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Le ultime tecnologie di NXP

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Technology Cover

2024-08-29, Detailed Explanation of Electric Vehicle Electronic Control Systems

Detailed Explanation of Electric Vehicle Electronic Control Systems

Technology Cover

2024-05-30, MPC555LFMZP40 - Enhance Your Embedded Systems Effortlessly

MPC555LFMZP40 are in stock at Heisener. Order Now! Heisener will ships the parts as soon as possible. Embedded - Microcontrollers (IC MCU 32BIT 448KB FLASH 272BGA). Manufacturer: NXP. In Stock: 8700 pcs. Unit Price: RFQ.

Technology Cover

2024-04-07, NXP addresses the complexity of automotive sdv integration

NXP Semiconductors has launched a new platform and first processor, the S32 CoreRide, to address the challenge of integration and scalability of complex automotive systems and software-defined vehicles (SDVs).

Technology Cover

2024-03-07, NXP + Matter: Upgrade the smart home to an autonomous home

Matter, a smart-home tech standard maintained by the Connectivity Standards Alliance (CSA), was first approved in October 2022. Throughout 2023, new devices were introduced that supported the Matter standard, but few demonstrated the full value and versatility of the technology.

Technology Cover

2023-05-05, United Nations World Peace launches the Body Control Module (BCM) solution based on NXP products

General Assembly Holdings, a leading international distributor of semiconductor components in the Asia Pacific region, announced the launch of its Shiping vehicle Body Control Module (BCM) solution based on NXP S32K344 chips.

Technology Cover

2023-04-18, The UWB module was developed to speed up UWB applications

Ultra-Wideband (UWB) technology is a short-range high-speed wireless communication technology. Its working frequency band is extremely wide, can cover multiple frequency bands, and the time domain of signal transmission is very short, which makes it has great application potential in short-range high-speed communication. This paper will introduce the development and application of UWB technology, as well as the functions and features of several UWB modules launched by Murata.

Technology Cover

2023-04-10, System base chip with LIN transceiver

The 33689 is a Serial Peripheral Interface (SPI) control System foundation chip (SBC) that combines many of the common features found in MMC-based systems with Local Interconnect Network (LIN) transceivers. Applications include power Windows, mirrors and seat controls

Technology Cover

2023-03-30, Monolithic silicon integrated circuit

The 33884 Switch monitoring interface is a monolithic silicon integrated circuit (IC) to perform switch monitoring functions. The device provides an efficient interface between an electrical switch and a low-voltage microprocessor. The 33884 provides pull-up and pull-down currents for switch contacts while monitoring input voltage levels.

Technology Cover

2023-03-24, Low-ohmic single-pole double-throw analog switch

The NX3L1T53 is a low-ohmic single-pole double-throw analog switch suitable for use as an analog or digital 2:1 multiplexer/demultiplexer. It has a digital select input (S), two independent inputs/outputs (Y0 and Y1), a common input/output (Z) and an active LOW enable input (E). When pin E is HIGH, the switch is turned off.

Technology Cover

2023-03-13, NXP introduces full-featured HDMI and DVI level converters

The PTN3360B is a high speed level converter that converts four-channel low-amplitude AC-coupled differential input signals into DVI v1.0 and HDMI v1.3a compatible leak-open current-directed differential output signals up to 2.5 Gbit/s per channel. The PTN3360B is powered by a single 3.3V power supply with low power consumption (typical power is 120 mW) and is packaged with 48 terminals HVQFN48

Technology Cover

2023-03-11, NXP intelligent, low-power, triaxial capacitive micromechanical accelerometer

The MMA8452Q is an intelligent, low-power, triaxial capacitive micromechanical accelerometer with 12-bit resolution. Available in 16-pin QFN, 3mm x 3mm x 1mm package. The accelerometer is packaged with embedded functionality with flexible user-programmable options that can be configured to two interrupt pins.

Technology Cover

2023-03-10, Bipolar monolithic differential clock distribution buffer and clock divider

The Motorola MC100ES6226 is a bipolar monolithic differential clock distribution buffer and clock divider. Designed for most demanding clock distribution systems, the MC100ES6226 supports various applications that require a large number of outputs to drive precisely aligned clock signals.

Technology Cover

2023-02-24, NXP provides serial link bus interface devices

The 33290 is a serial link bus interface device designed to provide a two-way half-duplex communication interface for automotive diagnostic applications. Ambient temperature :-40ºC≤TA≤125ºC, 8.0 V≤VBB≤18v power supply. The economical SO-8 surface-mount plastic packaging makes the 33290 very cost effective.

Technology Cover

2023-02-20, NXP develops multi-switch detection interface

The multi-switch detection interface is designed to detect the closing and opening of up to 22 switch contacts. The switching state, on or off, is transmitted to the microprocessor unit (MCU) via the Serial Peripheral Interface (SPI). The device also has a 22-to-1 analog multiplexer for reading analog inputs. 33993 adopts 32-pin wide-body SOIC package to reduce the area of the circuit board. The low rest current makes the 33993 ideal for automobiles and industrial products that require low sleep state current

Technology Cover

2023-01-04, Dual output DC-DC and linear stabilized IC

The 34710 is a dual-output power regulator IC integrating switching regulator, linear regulator, supervisory and power supply sequencing circuitry. With a wide operating input voltage range of 13 to 32V, the 34710 is applicable to many commercial and industrial applications using embedded MCUs.

Technology Cover

2022-12-24, 2.5V and 3.3V CMOS PLL clock generators and drivers

The MPC9315 is a 2.5 V and 3.3 V compatible, PLL based clock generator designed for low-skew clock distribution in low-voltage mid-range to high-performance telecom, networking and computing applications.

Technology Cover

2022-12-06, Bluetooth audio solution revolutionary wireless listening and listening experience

NXP Semiconductors offers the NXH3675 high-quality audio streaming solution, a highly integrated, single-chip 2.4GHz transceiver certified to the Bluetooth 5.3 LE audio standard. The device allows developers to produce innovative products in the Bluetooth audio world with elements such as high-quality audio transmission, broadcasting capabilities, and multiple audio streams and data channels. With its optimised audio streaming protocol, the device provides ultra-low latency with ultra-low power consumption for advanced use cases.

Technology Cover

2022-12-05, NXP single-chip dual H-bridge power integrated circuits are ideal for portable electronics applications

The 17529 is a monolithic dual H-Bridge power IC ideal for portable electronic applications containing bipolar step motors and/or brush DC-motors (e.g., cameras and disk drive head positioners).