Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:15 3GHZ 52PTQFP
|
pacchetto: 52-LQFP Exposed Pad |
Azione6.320 |
|
1 | 2:15 | Yes/Yes | ECL, PECL | LVPECL | 3GHz | 2.375 V ~ 3.465 V | -40°C ~ 110°C | Surface Mount | 52-LQFP Exposed Pad | 52-PTQFP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:10 2.7GHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione23.100 |
|
1 | 2:10 | Yes/Yes | ECL, HSTL, PECL | ECL, PECL | 2.7GHz | 2.375 V ~ 3.465 V | -40°C ~ 110°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 166MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione21.756 |
|
1 | 1:10 | No/No | LVTTL | CMOS, TTL | 166MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 166MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione6.016 |
|
1 | 1:10 | No/No | LVTTL | CMOS, TTL | 166MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 2.1GHZ 16VFQFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione6.416 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL, SSTL | ECL, LVPECL | 2.1GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 2GHZ 16VFQFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione3.552 |
|
1 | 1:2 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 2GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 3.5GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione5.472 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, PECL | LVPECL | 3.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione6.128 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
ON Semiconductor |
IC CLK BUFFER 1:4 12GHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione4.992 |
|
1 | 1:4 | Yes/Yes | CML, LVCMOS, LVDS, LVTTL, NECL, PECL, RSECL | RSECL, RSNECL, RSPECL | 12GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
ON Semiconductor |
IC CLK BUFFER 1:8 80MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione4.016 |
|
1 | 1:8 | Yes/No | ECL, TTL | TTL | 80MHz | 4.75 V ~ 5.25 V, -4.2 V ~ -5.5 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Analog Devices Inc. |
IC CLK BUF 2:10 4.8GHZ 40LFCSP
|
pacchetto: 40-VFQFN Exposed Pad, CSP |
Azione7.504 |
|
1 | 2:10 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVPECL | 4.8GHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad, CSP | 40-LFCSP-VQ (6x6) |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 2:10 1.5GHZ 32TQFP
|
pacchetto: 32-TQFP Exposed Pad |
Azione3.392 |
|
1 | 2:10 | Yes/Yes | LVPECL | LVPECL | 1.5GHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 32-TQFP Exposed Pad | 32-TQFP (7x7) |
||
Texas Instruments |
IC CLK BUFFER 1:6 800MHZ 40VQFN
|
pacchetto: 40-VFQFN Exposed Pad |
Azione7.712 |
|
2 | 1:6 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVDS | 800MHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-VQFN (6x6) |
||
Microchip Technology |
IC CLK BUFFER 1:4 2.5GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione4.448 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 2.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Silicon Labs |
2:6 LVDS BUFFER (200MHZ), 2:1 LV
|
pacchetto: 24-VFQFN Exposed Pad |
Azione5.552 |
|
1 | 2:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | CML, HCSL, LVCMOS, LVDS, LVPECL | 200MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
ON Semiconductor |
IC CLK BUFFER 1:2 10KHZ
|
pacchetto: 6-XFBGA, WLCSP |
Azione4.016 |
|
1 | 1:2 | No/No | Clock | Clock | 52MHz | 2.3 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 6-XFBGA, WLCSP | 6-WLCSP (1.14x0.74) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione4.672 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 166MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione9.588 |
|
1 | 1:10 | No/No | LVTTL | CMOS, TTL | 166MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
Diodes Incorporated |
IC CLK BUFFER 1:4 140MHZ 8COIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.960 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 200MHz | 1.1 V ~ 1.6 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:1 3GHZ 8MLF
|
pacchetto: 8-VFDFN Exposed Pad, 8-MLF? |
Azione3.392 |
|
1 | 1:1 | Yes/Yes | CML, LVDS, LVPECL | CML | 3GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-VFDFN Exposed Pad, 8-MLF? | 8-MLF? (2x2) |
||
Silicon Labs |
IC BUFFER 1:10 LVPECL 32ELQFP
|
pacchetto: 32-LQFP Exposed Pad |
Azione7.140 |
|
1 | 2:10 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 1.25GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 32-LQFP Exposed Pad | 32-LQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTPLX 2:2 270MHZ 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione5.952 |
|
1 | 2:2 | No/No | Clock | Clock | 270MHz | 2.5 V ~ 5.5 V | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
pacchetto: 12-WFDFN Exposed Pad |
Azione84.000 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC FANOUT BUFFER 32VFQFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione2.240 |
|
1 | 1:10 | Yes/Yes | HSTL, LVPECL | LVPECL | 2.7GHz | 2.5V, 3.3V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |
||
Renesas Electronics Corporation |
IC CLK BUFFER 1:4 650MHZ 20TSSOP
|
pacchetto: - |
Request a Quote |
|
1 | 1:4 | No/Yes | LVCMOS, LVTTL | LVDS | 650 MHz | 3.135V ~ 3.465V | 0°C ~ 70°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 2:5 1.5GHZ 32TQFP
|
pacchetto: - |
Request a Quote |
|
2 | 2:5 | Yes/Yes | ECL, PECL | ECL, PECL | 1.5 GHz | 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:2 400MHZ 20QFN
|
pacchetto: - |
Azione2.211 |
|
1 | 1:2 | Yes/Yes | Differential or Single-Ended | HCSL | 400 MHz | 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 20-VFQFN Exposed Pad | 20-QFN (4x4) |
||
SiTime |
-40C TO 125C, 8PIN, 2020, 1.8V-3
|
pacchetto: - |
Request a Quote |
|
1 | 1:4 | No/No | Clock | LVCMOS | 200 MHz | 1.8V ~ 3.3V | -40°C ~ 125°C (TA) | Surface Mount | 8-WFDFN | 8-DFN (2x2) |