Teledyne DALSA has introduced AxCIS, a new family of high-speed high-resolution fully integrated line scan imaging modules. The easy-to-use contact Image sensor (CIS) combines sensors, lenses, and lights into one, making it a low-cost detection system suitable for many demanding machine vision applications.
Lifting applications have special requirements for the installation space of the drive device. Nordisk's new MAXXDRIVE XD is an industrial gearbox with a larger center distance, ideal for U-shaped drives, motors and cable reels.
ROHM designed the buck DC-DC converter IC with built-in MOSFET (switching regulator), BD9S402MUF-C, for automotive applications covering infotainment and ADAS, including onboard sensors and cameras that are becoming more advanced.
Microchip Technology Inc has released the PIC32CM JH MCU. This is the industry's first MCU based on the Arm Cortex-M0+ architecture, supporting AUTOSAR, mist and secure boot.
Stmicro's L4985A/B and L4986A/B power factor correction (PFC) boost converters with integrated 800V starting circuits, as well as STMICRO's proprietary practical auxiliary features, help simplify application design and improve design flexibility.
TDK has introduced the new B58101A0109A* (HP100) series heat pump sensors. This NTC (Negative temperature coefficient) sensor is designed to meet the requirements of automotive applications. It can measure the refrigerant temperature in the pipeline indirectly by measuring the temperature of the pipeline surface. The new element is suitable for harsh working conditions
Bourns has introduced a bidirectional power Transient Voltage Suppressor (PTVS) diode designed for high-power DC line protection applications. The new model PTVS20-015C-TH is capable of handling 20 kA surges at a low voltage of 15 V, making it an ideal and effective electrostatic discharge (ESD) protection solution for applications requiring high-power DC bus protection.
Diodes has announced the addition of three new 20Gbps devices rated at 1.8V to its large scale programmable multichannel linear ReDrivers product line. Designed to address the rapidly growing USB4 Gen3, Thunderbolt 4.0, and DisplayPort™ 2.0 standards.
NXP Semiconductors now offers its new higher power BTS7202 RX FEM and BTS6403/6305 pre-drivers for 5G massive MIMO going up to 20W per channel. Developed and implemented in its SiGe process, the devices function with modest current consumption to lower operational costs for MNOs. They also provide improved linearity and lower noise figures to support better 5G signal quality.
EPC's new 100 V, 3.8 mΩ GaN FET EPC2306 provides higher performance and smaller solutions for high power density applications, including DC/DC conversion, AC/DC charging inverters, solar optimizers and microinverters, motor drives and Class D audio amplifiers.
Infineon Technologies Inc. 's fifth-generation fixed frequency (FF) CoolSET portfolio is designed to provide the right critical components for optimal design. Infineon's new 800V and 950V AC-DC integrated power levels (IPS) are packaged in DIP-7 packages to meet the needs of applications such as home appliance auxiliary power supply, AC-DC converters, battery chargers, solar systems, and motor control and drive.
Texas Instruments' TLVM13630 is a highly integrated, efficient, and easy-to-use synchronous step-down DC/DC power module with a wide input voltage range of 3 V to 36 V to support a variety of systems in industrial applications
