (TA) | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFPN (3x3) |
||
Silicon Labs |
1:4 LVPECL LOW-JITTER CLOCK BUFF
|
pacchetto: - |
Azione3.136 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CLK BUFFER 1:8 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione7.584 |
|
1 | 1:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Renesas Electronics Corporation |
IC CLK BUFFER 1:2 3GHZ 16VFQFPN
|
pacchetto: - |
Request a Quote |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 3 GHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFPN (3x3) |
||
Diodes Incorporated |
IC CLK BUFFER 1:4 400MHZ 32TQFN
|
pacchetto: - |
Azione4.170 |
|
1 | 1:4 | Yes/Yes | HCSL | HCSL | 400 MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-TQFN (5x5) |
||
SiTime |
-40C TO 85C, 8PIN, 2020, 1.8V-3.
|
pacchetto: - |
Request a Quote |
|
1 | 1:4 | No/No | Clock | LVCMOS | 200 MHz | 1.8V ~ 3.3V | -40°C ~ 105°C (TA) | Surface Mount | 8-WFDFN | 8-DFN (2x2) |
||
onsemi |
IC CLK BUFF DVDR MUX 2:4 20-SOIC
|
pacchetto: - |
Request a Quote |
|
- | 2:4 | - | - | - | - | - | - | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |